Steps Toward Automated Deprocessing of Integrated Circuits

2017 ◽  
Author(s):  
E.L. Principe ◽  
Navid Asadizanjani ◽  
Domenic Forte ◽  
Mark Tehranipoor ◽  
Robert Chivas ◽  
...  
Keyword(s):  
Image Processing ◽  
Integrated Circuits ◽  
3D Imaging ◽  
Time Data ◽  
X Ray ◽  
Ongoing Work ◽  
Real Time Data ◽  
Instrument Control ◽  
Sem Imaging ◽  
Control Image

Abstract This paper discusses the development of an extensible programmatic workflow that leverages evolving technologies in 2D/3D imaging, distributed instrument control, image processing, and automated mechanical/chemical deprocessing technology. Initial studies involve automated backside mechanical ultra-thinning of 65nm node IC processor chips in combination with SEM imaging and X-ray tomography. Areas as large as 800μm x 800μm were deprocessed using gas-assisted plasma FIB delayering. Ongoing work involves enhancing the workflow with “intelligent automation” by bridging FIB-SEM instrument control and near real-time data analysis to establish a computationally guided microscopy suite.

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

X-Ray Mapping with Energy-Dispersive and Wavelength-Dispersive X-Ray Spectrometry in the Scanning Electron Microscope: a Tutorial

1999 ◽  
Vol 5 (S2) ◽  
pp. 518-519
Author(s):  
Dale E. Newbury ◽  
David S. Bright
Keyword(s):  
Image Processing ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Recording System ◽  
X Ray ◽  
On Line ◽  
Current Electron ◽  
Sem Imaging ◽  
Display Systems ◽  
Scanning Electron

X-ray mapping is one of the most popular modes for displaying information obtained with x-ray spectrometry performed in the scanning electron microscope. This popularity arises from the ready accessibility and apparent simplicity of information presented in a pictorial fashion, especially when used in conjunction with other SEM imaging modes, such as backscattered, secondary, and specimen current electron images. Further, the rise of powerful, inexpensive computer systems capable of image processing and display has given the analyst a dedicated, on-line tool with the capacity and flexibility needed for problem solving. Figure 1 shows a typical example of mapping. Although the interpretation of x-ray images obtained with a modern digital control and recording system would seem to be straightforward and relatively trivial, there are significant pitfalls and limitations that can easily fool the unwary. In Figure 1, within an individual x-ray map, the observer can reasonably judge where the concentration is lower or higher, at least for a group of contiguous pixels. Can such judgments be made among a set of maps of the same region for different elements, or even for the same element from different regions of the same specimen? With current x-ray processing and display systems, the answers are generally no. In fact, problems that can influence interpretation can arise at each stage of x-ray generation/emission, x-ray spectral collection, processing, and display.

scholarly journals Looking Towards the Future of Strain Scanning Using Neutron Diffraction

2014 ◽  
Vol 996 ◽  
pp. 187-191
Author(s):  
Robert Charles Wimpory ◽  
Mirko Boin
Keyword(s):  
Data Analysis ◽  
Neutron Diffraction ◽  
Data Acquisition ◽  
Real Time ◽  
Measurement Time ◽  
Time Data ◽  
Control Data ◽  
Real Time Data ◽  
The Future ◽  
Instrument Control

All aspects of instrument control, data acquisition, simulation and analysis are expected to merge in the future. For instance real time data analysis will feed back influencing the instrument control in order to optimize the measurement time and simulations themselves will control the instrument. This presentation will discuss how the all-important pre-planning of a measurement can be optimized and used to define the whole measurement, efficiently and effectively using the neutron beamtime.

Real-Time Data Processing for X-Ray Spectroscopy

2009 ◽  
Author(s):  
J. S. Adams ◽  
S. R. Bandler ◽  
L. E. Brown ◽  
K. R. Boyce ◽  
M. P. Chiao ◽  
...  
Keyword(s):  
Data Processing ◽  
Real Time ◽  
Time Data ◽  
X Ray ◽  
Real Time Data ◽  
Real Time Data Processing

Simultaneous measurement of X-ray powder diffraction and ferroelectric polarisation data as a function of applied electric field at a range of frequencies

2013 ◽  
Vol 28 (S2) ◽  
pp. S220-S227 ◽  
Author(s):  
Stephanie Ryding ◽  
Robert Cernik ◽  
Jenny Wooldridge ◽  
Tim L Burnett ◽  
Mark Stewart ◽  
...  
Keyword(s):  
Electric Field ◽  
Light Source ◽  
Variable Frequency ◽  
Time Data ◽  
X Ray ◽  
Real Time Data ◽  
User Facility ◽  
Xrd Patterns ◽  
Collection Methods

A variable frequency ferroelectric polarisation measurement system has been designed and built at the UK's Diamond Light Source. The electric field induced phase transitions in Pb(Zr1−xTix)O3 (PZT) have been used to test the facility via in-situ measurements of electric polarisation and XRD. Stroboscopic and real time data collection methods on polycrystalline samples were employed as a function of frequency to determine the dynamic ferroelectric response. The system has been shown to deliver XRD patterns of good statistical quality measured over 40 points of a ferroelectric PE loop. The system is now available on station I11 as a user facility at the Diamond Light Source.

scholarly journals Hand Detection for Safety to Avoid Accidents

2021 ◽  
Vol 9 (VI) ◽  
pp. 3547-3552
Author(s):  
Eega Krishna Chaithanya
Keyword(s):  
Image Processing ◽  
Computer Vision ◽  
Object Detection ◽  
Time Data ◽  
Image Processing Algorithm ◽  
Hand Detection ◽  
Safety Level ◽  
Real Time Data ◽  
Imaginary Line ◽  
Stop Line

Detecting the hand when it crosses the safety level and in return it also raises an alert in the form of alarm. So that the threat can be identified and proper measures are taken to overcome that. The methodology of the project goes as follows, taking input from camera , Image processing to detect hand, Projecting a line using computer vision, Raising alarm when hand crosses this projected safety line. The real time data is taken from the camera as an input to the Image processing algorithm. Then this input is processed to find the hand in image in it and checks whether the hand is crossing that safety line. If that hand is crossing the safety line we can simply raise alarm. The applications of the project are to the Employees who are working at industry are pushing the material into shredder machine. But somehow while pushing these material into shredder machine the employees are pushing their hands itself in the flow of work and the hands of employees were cut in that cause. So from a certain distance from shredder machine input we project a imaginary line using computer vision, So that if any hand crossing that imaginary line which is for safety we will raise an alarm. In addition, we can also extend the applications, by just replacing hand with the Bike, we can detect the bike, which is crossing the staggered stop line, and we can punish or fine them. As a part of object detection we are using Single short multibox detector.

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