scholarly journals Removal of ammonia and hydrogen sulfide from livestock farm by copper modified activated carbon

2020 ◽  

<p>Ammonia (NH3) and hydrogen sulfide (H2S), as the main odorous substances in waste gas from livestock farm, have attracted more attentions rescently since their adverse effects. To remove NH3 and H2S efficiently, high-pressure hydrothermal modification (HPHM), metal salt solution impregnation modification (MSIM), and HPHM combined with MSIM are used to modify the activated carbon (AC). Meanwhile, the pore structure and surface functional groups of AC and MAC absorbents are characterized by BET, FTIR and Boehm titration method. The adsorption performance of activated carbon (AC) and modified activated carbon (MAC) are compared. The effects of modification and operation conditions on the adsorption performance of MAC for NH3 and H2S are studied in detail. It was found that the optimal adsorption performance of MAC can be achieved by high-pressure hydrothermal modification (HPHM) followed by the metal salt solution impregnation modification (MSIM). With gas space velocity of 900 h-1 and total inlet concentration of 550-650 mg m-3 at 50 oC, the adsorption capacities of NH3 and H2S of GS270CuCl6010 are 24.17 mg g-1 and 26.20 mg g-1, respectively. The adsorption of NH3 and H2S by MAC is the result of both physical adsorption and chemical adsorption.</p>

1997 ◽  
Vol 66 (2) ◽  
pp. 392-395 ◽  
Author(s):  
Huang Shi Ping ◽  
Fukuo Yoshida

2018 ◽  
Vol 117 ◽  
pp. 350-362 ◽  
Author(s):  
Radhika R. ◽  
Jayalatha T. ◽  
Rekha Krishnan G. ◽  
Salu Jacob ◽  
Rajeev R. ◽  
...  

2015 ◽  
Vol 2015 (1) ◽  
pp. 000669-000674
Author(s):  
Daisuke Hiratsuka ◽  
Akihiro Sasaki ◽  
Tomohiro Iguchi ◽  
Tetsuya Yamamoto ◽  
Tsuyoshi Sato

Interest in die-attach materials with high thermostability has been stimulated by the high junction temperature of power semiconductors. Sintered Ag nanoparticle bonding is the most attractive candidate for use as solder because of its high melting point (1253 K) and low process temperature (~573 K). Recent studies have assumed that this bonding exhibits high thermostability above 573 K. However, in fact, it is difficult to preserve the bonding strength after high-temperature storage at 523 K for 1000 h. Thus, we first clarified that the sintered Ag nanoparticle bonding was degraded by micropore coalescence caused by the Ag grain growth. We then developed the metal salt solution-nanoprecipitation (MS2NP) method for improving the reliability of the sintered Ag nanoparticle bonding. We found that the bonding used by the MS2NP method can maintain a high die-shear strength (~40 MPa) even after high-temperature storage at 573 K for 1000 h.


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