scholarly journals Обеспечение испытаний бортовых блоков управления стартерами-генераторами

2021 ◽  
pp. 138-143
Author(s):  
Анна Григорьевна Буряченко ◽  
Андрей Анатольевич Царев

There are described the results of the creation by the developer of the on-board equipment – JSC "Element" – improved specialized test equipment for checking the parameters of the on-board control units of DC starter-generators – a stand-simulator of the starter-generator. The previously developed version improvement was carried out to increase the tests automatization because of preparation for control units' serial production stage. In addition, during the improvement process, the list of simulated starter-generators has been expanded, namely, to the starter-generators produced in France (THALES), Russia (STG9M-1, STG-3), and Ukraine (8260-12UD, 8260-9UD, STG-150UD) for the AI-450M engine and its modifications (with which the BZG-450 unit worked, providing control of start-up and generation) the STG-12TMO-1000 starter-generator was added. This STG-12TMO-1000 works with the AI-25TLT engine, for which Element JSC is currently developing an SGU-25 unit for control of start-up and generation. Stand-simulator improvement was based on an additional experimental study of the interaction between mentioned control units and real objects. The interaction was studied during the test process on the engine stand and aircraft of the State Enterprise "Ivchenko-Progress" and JSC "Motor Sich". The results achieved are shown. There are shown the structural diagram of improved stand-simulator and working screen of specialized software installed on a personal computer and providing the operator with the ability to control the test process. A list of simulated analog and frequency signals with ranges and errors indication is given. In addition to the stand-simulator description, attention is also paid to the quality checking method of the installation of printed circuit boards of control units by thermography means under electrical load and comparison with a specially prepared reference picture of temperature distribution. The need for such especially careful control during acceptance tests is due to the level of flowing currents – up to 20 A.

1995 ◽  
Vol 117 (4) ◽  
pp. 288-293
Author(s):  
J. J. Miles ◽  
C. R. Zelak ◽  
J. M. Kliman ◽  
J. E. Sunderland

A method is presented to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. Testing is intended for implementation in a volume manufacturing environment and involves the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: a procedure for handling variable radiation heat transfer properties across a printed circuit board be developed; a thermally-controlled test enclosure be provided; PASS/FAIL criteria be established. These tasks are addressed, testing procedures are described, and favorable results are presented. The feasibility of an infrared test process is demonstrated.


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.


2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo

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