scholarly journals Experimental and Finite Element Analysis on Chip Formation Mechanism in Machining of Elastomers

Author(s):  
Rajesh Nayak
Author(s):  
Leo Kumar S. P. ◽  
Avinash D.

Finite element analysis (FEA) is a numerical technique in which product behavior under various loading conditions is predicted for ease of manufacturing. Due to its flexibility, its receiving research attention across domain discipline. This chapter aims to provide numerical investigation on chip formation in micro-end milling of Ti-6Al-4V alloy. It is widely used for medical applications. The chip formation process is simulated by a 3D model of flat end mill cutter with an edge radius of 5 μm. Tungsten carbide is used as a tool material. ABACUS-based FEA package is used to simulate the chip formation in micro-milling operation. Appropriate input parameters are chosen from the published literature and industrial standards. 3-D orthogonal machining model is developed under symmetric proposition and assumptions in order to reveal the chip formation mechanism. It is inferred that the developed finite element model clearly shows stress development in the cutting region at the initial stage is higher. It reduces further due to tool wear along the cutting zone.


Author(s):  
Russell G. DeAnna

A finite-element analysis of possible silicon carbide (SiC), folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices® Inc., (Norwood, MA) air-bag crash detector, are etched from 2-μm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 μm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite-element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.


1993 ◽  
Vol 59 (5) ◽  
pp. 821-826 ◽  
Author(s):  
Toshiyuki OBIKAWA ◽  
Katsuyuki TAGUCHI ◽  
Hiroyuki SASAHARA ◽  
Takahiro SHIRAKASHI ◽  
Eiji USUI

2020 ◽  
Vol 23 (2) ◽  
pp. 255-268
Author(s):  
Olga Liivapuu ◽  
Jüri Olt ◽  
Tanel Tärgla

In the process of cutting, often the selection of cutting parameters is done considering empirical methods. This approach is more expensive and does not usually lead to the best solutions. Numerical methods for simulating the chip formation have been under development over the last thirty years. The aim of the present research is to compare models based on rheological properties of metals with 2D Finite Element Models of chip formation process.


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