Common Fallacies about Multivalued Circuits

For more than 60 years, many ternary or quaternary circuits have been proposed based on similar assumptions. We successively examine four of these assumptions and demonstrate that they are wrong. The fundamental reason for which m-valued combinational circuits are more complicated than the corresponding binary ones is explained. M-valued flash memories are used in USB devices because access times in not critical and a trade-off is possible between access time and chip area. If m-valued circuits are reduced to a very small niche in the binary world with semi-conductor technologies, there is a significant exception: quantum devices and computers are a true breakthrough as qbits are intrinsically multivalued. Successful m-valued circuits need m-valued devices as qbits.

Impact of Residual Stress on a Polysilicon Channel in Scaled 3D NAND Flash Memory

The effects of residual stress in a tungsten gate on a polysilicon channel in scaled 3D NAND flash memories were investigated using a technology computer-aided design simulation. The NAND strings with respect to the distance from the tungsten slit were also analyzed. The scaling of the spacer thickness and hole diameter induced compressive stress on the polysilicon channel. Moreover, the residual stress of polysilicon in the string near the tungsten slit had greater compressive stress than the string farther away. The increase in compressive stress in the polysilicon channel degraded the Bit-Line current (Ion) because of stress-induced electron mobility deterioration. Moreover, a threshold voltage shift (△Vth) occurred in the negative direction because of conduction band lowering.

Impact of Residual Stress on a Polysilicon Channel in Scaled 3D NAND Flash Memory

The effects of residual stress in a tungsten gate on a polysilicon channel in scaled 3D NAND flash memories were investigated using a technology computer-aided design simulation. The NAND strings with respect to the distance from the tungsten slit were also analyzed. The scaling of the spacer thickness and hole diameter induced compressive stress on the polysilicon channel. Moreover, the residual stress of polysilicon in the string near the tungsten slit had greater compressive stress than the string farther away. The increase in compressive stress in the polysilicon channel degraded the Bit-Line current (Ion) because of stress-induced electron mobility deterioration. Moreover, a threshold voltage shift (△Vth) occurred in the negative direction because of conduction band lowering.

Technique for Profiling the Cycling-Induced Oxide Trapped Charge in NAND Flash Memories

NAND Flash memories have gained tremendous attention owing to the increasing demand for storage capacity. This implies that NAND cells need to scale continuously to maintain the pace of technological evolution. Even though NAND Flash memory technology has evolved from a traditional 2D concept toward a 3D structure, the traditional reliability problems related to the tunnel oxide continue to persist. In this paper, we review several recent techniques for separating the effects of the oxide charge and tunneling current flow on the endurance characteristics, particularly the transconductance reduction (ΔGm,max) statistics. A detailed analysis allows us to obtain a model based on physical measurements that captures the main features of various endurance testing procedures. The investigated phenomena and results could be useful for the development of both conventional and emerging NAND Flash memories.

Temperature Impacts on Endurance and Read Disturbs in Charge-Trap 3D NAND Flash Memories

Temperature effects should be well considered when designing flash-based memory systems, because they are a fundamental factor that affect both the performance and the reliability of NAND flash memories. In this work, aiming to comprehensively understanding the temperature effects on 3D NAND flash memory, triple-level-cell (TLC) mode charge-trap (CT) 3D NAND flash memory chips were characterized systematically in a wide temperature range (−30~70 °C), by focusing on the raw bit error rate (RBER) degradation during program/erase (P/E) cycling (endurance) and frequent reading (read disturb). It was observed that (1) the program time showed strong dependences on the temperature and P/E cycles, which could be well fitted by the proposed temperature-dependent cycling program time (TCPT) model; (2) RBER could be suppressed at higher temperatures, while its degradation weakly depended on the temperature, indicating that high-temperature operations would not accelerate the memory cells’ degradation; (3) read disturbs were much more serious at low temperatures, while it helped to recover a part of RBER at high temperatures.

Read Reference Calibration and Tracking for Non-Volatile Flash Memories

The performance and reliability of nonvolatile NAND flash memories deteriorate as the number of program/erase cycles grows. The reliability also suffers from cell-to-cell interference, long data retention time, and read disturb. These processes effect the read threshold voltages. The aging of the cells causes voltage shifts which lead to high bit error rates (BER) with fixed predefined read thresholds. This work proposes two methods that aim on minimizing the BER by adjusting the read thresholds. Both methods utilize the number of errors detected in the codeword of an error correction code. It is demonstrated that the observed number of errors is a good measure for the voltage shifts and is utilized for the initial calibration of the read thresholds. The second approach is a gradual channel estimation method that utilizes the asymmetrical error probabilities for the one-to-zero and zero-to-one errors that are caused by threshold calibration errors. Both methods are investigated utilizing the mutual information between the optimal read voltage and the measured error values. Numerical results obtained from flash measurements show that these methods reduce the BER of NAND flash memories significantly.

Random Telegraph Noise in 3D NAND Flash Memories

In this paper, we review the phenomenology of random telegraph noise (RTN) in 3D NAND Flash arrays. The main features of such arrays resulting from their mainstream integration scheme are first discussed, pointing out the relevant role played by the polycrystalline nature of the string silicon channels on current transport. Starting from that, experimental data for RTN in 3D arrays are presented and explained via theoretical and simulation models. The attention is drawn, in particular, to the changes in the RTN dependences on the array working conditions that resulted from the transition from planar to 3D architectures. Such changes are explained by considering the impact of highly-defective grain boundaries on percolative current transport in cell channels in combination with the localized nature of the RTN traps.