scholarly journals Leaching Kinetics of Arsenic Sulfide-Containing Materials by Copper Sulfate Solution

Metals ◽  
2019 ◽  
Vol 10 (1) ◽  
pp. 7
Author(s):  
Kirill A. Karimov ◽  
Denis A. Rogozhnikov ◽  
Evgeniy A. Kuzas ◽  
Andrei A. Shoppert

The overall decrease in the quality of mineral raw materials, combined with the use of arsenic-containing ores, results in large amounts of various intermediate products containing this highly toxic element. The use of hydrometallurgical technologies for these materials is complicated by the formation of multicomponent solutions and the difficulty of separating copper from arsenic. Previously, for the selective separation of As from copper–arsenic intermediates a leaching method in the presence of Cu(II) ions was proposed. This paper describes the investigation of the kinetics of arsenic sulfide-containing materials leaching by copper sulfate solution. The cakes after leaching of arsenic trisulfide with a solution of copper sulfate were described using methods such as X-ray diffraction spectrometry (XRD), X-ray fluorescence spectrometry (XRF), scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy analysis (EDS). The effect of temperature (70–90 °C), the initial concentration of CuSO4 (0.23–0.28 M) and the time on the As recovery into the solution was studied. The process temperature has the greatest effect on the kinetics, while an increase in copper concentration from 0.23 to 0.28 M effects an increase in As transfer into solution from 93.2% to 97.8% for 120 min of leaching. However, the shrinking core model that best fits the kinetic data suggests that the process occurs by the intra-diffusion mode with the average activation energy of 44.9 kJ/mol. Using the time-to-a-given-fraction kinetics analysis, it was determined that the leaching mechanism does not change during the reaction. The semi-empirical expression describing the reaction rate under the studied conditions can be written as follows: 1/3ln(1 − X) + [(1 − X) − 1/3 − 1] = 4560000Cu3.61e−44900/RT t.

2021 ◽  
Vol 108 ◽  
pp. 103194
Author(s):  
Francisco R.A. Ziegler-Rivera ◽  
Blanca Prado ◽  
Alfonso Gastelum-strozzi ◽  
Jorge Márquez ◽  
Lucy Mora ◽  
...  

2019 ◽  
Vol 73 (11) ◽  
pp. 945-946
Author(s):  
Rachel Fischer ◽  
Marco Oetken

For aluminum, a new visualization method is presented in which copper is deposited electrochemically. The fingerprint on the aluminum (trace carrier) serves as an insulator as it prevents direct contact between electrolyte and aluminum. The decisive factor is the choice of an ammoniacal copper sulfate solution, which acts as a corrosion inhibitor due to the ammonia molecules. This enables uniform copper deposition on aluminum and thus the development of a clearly defined negative image.


2014 ◽  
Vol 84 (19) ◽  
pp. 2026-2035 ◽  
Author(s):  
Bing Li ◽  
Dapeng Li ◽  
Jiping Wang

A three-axis automatic robot was coupled with a precision liquid dispenser to deposit copper on fabrics to be used as the conductive layer for assembly of textile-based flexible microstrip patch antennas. Two reactive solutions, copper sulfate and sodium borohydride, were sequentially dispensed on fabrics and a conductive copper was produced in situ and in real time, through a simple redox mechanism. Driving pressure, the number of dispensing cycles, concentration and composition (i.e. the addition of a complexing agent sodium citrate to the copper sulfate solution) of the reactive solutions were studied to optimize the dispensing process in favor of rapid copper deposition. The electrical performance of the resulting copper deposit and its adhesion to the textile substrates were characterized. A copper coating of about 0.2 ohm/□ sheet resistance could be prepared in less than 1 hour under a 45 kPa driving pressure, at a 200 mm·s−1 moving speed, and within 60 dispensing cycles.


1983 ◽  
Vol 22 (8) ◽  
pp. 1184-1187 ◽  
Author(s):  
A. Musinu ◽  
G. Paschina ◽  
G. Piccaluga ◽  
M. Magini

1990 ◽  
Vol 204 ◽  
Author(s):  
R. J. Von Gutfeld ◽  
D. R. Vigliotti

ABSTRACTWe describe a two step method that uses thermally driven exchange plating to repair open copper circuits with local heating produced by ac Joule losses. The first step utilizes a non-acid copper sulfate solution to grow copper dendrites across the open circuit. This electrical “bridge” is then strengthened using additional plate-up in acid copper sulfate.


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