scholarly journals Texture and Microstructure Evolution of Ultra-High Purity Cu-0.1Al Alloy under Different Rolling Methods

Crystals ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1113
Author(s):  
Doudou Long ◽  
Shifeng Liu ◽  
Jialin Zhu ◽  
Jing Zhang ◽  
Xiaoli Yuan
Keyword(s):  
Microstructure Evolution ◽  
High Purity ◽  
Electron Backscatter Diffraction ◽  
Deformation Bands ◽  
Layer Spacing ◽  
Ultra High Purity ◽  
Average Grain Size ◽  
Orientation Density ◽  
The Difference ◽  
Backscatter Diffraction

The microstructure and texture distribution of ultra-high purity Cu-0.1Al alloy target play a key role in the quality of the sputtering film. The Cu-0.1Al alloy sheets were processed by unidirectional (UR) and cross rolling (CR), and X-ray diffraction (XRD), and electron backscatter diffraction (EBSD) technologies were adopted to observe the texture and microstructure evolution. XRD results reveal that the texture types vary greatly in UR and CR due to the change of strain path. As the strain increases to 90%, S texture occupies the most, followed by copper texture in the UR sample, while brass texture dominates the most in the CR sample. Additionally, the orientation density of texture does not increase significantly with the increase of strain but shows a downward trend both in UR and CR modes. EBSD analysis demonstrates that compared with UR, the deformation microstructure in CR is more uniform, and the layer spacing between the deformation bands is smaller, which can reduce the local-region stress concentration. After the completion of recrystallization, the difference in average grain size between the UR and CR-annealed samples is not significant, and the recrystallized grains become much finer with the increase of strain, while more equiaxed grains can be observed in CR-annealed samples.

Texture and Microstructure Evolution in Friction Stir Welded Cu-Al Sheets Characterized by EBSD

2011 ◽  
Vol 702-703 ◽  
pp. 574-577 ◽  
Author(s):  
Daniel Goran ◽  
G. Ji ◽  
M. N. Avettand-Fènoël ◽  
R. Taillard
Keyword(s):  
Microstructure Evolution ◽  
Electron Backscatter Diffraction ◽  
Texture Evolution ◽  
Weld Interface ◽  
Friction Stir ◽  
Electron Backscatter ◽  
Ebsd Technique ◽  
Backscatter Diffraction

Texture and microstructure of FSW joined Al and Cu sheets were investigated by means of electron backscatter diffraction (EBSD) technique. The analysis has revealed a strong texture evolution on both sides of the weld interface as well as a very complex microstructure. Grains were found to be fully recrystallized on both sides of the weld and with different average diameters at different specific zones of the weld.

scholarly journals Microstructure Evolution and Mechanical Property Characterization of 6063 Aluminum Alloy Tubes Processed with Friction Stir Back Extrusion

JOM ◽  
2019 ◽  
Vol 71 (12) ◽  
pp. 4436-4444
Author(s):  
Suhong Zhang ◽  
Alan Frederick ◽  
Yiyu Wang ◽  
Mike Eller ◽  
Paul McGinn ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Microstructure Evolution ◽  
Electron Backscatter Diffraction ◽  
Deformation Gradient ◽  
Optical Microscope ◽  
Grain Structure ◽  
Frictional Heat ◽  
Friction Stir ◽  
Metal Extrusion ◽  
Backscatter Diffraction

Abstract Friction stir back extrusion (FSBE) is a technique for lightweight metal extrusion. The frictional heat and severe plastic deformation of the process generate an equiaxed refined grain structure because of dynamic recrystallization. Previous studies proved that the fabrication of tube and wire structures is feasible. In this work, hollow cylindrical billets of 6063-T6 aluminum alloy were used as starting material. A relatively low extrusion ratio allows for a temperature and deformation gradient through the tube wall thickness to elucidate the effect of heat and temperature on the microstructure evolution during FSBE. The force and temperature were recorded during the processes. The microstructures of the extruded tubes were characterized using an optical microscope, energy-dispersive x-ray spectroscopy, electron backscatter diffraction, and hardness testing. The process reduced the grain size from 58.2 μm to 20.6 μm at the inner wall. The microhardness of the alloy was reduced from 100 to 60–75 HV because of the process thermal cycle.

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

2010 ◽  
Vol 132 (2) ◽  
Author(s):  
X. Zhao ◽  
M. Saka ◽  
M. Yamashita ◽  
F. Togoh
Keyword(s):  
Grain Boundary ◽  
High Purity ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Dominant Factor ◽  
Affecting Factors ◽  
Flux Divergence ◽  
Proposed Model ◽  
Average Grain Size ◽  
The Difference

This paper is focused on evaluating the dominant factor for electromigration (EM) in sputtered high purity Al films. A closed-form equation of atomic flux divergence by treating grain boundary diffusion and hillock formation in a polycrystalline structure without passivation layer was derived to construct the theoretical model. According to the developed equation, it is available to see the effect of various parameters on the EM resistance. Moreover, based on the proposed model, we compared the EM resistance of different sputtered high purity Al films. These films differ in purity and features, which are realized as affecting factors for the EM resistance. Finally, according to the analysis by the synthesis of the obtained EM resistance, the evaluation of the dominant factor for EM in sputtered high purity Al films was approached. Although the effects of the average grain size and the effective valence cannot be ignored, the difference in diffusion coefficient was believed to have a dominant influence in determining the EM resistance. Thus, increasing the activation energy for grain boundary diffusion can significantly reduce the damage during EM in such sputtered polycrystalline Al films.

Effect of Annealing Time on the Microstructure and Texture of Interstitial Free Steel

2012 ◽  
Vol 535-537 ◽  
pp. 593-596
Author(s):  
Zhi Fen Wang ◽  
Rong Dong Han ◽  
Shun Bing Zhou ◽  
Zhong Hai Yao ◽  
Li Xin Wu
Keyword(s):  
Grain Size ◽  
Annealing Time ◽  
Electron Backscatter Diffraction ◽  
Recrystallization Process ◽  
Interstitial Free ◽  
X Ray Diffraction ◽  
Steel Sheets ◽  
Grain Boundary Character ◽  
Average Grain Size ◽  
Backscatter Diffraction

Effect of annealing time on the microstructure and texture of IF steel sheets was investigated. Average grain size, grain boundary character and recrystallization texture were measured by X-ray diffraction (XRD) and electron backscatter diffraction (EBSD) in order to clarify the effect of annealing time on microstructure of recrystallization process. The average grain size increased with increasing annealing time. With rising annealing time, the number of low angle boundary (0～15o) decreased due to the mergence of grain with sub-boundary. The //ND (-fiber) pole intensity had a highest value annealed at 60s. The annealing time played an important role in recrystallization process which affected the mechanical properties and microstructure of IF steels.

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