Design of a high sensitivity and low power ultrasound receiver with a high-resolution SAR ADC for photoacoustic sensing and imaging

2020 ◽  
Author(s):  
◽  
Chuanshi Yang
Keyword(s):  
High Resolution ◽  
Low Power ◽  
High Sensitivity ◽  
Sar Adc ◽  
Power Ultrasound

An 8-bit 3: 2MS/s low power SAR ADC for high-resolution audio applications

2016 ◽  
pp. 323-324
Author(s):  
Chi-Hsiung Wang ◽  
Jen-Shiun Chiang ◽  
Wei-Ming Hsu ◽  
Wei-Bin Yang ◽  
Horng-Yuan Shih ◽  
...  
Keyword(s):  
High Resolution ◽  
Low Power ◽  
Sar Adc

Backscattered Electron Imaging of GaAs/AlGaAs Super Lattice Structures with an Ultra-High- Resolution SEM

1988 ◽  
Vol 46 ◽  
pp. 204-205
Author(s):  
Kazumichi Ogura ◽  
Michael M. Kersker
Keyword(s):  
High Resolution ◽  
Layer Structure ◽  
High Sensitivity ◽  
Beam Current ◽  
Electron Beam Current ◽  
Lattice Structures ◽  
Super Lattice ◽  
Different Types ◽  
Backscattered Electron ◽  
Electron Imaging

Backscattered electron (BE) images of GaAs/AlGaAs super lattice structures were observed with an ultra high resolution (UHR) SEM JSM-890 with an ultra high sensitivity BE detector. Three different types of super lattice structures of GaAs/AlGaAs were examined. Each GaAs/AlGaAs wafer was cleaved by a razor after it was heated for approximately 1 minute and its crosssectional plane was observed.First, a multi-layer structure of GaAs (100nm)/AlGaAs (lOOnm) where A1 content was successively changed from 0.4 to 0.03 was observed. Figures 1 (a) and (b) are BE images taken at an accelerating voltage of 15kV with an electron beam current of 20pA. Figure 1 (c) is a sketch of this multi-layer structure corresponding to the BE images. The various layers are clearly observed. The differences in A1 content between A1 0.35 Ga 0.65 As, A1 0.4 Ga 0.6 As, and A1 0.31 Ga 0.69 As were clearly observed in the contrast of the BE image.

Real-time, High-resolution Depth Upsampling on Embedded Accelerators

2021 ◽  
Vol 20 (3) ◽  
pp. 1-22
Author(s):  
David Langerman ◽  
Alan George
Keyword(s):  
High Resolution ◽  
Low Power ◽  
Real Time ◽  
Mixed Reality ◽  
Graphics Processing Unit ◽  
Processing Unit ◽  
Reconfigurable Logic ◽  
Depth Sensors ◽  
Time Requirements ◽  
Graphics Processing

High-resolution, low-latency apps in computer vision are ubiquitous in today’s world of mixed-reality devices. These innovations provide a platform that can leverage the improving technology of depth sensors and embedded accelerators to enable higher-resolution, lower-latency processing for 3D scenes using depth-upsampling algorithms. This research demonstrates that filter-based upsampling algorithms are feasible for mixed-reality apps using low-power hardware accelerators. The authors parallelized and evaluated a depth-upsampling algorithm on two different devices: a reconfigurable-logic FPGA embedded within a low-power SoC; and a fixed-logic embedded graphics processing unit. We demonstrate that both accelerators can meet the real-time requirements of 11 ms latency for mixed-reality apps. 1

Low-power laser calorimetry with high resolution

1994 ◽  
Author(s):  
Hans W. Becker ◽  
Volker Scheuer ◽  
Theo T. Tschudi
Keyword(s):  
High Resolution ◽  
Low Power ◽  
Power Laser ◽  
Laser Calorimetry
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