scholarly journals Effect of reaction sintering modes on the structure and properties of carbide ceramics

Author(s):  
E. V. Zvonarev ◽  
A. Ph. Ilyushchanka ◽  
Zh. A. Vitko ◽  
V. A. Osipov ◽  
D. V. Babura

Experimental studies of the structure, phase composition, physical and mechanical properties of the reaction-sintered ceramics based on silicon carbide and boron obtained by reaction sintering have been performed. It has been shown that the properties of the reaction-sintered ceramics based on carbides are largely determined by the quality of impregnation of the porous carbide frame with silicon, which depends on the total and open porosity, shape and size of the pores of the compact, the composition of the charge from the carbide powder. High-temperature sintering, followed by impregnation of the carbide frame with silicon and its interaction with the carbon constituent of the frame, largely determines the properties of the material. The main task in the implementation of this process is to create conditions that ensure the full filling of pores in the initial compact during impregnation with silicon melt and, secondly, maximum activation of chemical interaction between the melt of silicon, carbon and other components that compose the charge. A complex of studies on the effect of compacting pressure and annealing temperature of the charge based on silicon carbide and boron powders with the addition of graphite on the pore structure of the compact and the quality of its impregnation with a silicon melt has been carried out in this work. It has been shown that the density, bending strength, hardness of ceramics based on silicon carbide and boron carbide obtained by reaction sintering are increased with a rise in compacting pressure of carbide frames. The optimum porosity of the carbide frame is 25–30 %; the pore size is 1.0–1.5 μm. It has been also demonstrated that ceramics based on boron carbide and boron carbide with 50 % silicon carbide impregnated with silicon at high-temperature sintering has higher strength and hardness values than those based on silicon carbide due to higher adhesion strength at the interface of boron carbide particles and binder, caused by the dissolution of boron carbide in the silicon melt and the formation of complex carbide particles on the surface.

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000033-000036 ◽  
Author(s):  
M.H. Weng ◽  
A.D. Murphy ◽  
D.T. Clark ◽  
D.A. Smith ◽  
R.F. Thompson ◽  
...  

The potential to thermally grow SiO2 on silicon carbide has resulted in it becoming the technology of choice to realise high temperature CMOS circuits. The challenge to achieve a high quality gate stack relies on engineering the metal-insulator-semiconductor interfaces to enable reliable high temperature functionality. Here we describe the effect of different process conditions for the formation of the dielectric layer on the characteristics of the resulting devices. The operating characteristics at elevated temperatures depend critically on the quality of the gate stack. Therefore a systematic evaluation of the intrinsic properties of the gate stack and data from reliability tests are needed.


2000 ◽  
Vol 123 (1) ◽  
pp. 64-69 ◽  
Author(s):  
Tatsuki Ohji

This paper describes high-temperature reliability, particularly creep and creep rupture behavior of three engineering ceramics—silicon nitride, silicon carbide, and alumina-based silicon-carbide-particulate ceramics—which are considered the most potential candidates for the use of blades of high-efficiency ceramic gas turbine. The structural reliability of silicon nitride is very often limited due to the softening of glassy phases formed at grain boundaries. On the other hand, silicon carbide, which generally does not contain glassy phase at the grain boundaries, shows excellent creep resistance even at very high temperatures. Finally, it is shown that creep resistance of alumina can be markedly improved by dispersing nano-sized silicon carbide particles into the grain boundary.


2018 ◽  
Vol 40 (6) ◽  
pp. 2473-2481 ◽  
Author(s):  
Kadiyala Ajay Kumar ◽  
Jayashree Bijwe ◽  
Prashantha Kalappa

2012 ◽  
Vol 717-720 ◽  
pp. 773-776 ◽  
Author(s):  
Lucy C. Martin ◽  
David T. Clark ◽  
Ewan P. Ramsay ◽  
A.E. Murphy ◽  
Robin. F. Thompson ◽  
...  

The recent development of silicon carbide complimentary metal-oxide-semiconductor (CMOS) is a key enabling step in the realisation of low power circuitry for high temperature applications, such as aerospace and well logging. This paper describes investigations into the properties of the gate dielectric as part of the development of the technology to realize monolithic fabrication of both n and p channel devices. A comparison of the oxide quality of the silicon carbide CMOS transistors is performed to examine the feasibility of this technology for high temperature circuitry.


Author(s):  
F. F. Lange

A variety of different promising high temperature structural materials exist under the generic names of silicon nitride (Si3N4) and silicon carbide (SiC). Each of these materials are fabricated by a different method and thus, each develop different microstructures and different properties. The relations between fabrication, microstructure and properties will be reviewed for both Si3N4 and SiC fabricated by (a) reaction-sintering, (b) conventional sintering, and (c) hot-pressing. The object of this review is to allow the engineer to obtain a better understanding of the different materials that are becoming available for high temperature structural design applications. An Appendix presents the properties of these materials required for stress analysis.


Sign in / Sign up

Export Citation Format

Share Document