Advanced X-Ray Inspection Techniques for Counterfeit IC Detection

2016 ◽  
Author(s):  
Rosanne M. LaVoy ◽  
Fred Babian ◽  
Andrew Reid
Keyword(s):  
Sample Preparation ◽  
Tomographic Reconstruction ◽  
Imaging Systems ◽  
X Ray ◽  
X Ray Imaging ◽  
Security And Reliability ◽  
Inspection Techniques ◽  
Preparation Techniques ◽  
2D Images

Abstract It is known by both the commercial and government suppliers, one of the best ways to guarantee the security and reliability of IC's is to image the IC directly using an x-ray microscope. These images can be inspected for many signs of counterfeit electronics. Unfortunately, previous generations of x-ray imaging systems have not kept up with the increasingly sophisticated counterfeiting techniques. Traditional 2D X-ray inspection techniques are becoming inadequate for imaging and verifying features due to the limited resolution of these systems for thick samples and because 2D images contain too many overlapping features to easily discern, making identification very difficult. This paper discusses the development of advanced sample preparation techniques for counterfeit IC detection. It presents information on the limitations of X-ray imaging and 3D tomographic reconstruction, and on the models for resolution configuration improvement.

Advanced X-Ray Inspection Techniques for IC Reverse Engineering

2016 ◽  
Author(s):  
Rosanne M. LaVoy ◽  
Fred Babian ◽  
Andrew Reid
Keyword(s):  
Sample Preparation ◽  
Reverse Engineering ◽  
The Novel ◽  
X Ray ◽  
Case Examples ◽  
Advantages And Disadvantages ◽  
X Ray Imaging ◽  
Inspection Techniques ◽  
Preparation Techniques ◽  
Sample Configuration

Abstract The need for reverse engineering (for IP verification or for reproducibility) has reached unprecedented levels requiring not only the inspection of the circuitry but also the understanding of the packaging and interconnects. Achieving the best X-ray inspection for a particular application depends on an in-depth understanding of the X-ray system configuration, the sample configuration, and the sample preparation techniques available. This paper presents various case examples on the development of advanced X-ray inspection techniques for IC reverse engineering, along with information on the limitations of X-ray imaging, issues with 3D reconstruction, models for resolution configuration improvement, and advantages and disadvantages of advanced sample preparation techniques. It is observed that the novel X-ray inspection techniques, combined with appropriate sample prep techniques, provide the necessary resolution to achieve results necessary for current reverse engineering needs.

The Changing Role of Advanced Sample Preparation in X-Ray Inspection Supporting 2.5D and 3D Sample Failure Analysis

2015 ◽  
Author(s):  
Rosanne M. LaVoy ◽  
Fred Babian ◽  
Matthew Mulholland ◽  
Scott Silverman
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Tomographic Reconstruction ◽  
Integrated Approach ◽  
The Novel ◽  
Throughput Time ◽  
X Ray ◽  
Flip Chips ◽  
X Ray Imaging ◽  
Changing Role

Abstract The X-ray inspection of fully assembled samples is becoming ever more important as the benefits of using area array packages/chip scale packages/flip chips are applied to more and more products. Sample preparation has traditionally been used to improve access to geometry or a specific location with a known defect that requires verification. The novel paradigm is an integrated approach to sample preparation and X-ray inspection to optimize resolution and throughput time performance with minimally deprocessed sample. This paper, covering the limitations of X-Ray imaging and 3D tomographic reconstruction, discusses the development of models for throughput time and resolution by failure analysis labs. It also discusses the processes involved in advanced sample preparation techniques and global BGA removal to obtain improved resolution at die level.

scholarly journals Truncated Inception Net: COVID-19 Outbreak Screening using Chest X-rays

2020 ◽  
Author(s):  
Dipayan Das ◽  
KC Santosh ◽  
Umapada Pal
Keyword(s):  
Neural Network ◽  
World Wide ◽  
Imaging Techniques ◽  
Imaging Systems ◽  
Ct Scans ◽  
X Rays ◽  
X Ray ◽  
X Ray Imaging ◽  
Proposed Model ◽  
Different Types

Abstract Since December 2019, the Coronavirus Disease (COVID-19) pandemic has caused world-wide turmoil in less than a couple of months, and the infection, caused by SARS-CoV-2, is spreading at an unprecedented rate. AI-driven tools are used to identify Coronavirus outbreaks as well as forecast their nature of spread, where imaging techniques are widely used, such as CT scans and chest X-rays (CXRs). In this paper, motivated by the fact that X-ray imaging systems are more prevalent and cheaper than CT scan systems, a deep learning-based Convolutional Neural Network (CNN) model, which we call Truncated Inception Net, is proposed to screen COVID-19 positive CXRs from other non-COVID and/or healthy cases. To validate our proposal, six different types of datasets were employed by taking the following CXRs: COVID-19 positive, Pneumonia positive, Tuberculosis positive, and healthy cases into account. The proposed model achieved an accuracy of 99.96% (AUC of 1.0) in classifying COVID- 19 positive cases from combined Pneumonia and healthy cases. Similarly, it achieved an accuracy of 99.92% (AUC of 0.99) in classifying COVID-19 positive cases from combined Pneumonia, Tuberculosis and healthy CXRs. To the best of our knowledge, as of now, the achieved results outperform the existing AI-driven tools for screening COVID-19 using CXRs.

scholarly journals Image Segmentation Techniques in Bone Structure Psychiatry

2020 ◽  
Vol 9 (07) ◽  
pp. 25102-25112
Author(s):  
Ajayi Olayinka Adedoyin ◽  
Olamide Timothy Tawose ◽  
Olu Sunday Adetolaju
Keyword(s):  
Image Segmentation ◽  
Bone Structure ◽  
Performance Comparison ◽  
Imaging Systems ◽  
Intrinsic Properties ◽  
X Ray ◽  
Practical Applications ◽  
X Ray Imaging ◽  
Segmentation Algorithms ◽  
Bone Structures

Today, a large number of x-ray images are interpreted in hospitals and computer-aided system that can perform some intelligent task and analysis is needed in order to raise the accuracy and bring down the miss rate in hospitals, particularly when it comes to diagnosis of hairline fractures and fissures in bone joints. This research considered some segmentation techniques that have been used in the processing and analysis of medical images and a system design was proposed to efficiently compare these techniques. The designed system was tested successfully on a hand X-ray image which led to the proposal of simple techniques to eliminate intrinsic properties of x-ray imaging systems such as noise. The performance and accuracy of image segmentation techniques in bone structures were compared and these eliminated time wasting on the choice of image segmentation algorithms. Although there are several practical applications of image segmentation such as content-based image retrieval, machine vision, medical imaging, object detection, recognition tasks, etc., this study focuses on the performance comparison of several image segmentation techniques for medical X-ray images.

Three Dimensional X-Ray Computed Tomography in Materials Science

MRS Bulletin ◽  
1988 ◽  
Vol 13 (1) ◽  
pp. 13-18 ◽  
Author(s):  
J.H. Kinney ◽  
Q.C. Johnson ◽  
U. Bonse ◽  
M.C. Nichols ◽  
R.A. Saroyan ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Sample Preparation ◽  
Visible Light ◽  
Three Dimensional ◽  
Materials Characterization ◽  
Imaging Technology ◽  
X Ray ◽  
X Ray Imaging ◽  
Visible Light Imaging

Imaging is the cornerstone of materials characterization. Until the middle of the present century, visible light imaging provided much of the information about materials. Though visible light imaging still plays an extremely important role in characterization, relatively low spatial resolution and lack of chemical sensitivity and specificity limit its usefulness.The discovery of x-rays and electrons led to a major advance in imaging technology. X-ray diffraction and electron microscopy allowed us to characterize the atomic structure of materials. Many materials vital to our high technology economy and defense owe their existence to the understanding of materials structure brought about with these high-resolution methods.Electron microscopy is an essential tool for materials characterization. Unfortunately, electron imaging is always destructive due to the sample preparation that must be done prior to imaging. Furthermore, electron microscopy only provides information about the surface of a sample. Three dimensional information, of great interest in characterizing many new materials, can be obtained only by time consuming sectioning of an object.The development of intense synchrotron light sources in addition to the improvements in solid state imaging technology is revolutionizing materials characterization. High resolution x-ray imaging is a potentially valuable tool for materials characterization. The large depth of x-ray penetration, as well as the sensitivity of absorption crosssections to atomic chemistry, allows x-ray imaging to characterize the chemistry of internal structures in macroscopic objects with little sample preparation. X-ray imaging complements other imaging modalities, such as electron microscopy, in that it can be performed nondestructively on metals and insulators alike.

Performance of a new star‐bar phantom designed for MTF calculations in x‐ray imaging systems

2020 ◽  
Vol 47 (10) ◽  
pp. 4949-4955
Author(s):  
Antonio González‐López ◽  
Pedro‐Antonio Campos‐Morcillo ◽  
Juan Antonio Vera‐Sánchez ◽  
Carmen Ruiz‐Morales
Keyword(s):  
Imaging Systems ◽  
X Ray ◽  
X Ray Imaging
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