Full-field Characterisation of Strain Localisation Evolution in Sand under Triaxial Loading by In-situ X-ray Microtomography and 3D-volumetric Digital Image Correlation

Author(s):  
S. A. Hall ◽  
N. Lenoir ◽  
G. Viggiani
2019 ◽  
Author(s):  
Anliang Wang ◽  
Zhijun Wei ◽  
Xiaodong Chen ◽  
Shunying Ji ◽  
Yu Liu ◽  
...  

Abstract. We took advantage of digital image correlation to measure the full-field deformation of sea ice in a uniaxial compression experiment in situ. The characteristics of failure mode, nonlinear behavior and crack propagation are all captured by the strain field of specimens. To our knowledge, this is the first attempt to experimentally capture sequential full-field deformations in the mechanical properties of sea ice. This achievement will extend the ability to further explore the complex mechanical behaviors of sea ice.


2017 ◽  
Vol 56 (3) ◽  
pp. 033101 ◽  
Author(s):  
Eszter Szigeti ◽  
Matthew Loparco ◽  
Evgeni Todorov ◽  
Shelby Wheatley ◽  
Richard J. Greene

2018 ◽  
Vol 69 ◽  
pp. 323-331 ◽  
Author(s):  
Anna Gustafsson ◽  
Neashan Mathavan ◽  
Mikael J Turunen ◽  
Jonas Engqvist ◽  
Hanifeh Khayyeri ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1511
Author(s):  
Filipa G. Cunha ◽  
Telmo G. Santos ◽  
José Xavier

This paper is a critical review of in situ full-field measurements provided by digital image correlation (DIC) for inspecting and enhancing additive manufacturing (AM) processes. The principle of DIC is firstly recalled and its applicability during different AM processes systematically addressed. Relevant customisations of DIC in AM processes are highlighted regarding optical system, lighting and speckled pattern procedures. A perspective is given in view of the impact of in situ monitoring regarding AM processes based on target subjects concerning defect characterisation, evaluation of residual stresses, geometric distortions, strain measurements, numerical modelling validation and material characterisation. Finally, a case study on in situ measurements with DIC for wire and arc additive manufacturing (WAAM) is presented emphasizing opportunities, challenges and solutions.


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