scholarly journals Investigation of Multi-Mesa-Channel-Structured AlGaN/GaN MOSHEMTs with SiO2 Gate Oxide Layer

Coatings ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1494
Author(s):  
Jhang-Jie Jian ◽  
Hsin-Ying Lee ◽  
Edward-Yi Chang ◽  
Ching-Ting Lee
Keyword(s):  
Performance Metrics ◽  
Low Frequency ◽  
High Electron Mobility Transistors ◽  
Oxide Semiconductor ◽  
Frequency Noise ◽  
High Electron ◽  
Electron Mobility Transistors ◽  
Positive Voltage ◽  
Gate Control ◽  
Source Current

In this study, an electron-beam lithography system was employed to pattern 80-nm-wide and 980-nm-spaced multi-mesa-channel for fabricating AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs). Since the structure of multi-mesa-channel could enhance gate control capabilities and reduce the self-heating effect in the channel, the performance of the MOSHEMTs could be obviously improved. The direct current performance metrics of the multi-mesa-channel-structured MOSHEMTs, such as a saturation drain-source current of 929 mA/mm, maximum extrinsic transconductance of 223 mS/mm, and on-resistance of 2.1 Ω-mm, were much better than those of the planar-structured MOSHEMTs. Moreover, the threshold voltage of the multi-mesa-channel-structured MOSHEMTs shifted toward positive voltage from −2.6 to −0.6 V, which was attributed to the better gate control capability. Moreover, the multi-mesa-channel-structured MOSHEMTs also had superior high-frequency and low-frequency noise performance. A low Hooge’s coefficient of 1.17 × 10−6 was obtained.

Low-Frequency Noise Investigation of AlGaN/GaN High-Electron-Mobility Transistors

2021 ◽  
pp. 108050
Author(s):  
Maria Glória Caño de Andrade ◽  
Luis Felipe de Oliveira Bergamim ◽  
Braz Baptista Júnior ◽  
Carlos Roberto Nogueira ◽  
Fábio Alex da Silva ◽  
...  
Keyword(s):  
Electron Mobility ◽  
Low Frequency ◽  
High Electron Mobility Transistors ◽  
Frequency Noise ◽  
High Electron ◽  
Low Frequency Noise ◽  
High Electron Mobility ◽  
Electron Mobility Transistors

scholarly journals Excess low-frequency noise in AlGaN/GaN-based high-electron-mobility transistors

2002 ◽  
Vol 80 (12) ◽  
pp. 2126-2128 ◽  
Author(s):  
S. A. Vitusevich ◽  
S. V. Danylyuk ◽  
N. Klein ◽  
M. V. Petrychuk ◽  
V. N. Sokolov ◽  
...  
Keyword(s):  
Electron Mobility ◽  
Low Frequency ◽  
High Electron Mobility Transistors ◽  
Frequency Noise ◽  
High Electron ◽  
Low Frequency Noise ◽  
High Electron Mobility ◽  
Electron Mobility Transistors

scholarly journals Effects of GaN Buffer Resistance on the Device Performances of AlGaN/GaN HEMTs

Crystals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 848
Author(s):  
Ki-Sik Im ◽  
Jae-Hoon Lee ◽  
Yeo Jin Choi ◽  
Sung Jin An
Keyword(s):  
Buffer Layer ◽  
Deep Level ◽  
Low Frequency ◽  
High Electron Mobility Transistors ◽  
Frequency Noise ◽  
High Electron ◽  
Electron Mobility Transistors ◽  
Noise Characteristics ◽  
Temperature Method ◽  
Gan Buffer Layer

We investigated the effects of GaN buffer resistance of AlGaN/GaN high-electron-mobility transistors (HEMTs) on direct current (DC), low-frequency noise (LFN), and pulsed I-V characterization performances. The devices with the highest GaN buffer resistance were grown on sapphire substrate using two-step growth temperature method without additional compensation doping. The proposed device exhibited the degraded off-state leakage current due to the improved GaN buffer quality compared to the reference devices with relative low buffer resistance, which is confirmed by high resolution X-ray diffraction (HRXRD). However, the proposed device with deep-level defects in GaN buffer layer showed the reduced hysteresis (∆Vth), increased breakdown voltage (BV), and enhanced pulse I-V characteristics. Regardless of GaN buffer resistance, all devices clearly showed 1/f behavior with carrier number fluctuations (CNF) at on-state but followed 1/f2 characteristic at off-state. From the 1/f2 noise characteristics, the extracted trap time constant (τi) of the proposed device can be obtained to be 10 ms, which is shorter than those of the reference devices because of the full compensation of deep-level defects in the GaN buffer layer.

scholarly journals AlGaN/GaN on SiC Devices without a GaN Buffer Layer: Electrical and Noise Characteristics

Micromachines ◽  
2020 ◽  
Vol 11 (12) ◽  
pp. 1131
Author(s):  
Justinas Jorudas ◽  
Artūr Šimukovič ◽  
Maksym Dub ◽  
Maciej Sakowicz ◽  
Paweł Prystawko ◽  
...  
Keyword(s):  
Gallium Nitride ◽  
Hybrid Material ◽  
Low Frequency ◽  
Drain Current ◽  
High Electron Mobility Transistors ◽  
Frequency Noise ◽  
High Electron ◽  
Electron Mobility Transistors ◽  
Noise Characteristics ◽  
Noise Measurements

We report on the high-voltage, noise, and radio frequency (RF) performances of aluminium gallium nitride/gallium nitride (AlGaN/GaN) on silicon carbide (SiC) devices without any GaN buffer. Such a GaN–SiC hybrid material was developed in order to improve thermal management and to reduce trapping effects. Fabricated Schottky barrier diodes (SBDs) demonstrated an ideality factor n at approximately 1.7 and breakdown voltages (fields) up to 780 V (approximately 0.8 MV/cm). Hall measurements revealed a thermally stable electron density at N2DEG = 1 × 1013 cm−2 of two-dimensional electron gas in the range of 77–300 K, with mobilities μ = 1.7 × 103 cm2/V∙s and μ = 1.0 × 104 cm2/V∙s at 300 K and 77 K, respectively. The maximum drain current and the transconductance were demonstrated to be as high as 0.5 A/mm and 150 mS/mm, respectively, for the transistors with gate length LG = 5 μm. Low-frequency noise measurements demonstrated an effective trap density below 1019 cm−3 eV−1. RF analysis revealed fT and fmax values up to 1.3 GHz and 6.7 GHz, respectively, demonstrating figures of merit fT × LG up to 6.7 GHz × µm. These data further confirm the high potential of a GaN–SiC hybrid material for the development of thin high electron mobility transistors (HEMTs) and SBDs with improved thermal stability for high-frequency and high-power applications.

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