scholarly journals Effect of Ag on Properties, Microstructure, and Thermostability of Cu–Cr Alloy

Materials ◽  
2020 ◽  
Vol 13 (23) ◽  
pp. 5386
Author(s):  
Yuqing Sun ◽  
Gaolei Xu ◽  
Xue Feng ◽  
Lijun Peng ◽  
Guojie Huang ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Cold Drawing ◽  
Softening Temperature ◽  
Optical Microscope ◽  
Peak Hardness ◽  
Transmission Electron ◽  
Alloy Microstructure ◽  
Softening Process ◽  
Stability Limits ◽  
Thermal Stability Of

Cu–Cr-based alloys exhibit excellent electrical conductivity and strength, but their poor thermal stability limits their application in industry. In this paper, Cu–0.2Cr (at. %) and Cu–0.2Cr–0.12Ag (at. %) alloys were prepared to study the effect of Ag on the properties, microstructure, and thermal stability of the Cu–Cr alloy. Microstructure and precipitation were observed by an optical microscope (OM) and a transmission–electron microscope (TEM). After cold-drawing by 99.9% and aging at 450 °C for 2 h, the peak hardness and electric conductivity of the Cu–Cr alloy were 120.3 HV and 99.5% IACS, respectively, and those of the Cu–Cr–Ag alloy were 135.8 HV and 98.3% IACS, respectively. The softening temperature of the Cu–Cr alloy was 500~525 °C, and that of the Cu–Cr–Ag alloy was about 550 °C. The creep strains of the Cu–Cr and Cu–Cr–Ag alloys at 40 MPa and 400 ℃ for 50 h were 0.18% and 0.05%, respectively. Ag elements improved the thermal stability of the Cu–Cr alloy. Recovery and recrystallization occurred before the coarsening of precipitates during the softening process. Ag atoms mainly improved the softening resistance of the alloy by delaying recrystallization, and mainly increased creep resistance by preventing the increase in mobile-dislocation density.

Formation and Thermal Stability of Nd0.32Y0.68Si1.7 Layers Formed by Channeled Ion Beam Synthesis

1998 ◽  
Vol 514 ◽  
Author(s):  
M. F. Wu ◽  
A. Vantomne ◽  
S. Hogg ◽  
H. Pattyn ◽  
G. Langouche ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Ion Beam ◽  
Hexagonal Structure ◽  
Orthorhombic Structure ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Good Crystalline Quality ◽  
Ion Beam Synthesis ◽  
Thermal Stability Of

ABSTRACTThe Nd-disilicide, which exists only in a tetragonal or an orthorhombic structure, cannot be grown epitaxially on a Si(111) substrate. However, by adding Y and using channeled ion beam synthesis, hexagonal Nd0.32Y0.68Si1.7 epilayers with lattice constant of aepi = 0.3915 nm and cepi = 0.4152 nm and with good crystalline quality (χmin of Nd and Y is 3.5% and 4.3 % respectively) are formed in a Si(111) substrate. This shows that the addition of Y to the Nd-Si system forces the latter into a hexagonal structure. The epilayer is stable up to 950 °C; annealing at 1000 °C results in partial transformation into other phases. The formation, the structure and the thermal stability of this ternary silicide have been studied using Rutherford backscattering/channeling, x-ray diffraction and transmission electron microscopy.

scholarly journals Polystyrene/Montmorillonite Nanocomposites: Study of the Morphology and Effects of Sonication Time on Thermal Stability

2013 ◽  
Vol 2013 ◽  
pp. 1-12 ◽  
Author(s):  
Mashael Alshabanat ◽  
Amal Al-Arrash ◽  
Waffa Mekhamer
Keyword(s):  
Electron Microscopy ◽  
Thermal Stability ◽  
Solution Method ◽  
Sonication Time ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Polystyrene Matrix ◽  
Before And After ◽  
Silicate Layers ◽  
Thermal Stability Of

Polymer nanocomposites of polystyrene matrix containing 10% wt of organo-montmorillonite (organo-MMT) were prepared using the solution method with sonication times of 0.5, 1, 1.5, and 2 hours. Cetyltrimethylammonium bromide (CTAB) is used to modify the montmorillonite clay after saturating its surface with Na+ions. Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM) were used to characterize the montmorillonite before and after modification by CTAB. The prepared nanocomposites were characterized using the same analysis methods. These results confirm the intercalation of PS in the interlamellar spaces of organo-MMT with a very small quantity of exfoliation of the silicate layers within the PS matrix of all samples at all studied times of sonication. The thermal stability of the nanocomposites was measured using thermogravimetric analysis (TGA). The results show clear improvement, and the effects of sonication time are noted.

Immobilization of hemoglobin on stable mesoporous multilamellar silica vesicles and their activity and stability

2005 ◽  
Vol 20 (10) ◽  
pp. 2682-2690 ◽  
Author(s):  
Yufang Zhu ◽  
Weihua Shen ◽  
Xiaoping Dong ◽  
Jianlin Shi
Keyword(s):  
Thermal Stability ◽  
Pore Size ◽  
X Ray Diffraction ◽  
X Ray ◽  
Practical Applications ◽  
Silica Material ◽  
Transmission Electron ◽  
Mesoporous Support ◽  
Adsorption Desorption ◽  
Thermal Stability Of

A stable mesoporous multilamellar silica vesicle (MSV) was developed with a gallery pore size of about 14.0 nm. A simulative enzyme, hemoglobin (Hb), was immobilized on this newly developed MSV and a conventional mesoporous silica material SBA-15. The structures and the immobilization of Hb on the mesoporous supports were characterized with x-ray diffraction, transmission electron microscopy, N2 adsorption-desorption isotherms, Fourier transform infrared, ultraviolet-visible spectroscopy, and so forth. MSV is a promising support for immobilizing Hb due to its large pore size and high Hb immobilization capacity (up to 522 mg/g) compared to SBA-15 (236 mg/g). Less than 5% Hb was leached from Hb/MSV at pH 6.0. The activity study indicated that the immobilized Hb retained most peroxidase activity compared to free Hb. Thermal stability of the immobilized Hb was improved by the proctetive environment of MSV and SBA-15. Such an Hb-mesoporous support with high Hb immobilization capacity, high activity, and enhanced thermal stability will be attractive for practical applications.

Strengthening Mechanism and Thermal Stability of Spray Formed H13 Steel

2019 ◽  
Vol 295 ◽  
pp. 49-56
Author(s):  
Zhan Zhan Zhang ◽  
Wan Zhen Wang ◽  
Yun Bo Chen ◽  
Miao Hui Wang ◽  
Chang De Zhao ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thermal Stability ◽  
Transmission Electron Microscopy ◽  
Strengthening Mechanism ◽  
H13 Steel ◽  
Tempering Temperature ◽  
Transmission Electron ◽  
Tempering Treatment ◽  
Hardness Values ◽  
Thermal Stability Of

The aim of this work is to study the strengthening mechanism and thermal stability of spray formed H13 steel. The microstructure and hardness of spray formed H13 steels are investigated by electron microscopy, transmission electron microscopy and hardness measurementscanning. The calculated results demonstrate that tensile strength, impact energy and hardness values of sprayed-formed H13 steel are higher than that of as-cast H13 steel when the tempering temperature is 600 °C after quenched at 1050 °C. Compared with as-cast H13 steels, tempered spray-formed H13 steels possess supernal high-temperature temper resistant stability. The chemical composition of the carbides in spray-formed steels is V and Cr rich spherical carbides are hardly influenced by the tempering treatment.

Structure and Thermal Stability of Cu after Severe Plastic Deformation

2010 ◽  
Vol 297-301 ◽  
pp. 1312-1321 ◽  
Author(s):  
Vladimir V. Popov ◽  
A.V. Stolbovkiy ◽  
E.N. Popova ◽  
V.P. Pilyugin
Keyword(s):  
Thermal Stability ◽  
Plastic Deformation ◽  
Severe Plastic Deformation ◽  
High Pressure Torsion ◽  
Pure Copper ◽  
Nanocrystalline Structure ◽  
Transmission Electron ◽  
Evolution Of Structure ◽  
Stability Of Structure ◽  
Thermal Stability Of

Evolution of structure of high-purity and commercially pure copper at severe plastic deformation (SPD) by high pressure torsion (HPT) at room temperature and in liquid nitrogen has been studied by transmission electron microscopy (TEM) and measurements of microhardness. Thermal stability of structure obtained by HPT has been investigated. Factors preventing from obtaining nanocrystalline structure in Cu are analyzed and possible ways of their overcoming are discussed.

Sign in / Sign up

Export Citation Format

Share Document