Development of a Variable Camber Leading Edge Device Design Methodology

Author(s):  
Vincent Lajux ◽  
John Fielding
2020 ◽  
Vol 51 (1) ◽  
pp. 683-686
Author(s):  
Kazuichiro Itonaga ◽  
Shoji Sudo ◽  
Jun Nishikawa ◽  
Kei Kimura ◽  
Hiroki Uchiyama ◽  
...  

Author(s):  
O¨zhan H. Turgut ◽  
Cengiz Camcı

Nonaxisymmetric endwall contouring has recently become one of the ways to minimize the secondary flow related losses in a turbine nozzle guide vane (NGV) passage. In this study, a specific nonaxisymmetric endwall contouring design methodology is introduced. Fourier series based splines at different axial locations are generated and combined with the help of stream-wise B-splines within solid modeling program. Eight different contoured endwalls are presented in this paper. Computational study of these designs are performed by the finite-volume flow solver. The SST k–ω turbulence model is selected and a body-fitted structured grid is used. Total pressure distribution at the NGV exit shows that contouring the endwall effectively changes the results. Among from these various designs, the most promising one is with the contouring extended in the upstream of the vane leading edge. Mass-averaged value of 3.2% total pressure loss reduction is achieved at the NGV exit plane. The current study was performed in a rotating turbine rig simulating a state of the art HP turbine stage. An NGV only simulation is performed. This approach is helpful in isolating rotor-stator influence and the possible upstream flow modifications of the rim seal cavity flow existing in the rotating turbine research rig. The investigation including the rotor-stator interaction and rim seal cavity flow is the topic of a subsequent paper currently under progress.


2004 ◽  
Vol 51 (7) ◽  
pp. 1122-1128 ◽  
Author(s):  
S.S. Suryagandh ◽  
M. Garg ◽  
J.C.S. Woo

2005 ◽  
Vol 09 (01) ◽  
pp. 47-73 ◽  
Author(s):  
DIETER ERNST

Among Keith Pavitt's many contributions to the study of innovation is the proposition that physical proximity is advantageous for innovative activities that involve highly complex technological knowledge. But chip design, a process that creates the greatest value in the electronics industry and that requires highly complex knowledge, is experiencing a massive dispersion to leading Asian electronics exporting countries. To explain why chip design is moving to Asia, the paper draws on interviews with 60 companies and 15 research institutions that are doing leading-edge chip design in Asia. I demonstrate that "pull" and "policy" factors explain what attracts design to particular locations. But to get to the root causes that shift the balance in favour of geographical decentralisation, I examine "push" factors, i.e., changes in design methodology ("system-on-chip design") and organisation ("vertical specialisation" within global design networks). The resultant increase in knowledge mobility explains why chip design — which in Pavitt's framework is not supposed to move — is moving from the traditional centres to a few new specialised design clusters in Asia.


2014 ◽  
Vol 87 ◽  
pp. 1218-1221 ◽  
Author(s):  
Mahmoud M. Magdy ◽  
Nader A. Mansour ◽  
Ahmed M.R. Fath El-Bab ◽  
Samy F.M. Assal

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