scholarly journals Robust Interferometry for Testing Thermal Expansion of Dual-Material Lattices

Materials ◽  
2020 ◽  
Vol 13 (2) ◽  
pp. 313
Author(s):  
Weipeng Luo ◽  
Shuai Xue ◽  
Cun Zhao ◽  
Meng Zhang ◽  
Guoxi Li
Keyword(s):  
Thermal Expansion ◽  
Measurement Error ◽  
Coefficient Of Thermal Expansion ◽  
Test Sample ◽  
Test Method ◽  
Measuring Error ◽  
Rotational Angle ◽  
Measurement Sensor ◽  
Wide Range ◽  
Dual Material

Dual-material lattices with tailorable coefficients of thermal expansion have been applied to a wide range of modern engineering systems. As supporting techniques for fabricating dual-material lattices with given coefficients of thermal expansion, the current existing methods for measuring the coefficient of thermal expansion have limited anti-interference ability. They ignore the measuring error caused by micro-displacement between the measurement sensor and the test sample. In this paper, we report a robust interferometric test method which can eliminate the measurement error caused by micro-displacement between the measurement sensor and the test sample. In the presented method, two parallel plane lenses are utilized to avoid the measurement error caused by translation, and the right lens is utilized as an angle detector to eliminate the measurement error caused by rotation. A robust interferometric testing setup was established using a distance measuring set and two plane lenses. The experiment results indicated that the method can avoid the measurement error induced by translation and has the potential to eliminate the measurement error induced by rotation using the rotational angle. This method can improve the anti-interference ability and accuracy by eliminating the measurement error. It is especially useful for high-precision thermal expansion measurement of dual-material lattices.

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

2014 ◽  
Vol 136 (1) ◽  
Author(s):  
Changsoo Jang ◽  
Bongtae Han
Keyword(s):  
Thermal Expansion ◽  
Moisture Content ◽  
Coefficient Of Thermal Expansion ◽  
Measurement Data ◽  
Hybrid Procedure ◽  
Boiling Temperature ◽  
Hygrothermal Behavior ◽  
Expansion Behavior ◽  
Wide Range ◽  
Moisture Conditions

Hygroscopic and thermal expansion behavior of advanced polymers is investigated when subjected to combined high temperature and moisture conditions. An enhanced experimental–numerical hybrid procedure is proposed to overcome the limitations of the existing methods when used at temperatures above the water boiling temperature. The proposed procedure is implemented to measure the hygrothermal strains of three epoxy molding compounds and a no-filler underfill over a wide range of temperatures including temperatures beyond the water boiling temperature. The effects of moisture content on the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are evaluated from the measurement data. A formulation to predict the Tg change as a function of moisture content is also presented.

Investigation of fatigue behavior of centrifuged series 3000 Al with addition of 26 wt% Cu

2020 ◽  
Vol 234 (10) ◽  
pp. 1375-1385
Author(s):  
Aref Mehditabar ◽  
Seyed E Vahdat ◽  
Gholam-Hossein Rahimi
Keyword(s):  
Electron Microscopy ◽  
Thermal Expansion ◽  
High Performance ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Fatigue Behavior ◽  
Centrifugal Casting ◽  
Image Analyzer ◽  
Casting Technique ◽  
Wide Range

More than 70% of mechanical parts in a wide range of engineering fields fail by fatigue. In addition, centrifugal casting is identified as the most effective casting technique for production of high performance cylindrical parts. In this regard, the present work aims to investigate the fatigue behavior of series 3000 Al with addition of 26 wt% Cu produced through horizontal centrifugal casting method. Microstructure characterizations are precisely studied using scanning transmission electron microscopy and field emission scanning electron microscopy in conjunction with image analyzer software. Also, compressive behavior, hardness, coefficient of thermal expansion, and wear rate ( Wr) are measured applying Zwick Z100, Vickers hardness, DIL 805A/D, and pin-on-disc machines, respectively. The results indicate that the main intermetallic compound is Al2Cu-based particle, and a volume fraction of 31 vol.% is obtained. Besides, the compressive strength of 460 MPa, elastic modulus of 10.986 GPa, hardness of 152 HV, coefficient of thermal expansion of 1.7 × 10−5 1/°C, and wear resistance of 3.3 × 10−6 g/mm2 are measured. Finally, the four-point bending fatigue test is performed and the fatigue ratio of 0.109 at about 106 cycles to failure is obtained.

scholarly journals Micro-structured medium with large isotropic negative thermal expansion

2019 ◽  
Vol 475 (2232) ◽  
pp. 20190468 ◽  
Author(s):  
Luigi Cabras ◽  
Michele Brun ◽  
Diego Misseroni
Keyword(s):  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Negative Thermal Expansion ◽  
Simple Relation ◽  
Space Structures ◽  
New Class ◽  
Wide Range ◽  
Theoretical Predictions ◽  
Innovative Materials ◽  
New Generation

A challenge in nano- and micro-mechanics is the realization of innovative materials exploiting auxetic behaviour to tailor thermal expansion properties. For this purpose, a new class of micro-structured media possessing an extremely wide range of tunable (positive, negative or even zero) thermal expansion is proposed and analytically and experimentally assessed. For this class of isotropic Mechanical-Auxetic Thermal-Shrinking media, the effective coefficient of thermal expansion is explicitly linked to two microstructural variables via a simple relation, allowing the design with desired values. The theoretical predictions for the negative thermal properties are fully validated by the experimental and numerical outcomes. The simplicity of the proposed structure makes the design useful for the production of a new generation of advanced media, with applications ranging from micromechanical devices to large civil and space structures.

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