Effects of Electrostatic-Discharge on GaN-Based High Voltage Light-Emitting Diode

2014 ◽  
Vol 43 (8) ◽  
pp. 823003
Author(s):  
韩禹 HAN Yu ◽  
郭伟玲 GUO Wei-ling ◽  
樊星 FAN Xing ◽  
俞鑫 YU Xin ◽  
白俊雪 BAI Jun-xue
2015 ◽  
Vol 2015 ◽  
pp. 1-4 ◽  
Author(s):  
W. Wang ◽  
Y. Cai ◽  
Y. B. Zhang ◽  
H. J. Huang ◽  
W. Huang ◽  
...  

A parallel and series network structure was introduced into the design of the high-voltage single-chip (HV-SC) light-emitting diode to inhibit the effect of current crowding and to improve the yield. Using such a design, a6.6×5 mm2large area LED chip of 24 parallel stages was demonstrated with 3 W light output power (LOP) at the current of 500 mA. The forward voltage was measured to be 83 V with the same current injection, corresponding to 3.5 V for a single stage. The LED chip’s average thermal resistance was identified to be 0.28 K/W by using infrared thermography analysis.


2015 ◽  
Vol 15 (10) ◽  
pp. 7733-7737 ◽  
Author(s):  
Kwanjae Lee ◽  
Cheul-Ro Lee ◽  
Jin Soo Kim ◽  
Jin Hong Lee ◽  
Kee Young Lim ◽  
...  

We report the influences of a Si-doped graded superlattice (SiGSL) on the electrostatic discharge (ESD) characteristics of an InGaN/GaN light-emitting diode (LED). For comparison, a conventional InGaN/GaN LED (C-LED) was also investigated. The luminous efficacy for the SiGSL-LED was 2.68 times stronger than that for the C-LED at the injection current of 20 mA. The resistances estimated from current–voltage (I–V) characteristic curves were 16.5 and 8.8 Ω for the C-LED and SiGSL-LED, respectively. After the ESD treatment at the voltages of 4000 and 6000 V, there was no significant change in the I–V curves for the SiGSL-LED. Also, there was small variation in the I–V characteristics for the SiGSL-LED at the ESD voltage of 8000 V. However, the I–V curves for the C-LED were drastically degraded with increasing ESD voltage. While the light emission was not observed at the injection current of 20 mA from the C-LED sample after the ESD treatment, the emission spectra for the SiGSL-LED sample were clearly measured with the output powers of 10.47, 9.66, and 7.27 mW for the ESD voltages of 4000, 6000, and 8000 V respectively.


2014 ◽  
Vol 2014 ◽  
pp. 1-7 ◽  
Author(s):  
Yen-Chih Chiang ◽  
Bing-Cheng Lin ◽  
Kuo-Ju Chen ◽  
Sheng-Huan Chiu ◽  
Chien-Chung Lin ◽  
...  

The GaN-based high-voltage flip chip light-emitting diode (HVFC-LED) is designed and developed for the purpose of efficiency enhancement. In our design, the distributed Bragg reflector (DBR) is deposited at the bonded substrate to increase the light extraction. After the flip chip process, the general current-voltage characteristics between the flip chip sample and the traditional sample are essentially the same. With the help of great thermal conductive silicon substrate and the bottom DBR, the HVFC-LED is able to enhance the power by 37.1% when compared to the traditional high-voltage LEDs. The wall-plug efficiencies of the HVFC-LED also show good droop reduction as high as 9.9% compared to the traditional devices.


2012 ◽  
Vol 61 (13) ◽  
pp. 138502
Author(s):  
Cao Dong-Xing ◽  
Guo Zhi-You ◽  
Liang Fu-Bo ◽  
Yang Xiao-Dong ◽  
Huang Hong-Yong

2011 ◽  
Vol 31 (3) ◽  
pp. 0323004
Author(s):  
崔德胜 Cui Desheng ◽  
郭伟玲 Guo Weiling ◽  
崔碧峰 Cui Bifeng ◽  
丁天平 Ding Tianping ◽  
尹飞 Yin Fei ◽  
...  

2015 ◽  
Vol 36 (6) ◽  
pp. 692-698
Author(s):  
黄晓升 HUANG Xiao-sheng ◽  
黄华茂 HUANG Hua-mao ◽  
王洪 WANG Hong ◽  
李静 LI Jing

2018 ◽  
Vol 39 (2) ◽  
pp. 169-174
Author(s):  
张建华 ZHANG Jian-hua ◽  
陈章福 CHEN Zhang-fu ◽  
徐小雪 XU Xiao-xue ◽  
曹进 CAO Jin ◽  
杨连乔 YANG Lian-qiao

2013 ◽  
Vol 52 (8S) ◽  
pp. 08JG08 ◽  
Author(s):  
Wang Wang ◽  
Wei Wei ◽  
Cai Cai ◽  
Yong Yong ◽  
Huang Huang ◽  
...  

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