Signal integrity analysis of high speed and high density PCB design based on FPGA

2010 ◽  
Vol 30 (10) ◽  
pp. 2853-2856 ◽  
Author(s):  
Gang HAN ◽  
Zheng GENG
2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan

2013 ◽  
Vol 662 ◽  
pp. 846-850
Author(s):  
Jiang Hong ◽  
Zhi Wei Tang ◽  
Long Hu Chen

With the increase of integrated circuit switch rate and PCB density, signal integrity has become one of the problems must be concerned in high-speed PCB design. How to fully consider EMC (Electromagnetic compatibility) and take effective measures has been a key factor of a system design. Based on the consideration of EMC, the author put forward some aspects in designing high-speed PCB. The optimized PCB design rules have steady and credible performance, the development period is shortened and the cost is reduced. The conclusions drawn from the dissertation are helpful to the design of high-speed PCB.


2015 ◽  
Vol 57 (5) ◽  
pp. 1226-1234 ◽  
Author(s):  
Sebastian Muller ◽  
Torsten Reuschel ◽  
Renato Rimolo-Donadio ◽  
Young H. Kwark ◽  
Heinz-Dietrich Bruns ◽  
...  

2013 ◽  
Vol 760-762 ◽  
pp. 320-324
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang

High-speed signal connector has become a key factor of the signal transmission quality in telecommunications and data communications system. Signal integrity of connector is an inevitable problem. This paper based on the theory of differential transmission lines and Multimode S-Parameters, analyzed the USB3.0 connector signal integrity. And use 3D simulation software CST to build model and analyze the relationship of signal integrity and connectors geometry.


ETRI Journal ◽  
2019 ◽  
Vol 41 (5) ◽  
pp. 670-683 ◽  
Author(s):  
Hyukje Kwon ◽  
Wonok Kwon ◽  
Myeong‐Hoon Oh ◽  
Hagyoung Kim

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