Finite Element Analysis of Chip Formation in Micro-Milling Operation

Author(s):  
Leo Kumar S. P. ◽  
Avinash D.

Finite element analysis (FEA) is a numerical technique in which product behavior under various loading conditions is predicted for ease of manufacturing. Due to its flexibility, its receiving research attention across domain discipline. This chapter aims to provide numerical investigation on chip formation in micro-end milling of Ti-6Al-4V alloy. It is widely used for medical applications. The chip formation process is simulated by a 3D model of flat end mill cutter with an edge radius of 5 μm. Tungsten carbide is used as a tool material. ABACUS-based FEA package is used to simulate the chip formation in micro-milling operation. Appropriate input parameters are chosen from the published literature and industrial standards. 3-D orthogonal machining model is developed under symmetric proposition and assumptions in order to reveal the chip formation mechanism. It is inferred that the developed finite element model clearly shows stress development in the cutting region at the initial stage is higher. It reduces further due to tool wear along the cutting zone.

1999 ◽  
Author(s):  
V. Madhavan ◽  
L. Olovsson ◽  
S. C. Swargam ◽  
R. Agarwal

Abstract We describe here the development and testing of a capability for finite element simulation of practical machining operations such as turning and milling, using 3D multi-material, explicit dynamic, Eulerian finite element analysis. In these simulations the workpiece material and the air surrounding it are modeled using Eulerian finite elements and the flow of the workpiece material into the air as a result of the action of the Lagrangian tool can be freely tracked. Tension tests and Taylor impact tests are simulated using the traditional Lagrangian approach as well as the Eulerian approach. Comparison of the results is used to understand the factors affecting the solution accuracy. Simulations of orthogonal machining using this technique show that the side flow of the chip is simulated realistically. Simulations of oblique machining with various rake and inclination angles confirm that the chip flow angle is independent of the rake angle. Inertial effects cause the chip flow angle to differ from the inclination angle as the weight of the chip increases. Simulations of turning and end milling show that chip formation and flow can be simulated ab-initio. The simulation capability described here can provide accurate results for various outputs of interest and is also computationally efficient, allowing a typical analysis to be completed within a day.


2011 ◽  
Vol 228-229 ◽  
pp. 66-71
Author(s):  
Xiao Hong Lu ◽  
Zhen Yuan Jia ◽  
Zhi Cong Zhang ◽  
Xv Jia

The fixture of motorized spindle significantly affect the vibration of micro high speed CNC milling machine, its performance can directly affect the machining accuracy of the entire micro milling machine. A special fixture of high-speed motorized spindle is designed in the paper and its static characteristics are checked by utilizing ANSYS finite element analysis software. To guarantee the sufficient strength of bolts and the safety of motorized spindle when the motorized spindle runs at high speed, theory analysis method and ANSYS finite element analysis method are used to make the strength check of the fixture. The designed special fixture for high speed motorized spindle plays an important part in the design of high-speed motorized spindle.


Author(s):  
Nand K. Jha ◽  
Mahmoud M. Amin

An attempt has been made to design and analyze Indexing Head a very important component in milling operation under sustainability considerations. The design of each component of indexing head is presented along with solid modeling and finite element analysis. The cost estimation for indexing head for milling operation is also presented. The design and finite element analysis of indexing head should be utilized by manufacturers of this very useful device in milling operation. It is used for cutting gears, spirals, splines, etc. The cost estimated of the manufactured indexing head shows it to be within reasonable limits of market. Finite element analysis of each component is safe. An electronic indexing is suggested as an improvement over the mechanical indexing head. A schematic of electronic indexing is presented. The electronic indexing head can be used with milling machine not provided with indexing head and will be portable. The minimum energy needed to manufacture the indexing head is also estimated.


Author(s):  
Saeid Nezamabadi ◽  
Hamid Zahrouni ◽  
Julien Yvonnet ◽  
Michel Potier-Ferry

In this study, we propose a numerical technique which combines a perturbation approach (asymptotic numerical method) and a multilevel finite element analysis. This procedure allows dealing with instability phenomena in the context of heterogeneous materials where buckling may occur at both macroscopic and/or microscopic scales. Different constitutive relations are applied and geometrical non-linearity is taken into account at both scales. Numerical examples involving instabilities at both micro and macro levels are presented.


Author(s):  
Russell G. DeAnna

A finite-element analysis of possible silicon carbide (SiC), folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices® Inc., (Norwood, MA) air-bag crash detector, are etched from 2-μm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 μm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite-element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.


1993 ◽  
Vol 59 (5) ◽  
pp. 821-826 ◽  
Author(s):  
Toshiyuki OBIKAWA ◽  
Katsuyuki TAGUCHI ◽  
Hiroyuki SASAHARA ◽  
Takahiro SHIRAKASHI ◽  
Eiji USUI

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