scholarly journals Heterogeneous Industry Collaboration and System CAD Navigation for Advanced Package Failure Analysis

2021 ◽  
Author(s):  
Arpan Bhattacherjee ◽  
Anand Shankar ◽  
Arshdeep Singh ◽  
Mehak Singla
Keyword(s):  
Failure Analysis ◽  
Computer Aided Design ◽  
Consumer Electronics ◽  
Sensitive Information ◽  
Security Measures ◽  
Time To Market ◽  
Multiple Components ◽  
Industry Collaboration ◽  
New Challenges ◽  
Aided Design

Abstract The emergence of Heterogenous Integration (HI) in today's wave of systems-in-package (SiP) has not only increased the complexity of semiconductor Failure Analysis (FA), but also introduced new challenges that go beyond the traditional FA lab, into market verticals such as Assembly and Test. Today's market requires semiconductor companies to collaborate with these verticals to efficiently debug failures in advanced package devices. In this increasingly collaborative industry, FA engineers struggle to maintain adequate security of their company's intellectual property (IP) while sharing design information that is required for effective fault localization of SiP products. On top of these growing complications, increased commercial competition and the drastic rise in the demand for consumer electronics has made time-to-market (TTM) the top priority for all global chip makers. To address these challenges, companies strive for ways to integrate various design sources into a normalized and controllable Computer-Aided Design (CAD) database that can be seamlessly navigated across multiple components without exposing sensitive information. This paper covers an approach to enhance the efficiency of advanced package FA by integrating a full heterogeneous system into a single CAD Navigation (CADNav) database with added security measures to enable data sharing for industry-wide collaboration.

scholarly journals The Quiet Forefront

2014 ◽  
Vol 136 (08) ◽  
pp. 44-49 ◽  
Author(s):  
Jean Thilmany
Keyword(s):  
Computer Aided Design ◽  
Consumer Electronics ◽  
Element Analysis ◽  
Design Engineers ◽  
Acoustical Analysis ◽  
Design Changes ◽  
Development Cycle ◽  
Design Cycle ◽  
The Many ◽  
Aided Design

This article highlights the acoustical analysis changes made by manufacturers in design cycle. Acoustical simulation is being pushed from experts to designers, following the trend for the last 15 or so years that saw other types of engineering applications like finite element analysis and computational fluid dynamics become integrated with computer-aided design packages used by mechanical engineers. With the advent of software packages that allow for design and for acoustical analysis in tandem, design engineers are increasingly running these analyses early in the development cycle and are making design changes to decrease noise and vibration issues they find. Experts suggest that with speaker sound quality and other pertinent information in hand, designers can actually design from the get-go with that information in mind, resulting in fewer design changes down the line. Though early acoustical simulation is still perhaps one of the consumer electronics’ industries best-kept secrets, that’s likely to change as word gets out about the many advantages of front-line simulation.

Fault Localization by Finding Schematic of Devices Connecting All Emission Sites in Photon Emission Microscope Image

2017 ◽  
Author(s):  
Ankush Oberai ◽  
Jiann-Shiun Yuan
Keyword(s):  
Failure Analysis ◽  
Computer Aided Design ◽  
Critical Path ◽  
Photon Emission ◽  
Fault Localization ◽  
Microscope Image ◽  
Transmission Gates ◽  
The One ◽  
Switching Mode ◽  
Aided Design

Abstract The work presented here is related to the utilization of computer aided design (CAD) Navigation tools in combination with images from Emission Microscope (EMMI) to improve the accuracy and efficiency of Failure Analysis. The paper presents the flow to quickly identify the failing device by taking the photon emission microscope image and CAD data as input. EMMI is used extensively for detecting leakage current resulting from device defects, e.g., gate oxide defects/ leakage, latch-up, electrostatic discharge (ESD) failure, junction leakage, etc. This emitted light is captured as hotspots on the image. A typical photon emission microscope image has a series of photon emission spots initiated by one physical defect. Not all emission spots may be defects; for example, emissions are shown during normal saturation or switching mode of the transistor. This results in multiple connectivity path between these spots which failure analysis (FA) engineer may want to analyze. The FA engineer wants to detect the one failed device which causes multiple other devices to show false hotspots. The work presented in this paper involves identifying all the devices beneath the hotspot areas, processing the connectivity of the found devices and extracting the schematic for all the devices beneath these hotspots. The connectivity between the devices could be direct connections through nets or indirect through “transmission gates”. The extracted schematic helps the FA engineer focus the FA work on critical devices such as a driver and enables faster and more accurate fault localization. The work in the paper shows the extraction of critical path of devices and their connectivity.

scholarly journals Characterization and TCAD Simulation of 90nm Technology PMOS Transistor under Continuous Photoelectric Laser Stimulation for Failure Analysis Improvement

2012 ◽  
Author(s):  
R. Llido ◽  
A. Sarafianos ◽  
O. Gagliano ◽  
V. Serradeil ◽  
V. Goubier ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Integrated Circuit ◽  
Computer Aided Design ◽  
Laser Stimulation ◽  
Modeling Technology ◽  
Physical Simulations ◽  
Complex Circuits ◽  
Aided Design ◽  
Long Channel ◽  
Pmos Transistor

Abstract This study responds to our need to optimize failure analysis methodologies based on laser/silicon interactions, using the functional response of an integrated circuit to local laser stimulation. Thus it is mandatory to understand the behavior of elementary devices under laser stimulation, in order to model and anticipate the behavior of more complex circuits. This paper characterizes and analyses effects induced by a static photoelectric laser on a 90 nm technology PMOS transistor. Comparisons between currents induced in short or long channel transistors for both ON and OFF states are made. Experimental measurements are correlated to Finite Elements Modeling Technology Computer Aided Design (TCAD) analyses. These physical simulations give a physical insight of carriers generation and charge transport phenomena in the devices.

scholarly journals Digital Tolerence

2010 ◽  
Vol 132 (07) ◽  
pp. 32-34 ◽  
Author(s):  
Jean Thilmany
Keyword(s):  
Cultural Change ◽  
Computer Aided Design ◽  
Geometric Dimension ◽  
Coordinate Measuring Machine ◽  
Time To Market ◽  
Model Based ◽  
Inspection Process ◽  
Engineering Drawings ◽  
Measuring Machine ◽  
Aided Design

This article demonstrates the use of model-based definition (MBD), which can lead to improve productivity and reduce time-to-market. MBD is a method of annotating 3D computer-aided design models with geometric and tolerancing information. With Boeing moving to model-based definition, members of industry have approached the team in Montreal about investigating MBD’s usefulness. Experts believe that the MBD format, if widely adopted, would have implications for inspection. The part would be inspected against the tolerances contained within the CAD model rather than against the 2D engineering drawings, and that would speed the process and potentially make it even more accurate. The cultural change that will have to take place at most engineering companies will be difficult to tackle, and engineering and manufacturing managers know this. A model-based inspection software is being developed to read geometric, dimension, and tolerance information attached to a solid model. This will minimize operator input during development of coordinate measuring machine programs and improve the accuracy and integrity of the inspection process.

L'intégration en conception assistée par ordinateur pour les projets pluridisciplinaires de génie civil

1988 ◽  
Vol 15 (6) ◽  
pp. 990-1005 ◽  
Author(s):  
R. Camarero ◽  
L. Granger ◽  
C. Marche ◽  
M. Soulié ◽  
R. Tinawi
Keyword(s):  
Development Strategy ◽  
Computer Aided Design ◽  
Conception Assistée ◽  
Hydro Development ◽  
Engineering Structures ◽  
Engineering Software ◽  
Industry Collaboration ◽  
Computer Aided ◽  
Aided Design ◽  
University Industry

CASTOR is a major project which involves the development and the integration of the software of a computer aided design for hydro projects. Based on a university–industry collaboration, the project involves a number of specialties such as hydraulics, hydrology, reservoir simulation, site characterization, geotechnical engineering, structures, turbines, and computer science. The integration of all components is presented as an advantage despite the restrictions that it could create. The integration covers the basic philosophy in development strategy, the proposed design methodology for users, the sharing of utilities, and the relations with a central data base. A rigorous quality assurance plan is adapted for each module. Key words: computer aided design, hydro development projects, engineering software.

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