scholarly journals High Precision Human Skin Temperature Fluctuations Measuring Instrument

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4101
Author(s):  
Nikolai B. Suvorov ◽  
Alexander V. Belov ◽  
Konstantin G. Kuliabin ◽  
Aleksei A. Anisimov ◽  
Timofei V. Sergeev ◽  
...  

This paper describes the experimental results of testing a prototype of a high precision human skin rapid temperature fluctuations measuring instrument. Based on the author’s work, an original circuit solution on a miniature semiconductor diode sensor has been designed. The proposed circuitry provides operation in the full voltage range with automatic setting and holding the operating point, as well as the necessary slope of the conversion coefficient (up to 2300 mV/°C), which makes it possible to register fast temperature oscillations from the surface of the human body and other biological objects. Simulation results in the Microcap 12 software and laboratory tests have confirmed all declared design specifications: temperature resolution of 0.01 °C, transducer thermal time constant of 0.05 s. An original thermostat and an experimental setup for the simultaneous registration of the electrocardiogram, pulse wave signals from the Biopac polygraph MP36 and a signal of temperature oscillations from the prototype thermometer have been designed for further investigations. The preliminary test results indicates that using the designed measuring instrument gives a possibility to provide an in-depth study of the relationship between micro- and macro-blood circulations manifested in skin temperature fluctuations.

Author(s):  
Nikolai Suvorov ◽  
Alexander Belov ◽  
Timofey Sergeev ◽  
Konstantin Kuliabin ◽  
Aleksei Anisimov

2019 ◽  
Vol 1 (3) ◽  
pp. 1-4
Author(s):  
Zaina Norhallis Zainol ◽  
Masine Md. Tap ◽  
Haslinda Mohamed Kamar

Thermal comfort is the human subject perceive satisfaction to the work environment. The thermal comfort need to be achieve towards productive working environment. The comfort level of the subject is affected by the human skin temperature. To assess the skin temperature with the sorrounding by conducting human experiment in the climatic chamber. It is rigorous and complex experiment.This study was developed to predict human skin temperature in comfort level with the finite element method and the bioheat equation. The bioheat equation is a consideration of metabolic heat generation and the blood perfusion to solve heat transfer of the living tissue. It is to determine the skin temperature focussing at the human arm. From the study, it is found that the predicted skin temperature value were in well agreement with the experimental results. The percentage error insignificant with acceptable error of 1.05%.


2008 ◽  
Vol 47 (27) ◽  
pp. 4895 ◽  
Author(s):  
Sook Voon Yap ◽  
Robert M. Ranson ◽  
Wayne M. Cranton ◽  
Demosthenes Koutsogeorgis

2019 ◽  
Vol 23 (3) ◽  
pp. 1141-1150 ◽  
Author(s):  
Weixing Liu ◽  
Dagong Jia ◽  
Jing Zhao ◽  
Hongxia Zhang ◽  
Tiegen Liu ◽  
...  

2016 ◽  
Vol 2016 (1) ◽  
pp. 000267-000271
Author(s):  
V.D. Heydemann ◽  
S. Lauer ◽  
W. Decker ◽  
J. Slater ◽  
J. Mazurowski

Abstract Most embedded components manufactured today are made either by photolithography to pattern inner board layer materials or by placing discrete components on an inner board layer followed by planarization with a potting compound. These traditional methods produce devices with poor tolerance due to inherent variances in the photolithography and etch process, and parasitic capacitance of long traces. Discrete embedded components increase thickness and weight and suffer from reduced reliability caused by the planarization process. This paper introduces an alternative patterning method to integrate in-line embedded passive and active components without photolithography processing. This additive printing process uses high precision, high feature density shadow masks with micrometer-level registration. Devices are built layer by layer using off-the-shelf bulk materials instead of inks to produce tight tolerance passive and active components that can be integrated into traditional PCB and wafer-level processing. Examples of such additively manufactured devices for both DC and RF applications and preliminary test data are presented in this paper.


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