Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000791-000810
Author(s):  
Jeb Flemming ◽  
Roger Cook ◽  
Kevin Dunn ◽  
James Gouker
Keyword(s):  
Cost Effective ◽  
High Density ◽  
Consumer Electronics ◽  
Liquid Crystal Polymers ◽  
Portable Devices ◽  
Signal Loss ◽  
Wafer Level ◽  
Advanced Packaging ◽  
And Performance ◽  
Optical Waveguiding

Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding. In this talk, 3D Glass Solutions will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. In this talk we will discuss our latest results in wafer-level microfabrication of packaging solutions. We will present on our efforts for creating copper filled vias, surface metallization, and passivation. Furthermore, we will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, and (3) creating wave guiding structures in HDI packages.

Development of High Density RDL Technologies for Panel Level Processing

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000284-000313
Author(s):  
Lars Böttcher ◽  
S. Karaszkiewicz ◽  
F. Schein ◽  
R. Kahle ◽  
A. Ostmann
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
High Density ◽  
Organic Films ◽  
High Yield ◽  
Wafer Level ◽  
Final Size ◽  
Process Yield ◽  
Cu Pillar ◽  
Thin Organic Films ◽  
Advanced Packaging

Advanced packaging technologies like wafer-level fan-out and 3D System-in-Packages (SIPs) are rapidly penetrating the market of electronic components. A recent trend to reduce cost is the extension of processes to large manufacturing formats, called Panel Level Packaging (PLP). In a consortium of German partners from industry and research advanced technologies for PLP are developed. The project aims for an integrated process flow for SIPs with chips embedded into an organic laminate matrix. At first dies with Cu pillar structures are placed into openings of a laminate frame layer with very low coefficient of thermal expansion (CTE). They are embedded by vacuum lamination of thin organic films, filling the very small gap down to 15 μm between chips and frame. The frame provides alignment marks for a local registration of following processes. The ridged frame limits die shift during embedding and gives a remarkable handling robustness. Developments are initially performed on a 305×256mm2 panel format, aiming for a final size of 610×615 mm2. On the top side of embedded chips, a 20μm dielectric film is applied. The goal is to avoid additional via formation and to realize a direct connection between the Cu pillar of the die and the RDL The RDL formation is based on semi-additive processing. Therefore a Ti or TiW barrier and Cu seed layer is sputtered. Subsequently a 7μm photoresist is applied and exposed by a newly developed Direct Imaging (DI) system. Lines and spaces of 4μm were achieved with high yield. In the following, Cu is simultaneously electroplated for the via contacts and interconnects traces. Finally, the photo resist is stripped and the TiW barrier and Cu seed layers are etched. The goal of the development is to provide a technology for a high-density RDL formation on large panel sizes. The paper will discuss the new developments in detail, e.g. the influence of most significant process parameters, like lithographical resolution, minimum via diameter and the placement and alignment accuracy on overall process yield.

Cost effective 3D Glass Microfabrication for Advanced Packaging Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 000781-000784
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt ◽  
Roger Cook
Keyword(s):  
Laser Ablation ◽  
Mechanical Strength ◽  
Glass Ceramic ◽  
Low Cost ◽  
Cost Effective ◽  
Consumer Electronics ◽  
Wet Etching ◽  
Ic Packaging ◽  
Advanced Packaging ◽  
Micron Diameter

Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is widely seen as a method to prolong Moore's law. Historically, silicon has been the material of interest for interposer materials given its prevalence in IC production, but it presents many technical and costs hurdles. In contrast, glass interposer technology presents a low cost alternative, yet attempts at producing advanced through glass vias (TGVs) arrays using traditional methods, such as laser ablation, have inherent process flaws, such as reduced interposer mechanical strength and debris sputtering among others. In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX™ Glass ceramic to create various interposer technologies. This extended abstract will present on the production of large arrays of 10 micron diameter TGVs, with 20 micron center-to-center pitch, in 100 micron thick APEX™ Glass ceramic and the comparisons of wet etching of APEX™ Glass vs. laser ablation.

scholarly journals Robust and cost-effective silver dendritic nanostructures for SERS-based trace detection of RDX and ammonium nitrate

RSC Advances ◽  
2020 ◽  
Vol 10 (73) ◽  
pp. 44747-44755
Author(s):  
V. S. Vendamani ◽  
S. V. S. Nageswara Rao ◽  
A. P. Pathak ◽  
Venugopal Rao Soma
Keyword(s):  
Performance Evaluation ◽  
Ammonium Nitrate ◽  
Cost Effective ◽  
High Density ◽  
Trace Detection ◽  
Electroless Etching ◽  
Dendritic Nanostructures ◽  
And Performance

We report the fabrication and performance evaluation of cost-effective, reproducible silver nanodendrite (AgND) substrates, possessing high-density trunks and branches, achieved by a simple electroless etching and used for the trace detection of RDX and Ammonium Nitrate.

Epitaxial and Non-Epitaxial Heterogeneous Integration Technologies at NGST

2008 ◽  
Vol 1068 ◽  
Author(s):  
Augusto Gutierrez-Aitken ◽  
Patty Chang-Chien ◽  
Bert Oyama ◽  
Kelly Tornquist ◽  
Khanh Thai ◽  
...  
Keyword(s):  
High Performance ◽  
Cost Effective ◽  
Heterogeneous Integration ◽  
Space Technology ◽  
Wafer Level ◽  
Selective Epitaxial Growth ◽  
Wafer Level Packaging ◽  
Design Flexibility ◽  
Systems Requirements ◽  
And Performance

ABSTRACTTo meet increasingly challenging and complex systems requirements, it is not enough to use one single semiconductor technology but to integrate several high performance technologies in an efficient and cost effective way. Heterogeneous integration (HI) approaches lead to a significant higher design flexibility and performance. In this paper we present some of the HI approaches that are being used and developed at Northrop Grumman Space Technology (NGST) that include selective epitaxial growth, metamorphic growth and wafer level packaging (WLP) technology. More recently we are developing a scaled and selective wafer packaging technique to integrate III-V semiconductors with silicon under the COSMOS DARPA program.

scholarly journals Applications and Performance of Geogrids in Structures

2019 ◽  
Vol 8 (4) ◽  
pp. 5495-5500
Keyword(s):  
Sustainable Development ◽  
Tensile Strength ◽  
High Density Polyethylene ◽  
Cost Effective ◽  
Retaining Walls ◽  
High Density ◽  
Pivotal Role ◽  
Different Types ◽  
And Performance ◽  
The Cost

A type of geosynthetic material named geogrid plays a pivotal role in the behaviour of concrete by implementing them as an additional reinforcement. Geogrids have good tensile strength as they are formed by the reticulation of tensile elements with an opening of an ample size which allows interlock with the nearby fill materials. These grids are flexible mesh which is highly effective and enhances the life of the structure. The prime constituents of geogrid are polyester, high-density polyethylene, and polypropylene. More often, in the field of civil engineering,uni-axial, bi-axial and tri-axial geogrids are used. As the cost and duration of construction are nominal, geogrids can be optedfor cost-effective and resilient construction. They are frequently used as reinforcement and for stabilization in structures like retaining walls, pavements, foundations, slopes, and embankments. The geogrids are employed in various construction which results in sustainable development. Thus, this paper discusses diverse studies that have been carried out by using different types of geogrids for various purposes by different research scholars

3-D Integration Latest Developments at LETI

2006 ◽  
Vol 970 ◽  
Author(s):  
Barbara Charlet
Keyword(s):  
Wafer Bonding ◽  
Crucial Role ◽  
3D Structure ◽  
High Density ◽  
Layer Transfer ◽  
Wafer Level ◽  
Hetero Structure ◽  
Front End ◽  
Integration Approach ◽  
Advanced Packaging

ABSTRACTWe review the latest 3-D integration developments performed in LETI, giving some devices integration examples and discussing the achieved performances. Direct bonding and layer transfer (smart cut™) is now largely used to process innovative substrates like: SOI, SSOI, GeOI, … and others. This type of new substrate can play a crucial role in 3D structure integration and can answer the requirements for new challenging performances.3-D integration approach has been used and will be presented in the following topics: advanced packaging by neo-wafers, chip to wafers integration, hetero-structures integration and wafer to wafer concept (front and back-end application). The examples of neo-wafer rebuilding for advanced packaging, the hetero- structure achieved by chip-to-wafer or wafer-to-wafer bonding and front-end and back-end architecture are discussed regarding the 3-D integration challenging requirements. The challenging cases of wafer-level integrated demonstrators for high density 3D inter-chips connections and wireless interconnections are presented. For some examples we give also the first electrical performances achieved with representative demonstrators.

Discotic columnar liquid-crystalline polymer semiconducting materials with high charge-carrier mobility via rational macromolecular engineering

2017 ◽  
Vol 8 (21) ◽  
pp. 3286-3293 ◽  
Author(s):  
Bin Mu ◽  
Xingtian Hao ◽  
Jian Chen ◽  
Qian Li ◽  
Chunxiu Zhang ◽  
...  
Keyword(s):  
Liquid Crystalline ◽  
Cost Effective ◽  
Crystalline Polymer ◽  
Charge Carrier Mobility ◽  
Optoelectronic Device ◽  
Side Chain ◽  
Liquid Crystal Polymers ◽  
Semiconducting Materials ◽  
Organic Semiconducting Materials ◽  
Device Applications

Well-prepared side-chain discotic liquid crystal polymers with shorter spacers in ordered columnar phases are fascinating and promising cost-effective, solution-processable organic semiconducting materials for various potential optoelectronic device applications.

scholarly journals Recent Advances in Conventional Methods and Electrochemical Aptasensors for Mycotoxin Detection

Foods ◽  
2021 ◽  
Vol 10 (7) ◽  
pp. 1437
Author(s):  
Jing Yi Ong ◽  
Andrew Pike ◽  
Ling Ling Tan
Keyword(s):  
Quantitative Analysis ◽  
Animal Feed ◽  
Cost Effective ◽  
Preventive Action ◽  
High Affinity ◽  
Recent Advances ◽  
Recognition Elements ◽  
Key Features ◽  
Pre Treatment ◽  
And Performance

The presence of mycotoxins in foodstuffs and feedstuffs is a serious concern for human health. The detection of mycotoxins is therefore necessary as a preventive action to avoid the harmful contamination of foodstuffs and animal feed. In comparison with the considerable expense of treating contaminated foodstuffs, early detection is a cost-effective way to ensure food safety. The high affinity of bio-recognition molecules to mycotoxins has led to the development of affinity columns for sample pre-treatment and the development of biosensors for the quantitative analysis of mycotoxins. Aptamers are a very attractive class of biological receptors that are currently in great demand for the development of new biosensors. In this review, the improvement in the materials and methodology, and the working principles and performance of both conventional and recently developed methods are discussed. The key features and applications of the fundamental recognition elements, such as antibodies and aptamers are addressed. Recent advances in aptasensors that are based on different electrochemical (EC) transducers are reviewed in detail, especially from the perspective of the diagnostic mechanism; in addition, a brief introduction of some commercially available mycotoxin detection kits is provided.

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