scholarly journals Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Materials ◽  
2021 ◽  
Vol 14 (17) ◽  
pp. 4869
Author(s):  
Hongpeng Jiang ◽  
Guangqiang Yan ◽  
Jianwei Li ◽  
Jie Xu ◽  
Debin Shan ◽  
...  
Keyword(s):  
Microstructural Evolution ◽  
Size Effects ◽  
Deformation Behavior ◽  
Pure Copper ◽  
High Strength ◽  
Recrystallization Temperature ◽  
Second Stage ◽  
Forming Load ◽  
Ultrafine Grained ◽  
Upsetting Test

Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C.

The Analysis of SPD Paradox by Computer Modeling Technique

2009 ◽  
Vol 633-634 ◽  
pp. 231-248
Author(s):  
Igor V. Alexandrov ◽  
Roza G. Chembarisova
Keyword(s):  
Plastic Deformation ◽  
Thermal Treatment ◽  
Deformation Behavior ◽  
High Strength ◽  
High Ductility ◽  
Angular Pressing ◽  
Deformation Twins ◽  
Ultrafine Grained ◽  
Favorable Conditions ◽  
Dislocation Density Increase

The paper has viewed the manifestation of the paradox of severe plastic deformation (SPD), caused by the occurrence of preexisting deformation twins in ultrafine-grained Cu, which has been obtained by the combination of the SPD method, accomplished by an equal-channel angular pressing with the conventional methods of deformation-thermal treatment. The high strength of the obtained samples has proved to be conditioned by the occurrence of the high density of the coherent twin boundaries, serving as effective obstacles on the way of slipping dislocations. Moreover, the occurrence of the twins creates favorable conditions for the dislocation density increase both in the grains with the twins and in the grains without them. As a result the sample hardens, contributing additionally into its strength. Simultaneously it manifests high ductility. By doing so the deformation behavior of the sample is mainly conditioned by the grain boundaries of grains free from the twins. The results were obtained on the basis of the dislocation-based model which develops models of Y. Estrin and L. Tóth, M. Zehetbauer, and L. Remy.

scholarly journals Ultrafine-Grained High Strength Cu-Ni-Si Alloys

2017 ◽  
Vol 892 ◽  
pp. 64-69 ◽  
Author(s):  
Igor Altenberger ◽  
Hans Achim Kuhn ◽  
Mozhgan Gholami-Kermanshahi ◽  
Mansour Mhaede ◽  
Manfred Wollmann ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Plastic Deformation ◽  
Severe Plastic Deformation ◽  
Copper Alloys ◽  
Pure Copper ◽  
High Strength ◽  
Solid Solution Hardening ◽  
Subsequent Aging ◽  
Ultrafine Grained ◽  
Wide Range

Ultrafine-grained (UFG) pure copper has been in the focus of materials scientists over the last two decades, however ultrafine-grained high-strength copper alloys have scarcely been processed or characterized so far industrially.In this contribution, UFG copper alloys, especially Cu-Ni-Si alloys, being well known as ideal materials for electromechanical connectors, springs and leadframes, are presented. Precipitation hardened Cu-Ni-Si alloys are a well established and technologically important class of materials for a wide range of applications where high strength and good conductivity are required. Yield strength and fatigue properties of metallic alloys can be significantly enhanced by severe plastic deformation methods. In contrast to other strengthening methods such as solid solution hardening, severe plastic deformation leads to a weaker decrease of electrical conductivity and is therefore a means of enhancing strength while maintaining acceptable conductivity for current bearing parts and components. Characterization of these materials after severe plastic deformation by swaging, wire drawing and subsequent aging was carried out using conductivity-, hardness-and tensile tests as well as highly-resolved microstructural characterization methods.The results reveal that UFG low alloyed copper alloys exhibit impressive combinations of properties such as strength, conductivity, high ductility as well as acceptable thermal stability at low and medium temperatures. By a subsequent aging treatment the severely plastically deformed microstructure of Cu-Ni-Si alloys can be further enhanced and thermal stability can profit from grain-boundary pinning by precipitated nanoscale nickel silicides.

Biaxial Deformation Behavior and Enhanced Formability of Ultrafine-Grained Pure Copper

2012 ◽  
Vol 44 (5) ◽  
pp. 2399-2408 ◽  
Author(s):  
E. C. Moreno-Valle ◽  
M. A. Monclus ◽  
J. M. Molina-Aldareguia ◽  
N. Enikeev ◽  
I. Sabirov
Keyword(s):  
Deformation Behavior ◽  
Pure Copper ◽  
Biaxial Deformation ◽  
Ultrafine Grained

Size effects on plastic deformation behavior in micro radial compression of pure copper

2013 ◽  
Vol 23 (9) ◽  
pp. 2686-2691 ◽  
Author(s):  
Li-dong CHENG ◽  
Chuan-jie WANG ◽  
Chun-ju WANG ◽  
Bin GUO ◽  
Zhen-long WANG
Keyword(s):  
Plastic Deformation ◽  
Size Effects ◽  
Deformation Behavior ◽  
Pure Copper ◽  
Radial Compression ◽  
Plastic Deformation Behavior
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