scholarly journals Study on Material Removal Model by Reciprocating Magnetorheological Polishing

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 413
Author(s):  
Rensheng Wang ◽  
Shichao Xiu ◽  
Cong Sun ◽  
Shanshan Li ◽  
Xiangna Kong
Keyword(s):  
Material Removal ◽  
Rotation Speed ◽  
Removal Rate ◽  
Flat Glass ◽  
Technological Parameters ◽  
Technical Parameters ◽  
Wheel Rotation ◽  
Material Removal Model ◽  
Eccentric Wheel ◽  
Magnetorheological Polishing

In this study, a new reciprocating magnetorheological polishing (RMRP) method for a flat workpiece was proposed. Based on the RMRP principle and Preston equation, the material removal rate (MRR) model of the RMRP as well as its normal polishing pressure model was established. On this basis, the effects of different technological parameters including workpiece rotation speed, eccentric wheel rotation speed and eccentricity on the MRR of the workpiece were investigated. The K9 optical flat glass was polished with the RMRP setup to verify the MRR model. The experimental results showed that the effect of workpiece rotation speed on the MRR was much greater than that of eccentric wheel rotation speed and eccentricity, and the MRR increased from 0.0115 ± 0.0012 to 0.0443 ± 0.0015 μm/min as workpiece rotation speed rose. The optimum surface roughness reduced to Ra 50.8 ± 1.2 from initial Ra 330.3 ± 1.6 nm when the technical parameters of the workpiece rotation speed of 300 rpm, the eccentric wheel rotation speed of 20 rpm and the eccentricity of 0.02 m were applied. The average relative errors between the theoretical and experimental values were 16.77%, 10.59% and 7.38%, respectively, according to the effects of workpiece rotation speed, eccentric wheel rotation speed and eccentricity on MRR.

Analysis of the Main Parameters in the Chemical Mechanical Polishing Process

2011 ◽  
Vol 317-319 ◽  
pp. 29-33 ◽  
Author(s):  
Xiang Dong Yang ◽  
Xin Wei ◽  
Xiao Zhu Xie ◽  
Zhuo Chen ◽  
Wei Bo Zou
Keyword(s):  
Surface Quality ◽  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Rotation Speed ◽  
Removal Rate ◽  
Surface Damage ◽  
Mechanical Polishing ◽  
Technological Parameters ◽  
Polishing Pressure

This paper studies the chemical mechanical polishing (CMP) of the wafer's material such as stainless steel, monocrystalline silicon etc, and analyzes how the technological parameters’ impact on the final wafer’s surface material removal rate, surface quality and surface damage like the polishing pad’s speed and the wafer speed, polishing pressure and polishing time.The results show that: when the difference between the polishing pad's rotation speed and the wafer's rotation speed is small and their directions are the same , then the material removal rate of the wafer is larger.when the polishing pressure is selected between 5 to 6.5 kPa, the wafer surface's damage is smaller.The polishing time also play a very important role and affect the surface quality and surface damage of the wafer after polishing.

A Mechanistic Model of Material Removal in Magnetorheological Finishing (MRF)

2007 ◽  
Vol 359-360 ◽  
pp. 384-388
Author(s):  
Feng Jun Chen ◽  
Shao Hui Yin ◽  
Jian Wu Yu ◽  
Hitoshi Ohmori ◽  
Wei Min Lin ◽  
...  
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Reynolds Equation ◽  
Removal Rate ◽  
Mechanistic Model ◽  
Magnetorheological Fluid ◽  
Magnetorheological Finishing ◽  
Material Removal Model ◽  
Removal Model ◽  
The Magnetic Field

According to the sharp rheological characteristics of magnetorheological fluid in the magnetic field, the principle and mechanism of magnetorheological finishing is analyzed. Based on the Preston equation, the Reynolds equation and its boundary conditions, the two-dimensional material removal model is built and simulated. Furthermore, a series of MRF experiments are carried out, and the influence of the immersed depth and material kinds on material removal rate are clarified respectively. The experimental results are compared with the modeling results of material removal rate to confirm the mechanistic model validity.

Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect

2008 ◽  
Vol 53-54 ◽  
pp. 155-160 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Ai Jun Tang ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Abrasive Particles ◽  
Magnetorheological Effect ◽  
Material Removal Model ◽  
Mr Effect ◽  
Removal Model

A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented in this paper, and some experiments were conducted to prove its effectiveness and applicability. Under certain experimental condition, the material removal rate was improved by a factor of 20.84% as compared with the conventional polishing methods with dissociative abrasive particles, while the surface roughness of the workpiece was not obviously increased. Furthermore, the composite of the MR fluid was optimized to obtain the best polishing performance. On the basis of the experimental results, the material removal model of the new plate polishing technique was presented.

Parametric Study of Micro Machining Three Dimensional Microstructure with the Tiny-Grinding Wheel Based on the EMR Effect

2010 ◽  
Vol 447-448 ◽  
pp. 193-197
Author(s):  
Wei Qiang Gao ◽  
Qiu Sheng Yan ◽  
Yi Liu ◽  
Jia Bin Lu ◽  
Ling Ye Kong
Keyword(s):  
Magnetic Field ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Rotation Speed ◽  
Optical Glass ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Machining Time ◽  
Fluctuation Phenomenon

Electro-magneto-rheological (EMR) fluids, which exhibit Newtonian behavior in the absence of a magnetic field, are abruptly transformed within milliseconds into a Bingham plastic under an applied magnetic field, called the EMR effect. Based on this effect, the particle-dispersed EMR fluid is used as a special instantaneous bond to cohere abrasive particles and magnetic particles together so as to form a dynamical, flexible tiny-grinding wheel to machine micro-groove on the surface of optical glass. Experiments were conducted to reveal the effects of process parameters, such as the feed rate of the horizontal worktable, feeding of the Z axis, machining time and machining gap, on material removal rate of glass. The results indicate that the feed rate of the worktable at horizontal direction has less effect on material removal rate, which shows a fluctuation phenomenon within a certain range. The feed rate of the Z axis directly influences the machining gap and leads to a remarkable change on material removal rate. Larger material removal rate can be obtained when the feeding frequency of Z direction is one time per processing. With the increase of rotation speed of the tool, material removal rate increases firstly and decreases afterwards, and it gets the maximum value with the rotation speed of 4800 rev/min. The machining time is directly proportional to material removal amount, but inversely proportional to material removal rate. Furthermore, material removal rate decreases with the increase of the machining gap between the tool and the workpiece. On the basis of above, the machining mode with the tiny-grinding wheel based on the EMR effect is presented.

Material Removal Model and Experimental Verification for Abrasive Jet Precision Finishing with Wheel as Restraint

2006 ◽  
Vol 304-305 ◽  
pp. 555-559 ◽  
Author(s):  
Chang He Li ◽  
Guang Qi Cai ◽  
Shi Chao Xiu ◽  
Q. Li
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Results ◽  
Grinding Wheel ◽  
Rate Model ◽  
Material Removal Model ◽  
Material Removal Rate Model ◽  
Three Body ◽  
Precision Finishing

The material removal rate (MRR) model was investigated in abrasive jet precision finishing (AJPF) with wheel as restraint. When abrasive wore and workpiece surface micro-protrusion removed, the size ratio for characteristic particle size to minimum film thickness gradually diminishing, the abrasive machining from two-body lapping to three-body polishing transition in AJPF with grinding wheel as restraint. In the study, the material removal rate model was established according to machining mechanisms and machining modes from two-body to three-body process transition condition, and active number of particles in grinding zone were calculated and simulated. Experiments were performed in the plane grinder for material removal mechanism and academic models verification. It can be observed from experimental results that the surface morphology change dramatically to a grooved or micro-machined surface with all the grooves aligned in the sliding direction in two-body lapping mode. On the other hand, the surface is very different, consists of a random machining pits with very little sign of any directionality to the deformation in the three-body machining mode. Furthermore, the material removal rate model was found to give a good description of the experimental results.

Goodness Indicator and Technological Optimization of Honing

2013 ◽  
Vol 581 ◽  
pp. 261-265 ◽  
Author(s):  
Ottó Szabó
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Cutting Tools ◽  
Cutting Speed ◽  
Complex Surface ◽  
Technology Planning ◽  
Technological Parameters ◽  
Machining Processes ◽  
Important Field ◽  
Abrasive Cutting

Optimisation of technological processes is an important field of research of machining processes. Honing process, its aim and results are affected more factors. Effectiveness is expressed by the following parameters: accuracy, surface roughness, complex surface quality (integrity),material removal rate, costs and productivity of the process. Developed method helps the technology planning and with the introduced new goodness indicator, investigates and corrects it. Optimization and minimization of costs can be ensured at given technological circumstances and technological parameters. With adjustment of the pressure (p) and the cutting speed (vc) economy of the process can be increased in the factory. Developed method can be applied for machining by other abrasive cutting tools. The paper summarizes new results of this theoretical and experimental research.

Experimental Research on Polishing Spot of Bonnet Polishing

2007 ◽  
Vol 10-12 ◽  
pp. 385-389
Author(s):  
J.F. Song ◽  
Ying Xue Yao ◽  
D.G. Xie ◽  
Bo Gao
Keyword(s):  
Experimental Research ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Technological Parameters ◽  
Bonnet Polishing ◽  
Surface Configuration ◽  
Polishing Tool ◽  
Optical Manufacturing ◽  
Manufacturing Machine

A new optical manufacturing technology called bonnet polishing has been developed over last decade. During bonnet polishing, the puffed bonnet is flexible and self-reacting against the surface configuration of optical parts. So the same polishing tool can be used in machining the optical parts with different curvature. The mechanism of the bonnet polishing is described in this paper firstly. Since the optical workpiece has been polished in the “polishing spot”, the bonnet polishing experiments have been accomplished on the trial-manufacturing machine to study the effect of technological parameters on the size and shape of “polishing spot” and the material removal rate of optical workpiece. At last, the material removal rules of the bonnet polishing have been given in the paper.

Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry

2009 ◽  
Vol 69-70 ◽  
pp. 214-218
Author(s):  
Xue Feng Xu ◽  
H.T. Ma ◽  
B.X. Ma ◽  
Wei Peng
Keyword(s):  
Silicon Wafer ◽  
Material Removal Rate ◽  
Material Removal ◽  
Colloidal Silica ◽  
Rotation Speed ◽  
Removal Rate ◽  
Polymer Particle ◽  
Optimal Parameters ◽  
Polymer Particles ◽  
Mechanism Of Interaction

In order to increase the material removal rate of silicon wafer, composite abrasives slurry was used in CMP. The mechanism of interaction between silica abrasives and polymer particles was analyzed. Small silica abrasives were seen to attach onto the surface of the polymer particles. Composite abrasives slurry was obtained by adding polymer particles into single abrasive slurry. Three key parameters, the concentration of colloidal silica, the concentration of polymer particle and the speed of polishing, which influence the material removal rate of silicon wafer were analyzed by Taguchi method and the optimal parameters were obtained. Experimental results indicated that the maximum material removed rate of 353nm/min was obtained when optimal craft parameters of 5% colloidal silica, 3% polymer particle, 50rpm plate and carrier rotation speed were selected.

High Spindle Speed Wire Electrical Discharge Grinding Using Electrostatic Induction Feeding Method

2010 ◽  
Vol 447-448 ◽  
pp. 268-271 ◽  
Author(s):  
Yuna Yahagi ◽  
Tomohiro Koyano ◽  
Masanori Kunieda ◽  
Xiao Dong Yang
Keyword(s):  
Material Removal ◽  
High Speed ◽  
Rotation Speed ◽  
Removal Rate ◽  
Spindle Speed ◽  
Workpiece Surface ◽  
Feeding Method ◽  
Electrostatic Induction ◽  
Micro Holes ◽  
Machining Characteristics

This paper describes machining characteristics of high spindle speed WEDG using the electrostatic induction feeding method. In this method, non-contact electric feeding allows the workpiece rod to be rotated at a high speed of up to 50000rpm. Since the temperature rise on the workpiece surface is low, the material removal rate was two times higher and the surface roughness was also improved compared to the normal RC discharge circuit where the rotational speed was 1000rpm at the highest due to contact electric feeding using a brush. Furthermore, micro rods thus prepared were used as tool electrodes to machine micro-holes with the same rotation speed of 50000rpm. It was found that smaller gaps and better straightness can be obtained due to the high flushing efficiency at the high spindle speed.

Study of Local Material Removal Model of Bonnet Tool Polishing

2006 ◽  
Vol 304-305 ◽  
pp. 335-339 ◽  
Author(s):  
Da Gang Xie ◽  
B. Gao ◽  
Ying Xue Yao ◽  
Zhe Jun Yuan
Keyword(s):  
Material Removal ◽  
Dwell Time ◽  
Removal Rate ◽  
Rate Model ◽  
Polishing Process ◽  
Flexible Membrane ◽  
Local Material ◽  
Internal Fluid ◽  
Material Removal Model ◽  
Removal Model

Bonnet tool polishing is a novel aspherical polishing method. This paper describes a method to obtain the local removal rate for the polishing process using bulbous flexible membrane covered with a polishing pad and pressurized by an internal fluid. According to the principle of bonnet polishing and Preston equation, the local removal rate model was established. It is confirmed by the experiments that the local removal depth has a linear relation with the dwell time. Preston coefficient can be calculated from the experimental data. Finally the expression of the local removal rate in bonnet tool polishing is acquired semi-empirically.

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