Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding.
In this talk, 3D Glass Solutions will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. In this talk we will discuss our latest results in wafer-level microfabrication of packaging solutions. We will present on our efforts for creating copper filled vias, surface metallization, and passivation. Furthermore, we will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, and (3) creating wave guiding structures in HDI packages.
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