scholarly journals Research Progress of Wood-Based Panels Made of Thermoplastics as Wood Adhesives

Polymers ◽  
2021 ◽  
Vol 14 (1) ◽  
pp. 98
Author(s):  
Xianfeng Mo ◽  
Xinhao Zhang ◽  
Lu Fang ◽  
Yu Zhang
Keyword(s):  
Production Efficiency ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Raw Material ◽  
Research Progress ◽  
Formaldehyde Resin ◽  
Wood Adhesives ◽  
Bonding Structure ◽  
Existing Problems ◽  
Thermoplastic Resins

When thermoplastic resins such as polyethylene (PE) and polypropylene (PP) are selected as wood adhesives to bond wood particles (fibers, chips, veneers) by using the hot-pressing technique, the formaldehyde emission issue that has long existed in the wood-based panel industry can be effectively solved. In this study, in general, thermoplastic-bonded wood-based panels presented relatively higher mechanical properties and better water resistance and machinability than the conventional urea–formaldehyde resin-bonded wood-based panels. However, the bonding structure of the wood and thermoplastic materials was unstable at high temperatures. Compared with the wood–plastic composites manufactured by the extruding or injection molding methods, thermoplastic-bonded wood-based panels have the advantages of larger size, a wider raw material range and higher production efficiency. The processing technology, bonding mechanism and the performance of thermoplastic-bonded wood-based panels are comprehensively summarized and reviewed in this paper. Meanwhile, the existing problems of this new kind of panel and their future development trends are also highlighted, which can provide the wood industry with foundations and guidelines for using thermoplastics as environmentally friendly adhesives and effectively solving indoor pollution problems.

Effect of Mineral Composite Fillers on Properties of Man-Made Plywood

2010 ◽  
Vol 178 ◽  
pp. 97-102 ◽  
Author(s):  
Hong Xia Shao ◽  
Qing Guo Tang ◽  
Jin Sheng Liang ◽  
Yan Ding
Keyword(s):  
Indoor Environment ◽  
Composite Powder ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Raw Material ◽  
National Standard ◽  
Formaldehyde Resin ◽  
Powder Filler ◽  
Modified Attapulgite ◽  
Mineral Powder

Attapulgite mineral powder as raw material, through surface modification and composite of various mineral processing, the effect of modifier dosage, composite powder filler ratio on the mechanical properties and formaldehyde emission of the plywood which is bonded by filled urea-formaldehyde resin were investigated. The results show that under the conditions of the plywood bonding strength to meet the national standard, modified attapulgite make the plywood formaldehyde emission decrease from 4.5 to 2.1 mg/L, the composite material can make the formaldehyde emission decreased to 1.6 mg/L, which can improved the indoor environment and the grade of plywood.

scholarly journals Improving Thermal Conductivity Coefficient in Oriented Strand Lumber (OSL) Using Sepiolite

Nanomaterials ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 599 ◽  
Author(s):  
Hamid R. Taghiyari ◽  
Abolfazl Soltani ◽  
Ayoub Esmailpour ◽  
Vahid Hassani ◽  
Hamed Gholipour ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Core Temperature ◽  
Thermal Conductivity Coefficient ◽  
Urea Formaldehyde ◽  
Wood Products ◽  
Raw Material ◽  
Formaldehyde Resin ◽  
The Core ◽  
Uf Resin ◽  
Hardness Values

An issue in engineered wood products, like oriented strand lumber (OSL), is the low thermal conductivity coefficient of raw material, preventing the fast transfer of heat into the core of composite mats. The aim of this paper is to investigate the effect of sepiolite at nanoscale with aspect ratio of 1:15, in mixture with urea-formaldehyde resin (UF), and its effect on thermal conductivity coefficient of the final panel. Sepiolite was mixed with UF resin for 20 min prior to being sprayed onto wood strips in a rotary drum. Ten percent of sepiolite was mixed with the resin, based on the dry weight of UF resin. OSL panels with two resin contents, namely 8% and 10%, were manufactured. Temperature was measured at the core section of the mat at 5-second intervals, using a digital thermometer. The thermal conductivity coefficient of OSL specimens was calculated based on Fourier’s Law for heat conduction. With regard to the fact that an improved thermal conductivity would ultimately be translated into a more effective polymerization of the resin, hardness of the panel was measured, at different depths of penetration of the Janka ball, to find out how the improved conductivity affected the hardness of the produced composite panels. The measurement of core temperature in OSL panels revealed that sepiolite-treated panels with 10% resin content had a higher core temperature in comparison to the ones containing 8% resin. Furthermore, it was revealed that the addition of sepiolite increased thermal conductivity in OSL panels made with 8% and 10% resin contents, by 36% and 40%, respectively. The addition of sepiolite significantly increased hardness values in all penetration depths. Hardness increased as sepiolite content increased. Considering the fact that the amount of sepiolite content was very low, and therefore it could not physically impact hardness increase, the significant increase in hardness values was attributed to the improvement in the thermal conductivity of panels and subsequent, more complete, curing of resin.

The Impact of Different Dosage of Additives on the UF Resin Used in Plywood

2011 ◽  
Vol 197-198 ◽  
pp. 147-150 ◽  
Author(s):  
Wei Wang ◽  
Li Bin Zhu ◽  
Ji You Gu ◽  
Xiang Li Weng ◽  
Hai Yan Tan
Keyword(s):  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Synthetic Process ◽  
Resin Adhesive ◽  
Environmental Friendly ◽  
Uf Resin ◽  
Comprehensive Performance ◽  
The Impact

Through the study of the effects of different dosage of additives on the properties of urea formaldehyde resin adhesive prepared at low mole ratio of formaldehyde/urea, optimize the synthetic process of the UF resin which is used at the E0 grade plywood. The results showed that the product synthesized under the following condition: the mole ratio of formaldehyde/urea is 0.99:1, the dosage of the specific additive is 1.0% and that of melamine is 3-4%, had a good comprehensive performance and the formaldehyde emission of the plywood meets the E0 grade which is environmental-friendly.

scholarly journals Reduction of formaldehyde emission from urea-formaldehyde resin with a small quantity of graphene oxide

RSC Advances ◽  
2021 ◽  
Vol 11 (52) ◽  
pp. 32830-32836
Author(s):  
Kazuki Saito ◽  
Yasushi Hirabayashi ◽  
Shinya Yamanaka
Keyword(s):  
Graphene Oxide ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Uf Resin

This is the first experiment to demonstrate that GO effectively prevents formaldehyde emission from UF resin.

scholarly journals THE SOY FLOUR AS AN EXTENDER FOR UF AND MUF ADHESIVES IN BIRCH PLYWOOD PRODUCTION

Wood Research ◽  
2021 ◽  
Vol 66 (6) ◽  
pp. 1015-1031
Author(s):  
JAKUB KAWALERCZYK ◽  
JOANNA SIUDA ◽  
DOROTA DZIURKA ◽  
RADOSŁAW MIRSKI ◽  
MAGDALENA WOŹNIAK ◽  
...  
Keyword(s):  
Chemical Interaction ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Solid Content ◽  
Urea Formaldehyde Resin ◽  
Soy Flour ◽  
Formaldehyde Resin ◽  
Gel Time ◽  
Major Disadvantage ◽  
Muf Adhesives

Formaldehyde emission still remains a major disadvantage of widely applied formaldehyde-containing amino resins such as UF (urea-formaldehyde) resin and MUF (melamine-urea-formaldehyde) resin. The compositions of adhesives for plywood manufacturing have to contain a proper extenders in order to adjust their viscosity. Thus, the aim of the study was to investigate the effect of protein-rich soy flour (SF) as the extender for adhesives. The composition of flours and their ability to absorb the formaldehyde were determined. Properties of liquid resins such as gel time, viscosity, pH and solid content were investigated. The possible chemical interaction between the extenders and resins were assessed with the use of FTIR spectroscopy. Plywood panels manufactured using UF and MUF adhesives with the soy flour introduced as the extender in various concentrations were tested in terms of shear strength and formaldehyde release. Studies have shown that soy flour has a favorable composition and formaldehyde-scavenging ability. The addition of SF affected resins properties such as viscosity and gel time but showed no influence on their pH and solid content. FTIR analysis has not explained the chemical interaction between resin and extender. The application of soy flour in the concentration of 15% for UF resin and 10% for MUF resin allowed to produce plywood characterized by improved bonding quality and decreased formaldehyde emission.

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