Method for Measuring Package to Board Interconnection Shear Strength for Area Array, Fine Pitch Packages

2002 ◽  
Author(s):  
Sridhar Yee ◽  
Hee Dong Yang ◽  
Puligandla Viswanadham
Keyword(s):  
Shear Strength ◽  
Solder Joint ◽  
Shear Test ◽  
Assessment Tool ◽  
Pure Shear ◽  
Interfacial Strength ◽  
Bulk Solder ◽  
Test Method ◽  
Shear Stresses ◽  
Area Array

Abstract The package to board interconnection shear strength (PBISS) test method yields an amalgamated measure of pad peel strength, solder/pad interfacial strength and bulk solder shear strength. This measure mirrors the reliability of the actual product better than any single component strength value. Using a novel fixture that ensures pure shear stresses on the package, the shear strengths of two different ball grid array packages with Sn62PbAg2 solder balls are characterized as a function of pad finish and board build-up layer type. The tests can be performed relatively quickly (< 15 minutes for an entire package on board) with good repeatability. Results indicate that the component shear test is sensitive to the variables studied and attractive as a candidate technique for quantifying solder joint quality and integrity on actual production samples for a variety of package types and sizes. Potential applications of this method are for materials/process/vendor evaluation during product development phase and as a production/supplier quality assessment tool in the factory. Key words: interconnection strength, shear test, area array package, solder joint, pad surface finish

Property of Sn-37Pb solder bumps with different diameter during thermal shock

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Guisheng Gan ◽  
Donghua Yang ◽  
Yi-ping Wu ◽  
Xin Liu ◽  
Pengfei Sun ◽  
...  
Keyword(s):  
Shear Strength ◽  
Solder Joint ◽  
Thermal Shock ◽  
Solder Joints ◽  
Test Method ◽  
Content Type ◽  
Ball Size ◽  
Solder Bumps ◽  
Free Solder ◽  
The Impact

Purpose The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored. Design/methodology/approach In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed. Findings With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively. Originality/value Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

Research on Shear Strength for Asphalt Mixture by the Uniaxle Penetration Test Method

2011 ◽  
Vol 97-98 ◽  
pp. 220-225 ◽  
Author(s):  
Yang Cai
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Linear Correlation ◽  
Shear Test ◽  
Asphalt Mixture ◽  
Test Method ◽  
Penetration Test ◽  
Triaxial Shear Test ◽  
Different Temperatures ◽  
Penetration Tests

With uniaxle penetration test method and Triaxial Shear method test, the shear strengths for asphalt mixture were analyzed. It turns out that the result of triaxial shear test is a little conservative than that of uniaxle penetration test. Then reasonable structure factor for shear strength should be considered by uniaxle penetration test. Uniaxle penetration tests at different temperatures revealed there were a linear correlation between shear strength and temperature.The asphalt was not the main fator of shear strength at high temperature.

scholarly journals The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint

Metals ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 380
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Rita Mohd Said ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Dewi Suriyani Che Halin ◽  
...  
Keyword(s):  
Shear Strength ◽  
Solder Joint ◽  
Annealing Time ◽  
Bulk Solder ◽  
Annealing Process ◽  
Shear Tests ◽  
Cu6sn5 Phase ◽  
Lap Shear ◽  
Mechanical Behaviours ◽  
Free Solder

The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.

scholarly journals Study on the Interfacial Strength of Carbon Fiber-Polymer Film Composite by Lap Shear Test Method

2019 ◽  
Vol 27 (6) ◽  
pp. 455-461 ◽  
Author(s):  
Chanhyeok Um ◽  
Myeongheon Lee ◽  
Sungbok Kwak ◽  
Insoo Han ◽  
Younki Ko ◽  
...  
Keyword(s):  
Carbon Fiber ◽  
Polymer Film ◽  
Shear Test ◽  
Interfacial Strength ◽  
Test Method ◽  
Film Composite ◽  
Lap Shear ◽  
Lap Shear Test ◽  
Carbon Fiber Polymer

scholarly journals Analysis of a Methodology for Torsional Test under Normal Stress and Shear Performance for Asphalt Mixtures

2019 ◽  
Vol 2019 ◽  
pp. 1-14
Author(s):  
Jun Xie ◽  
Yiqun Zhan ◽  
Yifan Wang
Keyword(s):  
Shear Strength ◽  
Normal Stress ◽  
Shear Test ◽  
Stress Condition ◽  
Asphalt Mixture ◽  
Friction Angle ◽  
Asphalt Mixtures ◽  
Test Method ◽  
Shear Performance ◽  
Torsional Test

Insufficient shear performance in an asphalt mixture is a primary reason for rutting deformation and pavement surface longitudinal cracking. Thus, it is important to choose a suitable shear test method to evaluate shear performance in an asphalt mixture. Current testing methods mainly evaluate the bonding strength between asphalt layers, and the current shear test method for an asphalt mixture is disadvantaged by high equipment cost and complicated procedures. Our study proposes a torsional test method under normal stress condition, and evaluation was done for four types of asphalt mixture under different temperature conditions. Through the mechanical analysis, the calculation formulas for shear strength and shear parameters (cohesion and internal friction angle) for the torsional test under a normal stress condition were obtained. Testing results were also obtained for shear strength, shear modulus, and cohesion and internal friction angle of the asphalt mixtures. Experimental testing indicated that the method was able to provide repeatable results for the shear resistance of asphalt mixtures at different temperatures and also reflected the difference in shear performance of the various asphalt mixtures and the influence of temperature on shear performance. The failure mode of the specimen was the appearance of an oblique crack of about 45° from the vertical axis after the specimen was destroyed, which accorded with shear failure characteristics. A shear fatigue model was obtained considering different shear stress levels. The torsional test method under normal stress formed a compression-shear action on the specimen by applying torque and normal stress and was used to evaluate the shear performance of the asphalt mixtures.

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