scholarly journals Synergistic Enhanced Thermal Conductivity and Dielectric Constant of Epoxy Composites with Mesoporous Silica Coated Carbon Nanotube and Boron Nitride Nanosheet

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5251
Author(s):  
Yutao Hao ◽  
Qihan Li ◽  
Xianhai Pang ◽  
Bohong Gong ◽  
Chengmei Wei ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Boron Nitride ◽  
Mesoporous Silica ◽  
Epoxy Composite ◽  
Dielectric Materials ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Charge Movement ◽  
Boron Nitride Nanosheet

Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here, a multifunctional epoxy composite is fulfilled by incorporation of boron nitride nanosheets (BNNSs) and mesoporous silica coated multi-walled carbon nanotubes (MWCNTs@mSiO2). Owing to the effective establishment of continuous thermal conductive network, the obtained BNNSs/MWCNTs@mSiO2/epoxy composite exhibits a high thermal conductivity of 0.68 W m−1 K−1, which is 187% higher than that of epoxy matrix. In addition, the introducing of mesoporous silica dielectric layer can screen charge movement to shut off leakage current between MWCNTs, which imparts BNNSs/MWCNTs@mSiO2/epoxy composite with high dielectric constant (8.10) and low dielectric loss (<0.01) simultaneously. It is believed that the BNNSs/MWCNTs@mSiO2/epoxy composites with admirable features have potential applications in modern electronics.

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Surface Modified ◽  
Enhanced Thermal Conductivity ◽  
Electrical Insulation Properties

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.

Boron nitride nanosheet nanofluids for enhanced thermal conductivity

Nanoscale ◽  
2018 ◽  
Vol 10 (27) ◽  
pp. 13004-13010 ◽  
Author(s):  
Xiao Hou ◽  
Mengjie Wang ◽  
Li Fu ◽  
Yapeng Chen ◽  
Nan Jiang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Boron Nitride Nanosheet ◽  
Water Based ◽  
Enhanced Thermal Conductivity

In this work, we focus on the preparation of water-based high thermal conductivity fluids by adding BNNSs.

Fabrication of Highly Oriented Hexagonal Boron Nitride Nanosheet/Elastomer Nanocomposites with High Thermal Conductivity

Small ◽  
2014 ◽  
Vol 11 (14) ◽  
pp. 1655-1659 ◽  
Author(s):  
Zhiqiao Kuang ◽  
Yulong Chen ◽  
Yonglai Lu ◽  
Li Liu ◽  
Shui Hu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Boron Nitride Nanosheet

Development of Epoxy/BN Composites with High Thermal Conductivity for Metal-Core Printed Circuit Board (MCPCB)

2015 ◽  
Vol 749 ◽  
pp. 290-294
Author(s):  
Jae Hyun Choi ◽  
Bong Goo Choi ◽  
Min A. Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Conductivity ◽  
Printed Circuit Board ◽  
Epoxy Composite ◽  
High Thermal Conductivity ◽  
Circuit Board ◽  
Epoxy Composites ◽  
Hot Press ◽  
Metal Core ◽  
Printed Circuit ◽  
Press Method

The epoxy composites with high thermal conductivity for metal-core printed circuit board (MCPCB) can be prepared by varnish coating and a hot press method. Alumina filler of plate-like shape was used as primary micro-filler, while plate-like alumina filler, h-BN, a-BN and s-BN filler were used for blending into the plate-like alumina filler as the secondary filler. Results showed that the secondary fillers a-BN and s-BN loaded epoxy composites have higher thermal conductivity than alumina filler single-loaded composites. Also, BN filler has high thermal conductivity, but h-BN filled epoxy composite has lower thermal conductivity than alumina filled epoxy composite. The decrease of voids in epoxy composite are very important, and the filler shape and surface modification is also necessary to achieve high thermal conductivity in epoxy composite for MCPCB

High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

2012 ◽  
Vol 537 ◽  
pp. 70-75 ◽  
Author(s):  
Jung-Pyo Hong ◽  
Sung-Woon Yoon ◽  
Taeseon Hwang ◽  
Joon-Suk Oh ◽  
Seung-Chul Hong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Nitride ◽  
Bimodal Distribution ◽  
High Thermal Conductivity ◽  
Epoxy Composites

scholarly journals Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Zhengdong Wang ◽  
Guodong Meng ◽  
Liangliang Wang ◽  
Liliang Tian ◽  
Siyu Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties ◽  
Boron Nitride ◽  
Heat Dissipation ◽  
Breakdown Strength ◽  
Epoxy Composite ◽  
Dielectric Materials ◽  
Hydrogen Bond Interaction ◽  
Boron Nitride Nanosheets ◽  
Hybrid Fillers

AbstractDielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10−1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.

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