scholarly journals Improving Thermal Conductivity Coefficient in Oriented Strand Lumber (OSL) Using Sepiolite

Nanomaterials ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 599 ◽  
Author(s):  
Hamid R. Taghiyari ◽  
Abolfazl Soltani ◽  
Ayoub Esmailpour ◽  
Vahid Hassani ◽  
Hamed Gholipour ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Core Temperature ◽  
Thermal Conductivity Coefficient ◽  
Urea Formaldehyde ◽  
Wood Products ◽  
Raw Material ◽  
Formaldehyde Resin ◽  
The Core ◽  
Uf Resin ◽  
Hardness Values

An issue in engineered wood products, like oriented strand lumber (OSL), is the low thermal conductivity coefficient of raw material, preventing the fast transfer of heat into the core of composite mats. The aim of this paper is to investigate the effect of sepiolite at nanoscale with aspect ratio of 1:15, in mixture with urea-formaldehyde resin (UF), and its effect on thermal conductivity coefficient of the final panel. Sepiolite was mixed with UF resin for 20 min prior to being sprayed onto wood strips in a rotary drum. Ten percent of sepiolite was mixed with the resin, based on the dry weight of UF resin. OSL panels with two resin contents, namely 8% and 10%, were manufactured. Temperature was measured at the core section of the mat at 5-second intervals, using a digital thermometer. The thermal conductivity coefficient of OSL specimens was calculated based on Fourier’s Law for heat conduction. With regard to the fact that an improved thermal conductivity would ultimately be translated into a more effective polymerization of the resin, hardness of the panel was measured, at different depths of penetration of the Janka ball, to find out how the improved conductivity affected the hardness of the produced composite panels. The measurement of core temperature in OSL panels revealed that sepiolite-treated panels with 10% resin content had a higher core temperature in comparison to the ones containing 8% resin. Furthermore, it was revealed that the addition of sepiolite increased thermal conductivity in OSL panels made with 8% and 10% resin contents, by 36% and 40%, respectively. The addition of sepiolite significantly increased hardness values in all penetration depths. Hardness increased as sepiolite content increased. Considering the fact that the amount of sepiolite content was very low, and therefore it could not physically impact hardness increase, the significant increase in hardness values was attributed to the improvement in the thermal conductivity of panels and subsequent, more complete, curing of resin.

scholarly journals Process modification involving strong-acid step in urea-formaldehyde resin preparation

2020 ◽  
Vol 16 (2) ◽  
pp. 212-217
Author(s):  
Dicky Dermawan ◽  
Lucky William Kusnadi ◽  
Jemmy Lesmana
Keyword(s):  
Urea Formaldehyde ◽  
Gelation Time ◽  
Strong Acid ◽  
Raw Material ◽  
Molar Ratio ◽  
Formaldehyde Resin ◽  
Formaldehyde Concentration ◽  
Formaldehyde Content ◽  
Process Modification ◽  
Uf Resin

Urea-formaldehyde (UF) resin adhesive for wood-based panel industries are commonly manufactured using conventional alkaline-acid process. This paper reports a process modification of a conventional UF resin preparation by incorporating a strong-acid step, involving simultaneous methylolation and condensation reactions at very low pH at the beginning of the processing step. The experiment showed that this additional step should be carried out at short duration and at high enough temperature in order to avoid gelation or separation problems. In order to control temperature rise caused by the exothermic nature of the reactions, the modified process requires a higher initial formaldehyde-to-urea (F/U) molar ratio compared to the original. For the same reason, the first urea should be fed incrementally to ensure high F/U ratio at any time during the strong acid step. Using regular formalin concentration as raw material at the same F/U molar ratio, the modified resin showed lower free formaldehyde content thus have lower reactivity in comparison to those of the original. However, when the same procedure was applied using higher formaldehyde concentration at higher solid content, the produced resin showed comparable free formaldehyde content and shorter gelation time. Application test for making plywood showed that the modified process gave a very significant improvement in both the internal bonding strength and formaldehyde emission.

scholarly journals Properties of High Density Fiberboard Mixed with Poplar Bark

2020 ◽  
Vol 17 (12) ◽  
pp. 1286-1293
Author(s):  
Zoltán PÁSZTORY ◽  
Katalin HALÁSZ ◽  
Zoltán BÖRCSÖK ◽  
Suthon SRIVARO
Keyword(s):  
Mechanical Properties ◽  
Health Risk ◽  
Indoor Air ◽  
Color Change ◽  
Urea Formaldehyde ◽  
Chemical Compounds ◽  
Dry Weight ◽  
Wood Products ◽  
Raw Material ◽  
Formaldehyde Resin

Formaldehyde in the indoor air is one of the chemicals which can cause health risk; therefore, researchers have strived to reduce formaldehyde emissions from different wood products. There are many chemical compounds in bark, including tannins, which can react with formaldehyde. The aim of this study was to reduce the formaldehyde emissions from HDF by mixing poplar bark powder into the raw material. 2, 4, 6, and 8 % (based on dry weight) Populus×euramericana bark was mixed with fibers, and HDF panels were manufactured with urea-formaldehyde resin. Mechanical properties, color change, and formaldehyde release were measured. Contrary to expectations, the mixed bark did not reduce formaldehyde emissions, but the mechanical properties deteriorated due to the bark powder. Formaldehyde emissions were reduced only in the case of 2 % added bark; in cases of 4, 6, and 8 %, the emissions increased.

scholarly journals Calcium carbonate modified urea–formaldehyde resin adhesive for strength enhanced medium density fiberboard production

RSC Advances ◽  
2021 ◽  
Vol 11 (40) ◽  
pp. 25010-25017
Author(s):  
Li Lu ◽  
Yan Wang ◽  
Tianhua Li ◽  
Supeng Wang ◽  
Shoulu Yang ◽  
...  
Keyword(s):  
Calcium Carbonate ◽  
Urea Formaldehyde ◽  
Medium Density Fiberboard ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Medium Density ◽  
Ionic Bond ◽  
Resin Adhesive ◽  
Uf Resin ◽  
Modified Urea

Reactions between CaCO3 and CH2O2 during polycondensation of UF resin produce Ca2+. Ionic bond complexation binds Ca2+ with UF resin. The UF resin crystalline percentage decreases from 26.86% to 22.71%. IB strength of resin bonded fiberboard increases from 0.75 to 0.94 MPa.

Effect of wood acidity and catalyst on UF resin gel time

Holzforschung ◽  
2004 ◽  
Vol 58 (4) ◽  
pp. 408-412 ◽  
Author(s):  
C. Xing ◽  
S.Y. Zhang ◽  
J. Deng
Keyword(s):  
Ph Value ◽  
Raw Materials ◽  
Urea Formaldehyde ◽  
Acid Catalyst ◽  
Buffering Capacity ◽  
Raw Material ◽  
Gel Time ◽  
Uf Resin ◽  
Effects Of Ph ◽  
Fiber Materials

Abstract Knowledge of pH and buffering capacity of raw fiber materials is important for understanding the effects of raw material on the curing rate of urea formaldehyde (UF) resin, used for panel manufacturing, especially with some less-desirable wood materials such as bark, top, and commercial thinnings. The effects of pH and buffering capacity as well as catalyst content on the gel time of UF resin were investigated. The results obtained from this study indicate that bark has a lower pH value as well as higher acid and alkaline buffering capacities than wood of the same species due to their extractives. The pH values of the raw fiber materials studied decrease with increased absolute and relative acid buffering capacity due to the increased absolute acidity mass in the solution. At lower levels of added catalyst, the effect of raw material pH on UF resin gel time is significant, while it is insignificant at higher catalyst contents. This may be due to the acidity of wood, which is the main acid catalyst source of the mixture at lower levels of added catalyst, while at higher levels, catalyst is the main source. With higher catalyst contents, all studied raw materials mixed with UF resin result in a longer gel time than does UF resin alone.

The Effect Of Weight Fraction And Size On The Properties Of Sago Particles Urea Formaldehyde Particleboard

2015 ◽  
Vol 73 (1) ◽  
Author(s):  
Tay Chen Chiang ◽  
Sinin Hamdan ◽  
Mohd Shahril Osman
Keyword(s):  
Urea Formaldehyde ◽  
Great Influence ◽  
Single Layer ◽  
Weight Fraction ◽  
Solid Content ◽  
Wood Products ◽  
Density Level ◽  
Testing Method ◽  
Uf Resin ◽  
Low Emission

We live in a world where wood products are hard to ignore. The sheer flexibility in the number of applications where the wood is used means that it is one of the most sought resources in the world. The wood products industry faces challenges in promoting sustainable management of forest resources. Composite materials have advantage of having an optimized performance, minimized weight and volume, cost effectiveness, chemical resistance and resistance to biodegradation. The research in this paper is focused on sago particles with adhesive of low emission urea formaldehyde (UF) resin 51.6% solid content. The fabrication and testing method are based on JIS A 5908 standard. A single-layer particleboard by using the sago particles has been established at targeted density level 600kg/m3. Particles with weight fractions of 90%, 85%, 80%, 75% and 70% were used in the fabrication of sago composite boards. The results of the test demonstrated that the samples with different weight fraction and size have great influence on the mechanical properties like: MOR, screw test and internal bonding. The findings had demonstrated that the level of weight fraction and size had affects the performance of a board. At the next stage of the research the comparison between sago and wood particleboard will be carried out to identify the feasibility of these materials in the industrial application.

scholarly journals Preparation and Optimization of Waterborne Acrylic Core Microcapsules for Waterborne Wood Coatings and Comparison with Epoxy Resin Core

Polymers ◽  
2020 ◽  
Vol 12 (10) ◽  
pp. 2366 ◽  
Author(s):  
Xiaoxing Yan ◽  
Yu Tao ◽  
Xingyu Qian
Keyword(s):  
In Situ Polymerization ◽  
Urea Formaldehyde ◽  
Paint Film ◽  
Bath Temperature ◽  
Water Bath ◽  
Core Material ◽  
Wall Material ◽  
Formaldehyde Resin ◽  
The Core ◽  
Resin Core

Microcapsules were prepared by in situ polymerization with urea formaldehyde resin as the wall material and Dulux waterborne acrylic acid as the core material. The effects of the core–wall ratio, water bath temperature and depositing time on the morphology, particle size, yield and encapsulation ratio of microcapsules were investigated by orthogonal experiment of three factors and two levels. The results showed that the core–wall ratio had the greatest influence on the performance of microcapsules. When the core–wall ratio was 0.58:1, the water bath temperature was 70 °C, and the depositing time was 5 d, the microcapsule performance was the best. With the increase in depositing time, the yield of microcapsule particles increased gradually, and the microcapsules appeared to show an adhesive phenomenon. However, the long-term depositing time did not lead to complete deposition and agglomeration of microcapsules. When 10.0% concentration of the waterborne acrylic microcapsules with 0.58:1 of core–wall ratio was added to the coatings, the mechanical and optical properties of the coatings did not decrease significantly, but the elongation at break increased significantly. Therefore, this study offers a new prospect for using waterborne acrylic microcapsules to improve the toughness of waterborne paint film which can be cured at room temperature on a wood surface.

The Impact of Different Dosage of Additives on the UF Resin Used in Plywood

2011 ◽  
Vol 197-198 ◽  
pp. 147-150 ◽  
Author(s):  
Wei Wang ◽  
Li Bin Zhu ◽  
Ji You Gu ◽  
Xiang Li Weng ◽  
Hai Yan Tan
Keyword(s):  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Synthetic Process ◽  
Resin Adhesive ◽  
Environmental Friendly ◽  
Uf Resin ◽  
Comprehensive Performance ◽  
The Impact

Through the study of the effects of different dosage of additives on the properties of urea formaldehyde resin adhesive prepared at low mole ratio of formaldehyde/urea, optimize the synthetic process of the UF resin which is used at the E0 grade plywood. The results showed that the product synthesized under the following condition: the mole ratio of formaldehyde/urea is 0.99:1, the dosage of the specific additive is 1.0% and that of melamine is 3-4%, had a good comprehensive performance and the formaldehyde emission of the plywood meets the E0 grade which is environmental-friendly.

Thermophysical and Radiative Properties of Conductive Biopolymer Composite

2012 ◽  
Vol 714 ◽  
pp. 115-122 ◽  
Author(s):  
Zied Antar ◽  
Hervé Noel ◽  
Jean François Feller ◽  
Patrick Glouannec ◽  
Khaled Elleuch
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Thermal Conductivity Coefficient ◽  
Environmental Concern ◽  
Polymeric Materials ◽  
Raw Material ◽  
Radiative Properties ◽  
Solar Collectors ◽  
Promising Alternative ◽  
Significant Cost Reduction

Usual plate solar collectors, based on a metal absorber (Cu, Al) selectively coated are technologically very sophisticated, expensive to produce and they are great consumer of fossil raw material. Polymeric materials are considered as a promising alternative for many interesting properties; easy moldability, corrosion resistance, they also offer a significant cost-reduction for solar thermal collectors, and a mass production may thus benefit to a broader utilization of solar energy. Most drawbacks of polymers are their low thermal properties; essentially thermal conductivity coefficient may strongly affect the solar absorber efficiency and deteriorate the collector performance. Polymers used in solar collectors are mainly petroleum-derivative product and mass use of them is not a response to environmental concern. That is why the laboratory chose to explore the potentialities of bio-polymers for the production of absorbers. This group of material presents the same properties as ordinary polymers. It is on the other hand possible to modify the thermal properties of the basic matrix by the addition of loads, such as carbon black, graphite or carbon nanotubes. The thermal performance of a solar collector is closely related to the thermal properties of the absorber. Within this framework, many measurements are necessary, more particularly the conductivity, but also emissivity and absorptivity to solar radiation. The aim of this paper is to study the thermal properties of the PLA bio-polymer charged of exfoliated graphite and/or CNT. Thereafter, the total hemispherical absorptivity, an estimation of the total hemispherical emissivity and the thermal conductivity coefficient were measured for different load rates, we will conclude on the interest and the potentialities of tested materials.

scholarly journals Reduction of formaldehyde emission from urea-formaldehyde resin with a small quantity of graphene oxide

RSC Advances ◽  
2021 ◽  
Vol 11 (52) ◽  
pp. 32830-32836
Author(s):  
Kazuki Saito ◽  
Yasushi Hirabayashi ◽  
Shinya Yamanaka
Keyword(s):  
Graphene Oxide ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Urea Formaldehyde Resin ◽  
Formaldehyde Resin ◽  
Uf Resin

This is the first experiment to demonstrate that GO effectively prevents formaldehyde emission from UF resin.

scholarly journals Research Progress of Wood-Based Panels Made of Thermoplastics as Wood Adhesives

Polymers ◽  
2021 ◽  
Vol 14 (1) ◽  
pp. 98
Author(s):  
Xianfeng Mo ◽  
Xinhao Zhang ◽  
Lu Fang ◽  
Yu Zhang
Keyword(s):  
Production Efficiency ◽  
Urea Formaldehyde ◽  
Formaldehyde Emission ◽  
Raw Material ◽  
Research Progress ◽  
Formaldehyde Resin ◽  
Wood Adhesives ◽  
Bonding Structure ◽  
Existing Problems ◽  
Thermoplastic Resins

When thermoplastic resins such as polyethylene (PE) and polypropylene (PP) are selected as wood adhesives to bond wood particles (fibers, chips, veneers) by using the hot-pressing technique, the formaldehyde emission issue that has long existed in the wood-based panel industry can be effectively solved. In this study, in general, thermoplastic-bonded wood-based panels presented relatively higher mechanical properties and better water resistance and machinability than the conventional urea–formaldehyde resin-bonded wood-based panels. However, the bonding structure of the wood and thermoplastic materials was unstable at high temperatures. Compared with the wood–plastic composites manufactured by the extruding or injection molding methods, thermoplastic-bonded wood-based panels have the advantages of larger size, a wider raw material range and higher production efficiency. The processing technology, bonding mechanism and the performance of thermoplastic-bonded wood-based panels are comprehensively summarized and reviewed in this paper. Meanwhile, the existing problems of this new kind of panel and their future development trends are also highlighted, which can provide the wood industry with foundations and guidelines for using thermoplastics as environmentally friendly adhesives and effectively solving indoor pollution problems.

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