Capability Resurrection of DC Sputtering Machine

Nanocoatings are gaining popularity owing to their widespread applications and the physical vapour deposition constitutes an effective method of deposition of coatings onto a suitable substrate. This work comprises of capability resurrection of a newly installed DC sputtering machine through troubleshooting, calibration, and establishment of process parameter mainly in terms of critical-to-performance (CTP) characteristic identified as the sputtering voltage. This work exercises the identification of potential causes for the breakdown of the sputtering machine through Ishikawa diagram and root cause is identified through the why-why analysis. Prioritization of corrective actions through process failure modes and effects analysis (PFMEA). Correct functioning of the DC sputtering machine after taking corrective action, is validated and confirmed through experimentation. This work shall serve as a reference to the maintenance and process personnel and guide them to perform the experiments related to DC sputtering in a laboratory environment.

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Case Study and Fault Modeling for Wrong Redundancy Evaluation on DRAM Devices

ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2007p0252 ◽

2007 ◽

Author(s):

Martin Versen ◽

Dorina Diaconescu ◽

Jerome Touzel

Keyword(s):

Failure Mode ◽

Failure Modes ◽

Fault Modeling ◽

Mode Analysis ◽

Root Cause ◽

Failure Mode Analysis

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.

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Microhardness Testing on Via Fill Material for Via In Pad Technology

ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2003p0209 ◽

2003 ◽

Author(s):

Norman J. Armendariz ◽

Carolyn McCormick

Keyword(s):

Printed Circuit Board ◽

Failure Modes ◽

Strong Dependence ◽

Circuit Board ◽

Electrical Performance ◽

Gravimetric Analysis ◽

Passive Components ◽

Root Cause ◽

Fill Material ◽

Signal Routing

Abstract Via in pad PCB (Printed Circuit board) technology for passive components such as chip capacitors and resistors, provides the potential for improved signal routing density and reduced PCB area. Because of these improvements there is the potential for PCB cost reduction as well as gains in electrical performance through reduced impedance and inductance. However, not long after the implementation, double digit unit failures for solder joint electrical opens due to capacitor “tombstoning” began to occur. Failure modes included via fill material (solder mask) protrusion from the via as well as “out gassing” and related “tombstoning.” This failure analysis involved investigating a strong dependence on PCB supplier and, less obviously, manufacturing site. Other factors evaluated included via fill material, drill size, via fill thermal history and via fill amount or fill percent. The factor most implicated was incomplete cure of the via fill material. Previous thermal gravimetric analysis methods to determine level of polymerization or cure did not provide an ability to measure and demonstrate via fill cure level in small selected areas or its link to the failures. As a result, there was a metrology approach developed to establish this link and root-cause the failures in the field, which was based on microhardness techniques and noncontact via fill measuring metrologies.

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A Matrix FMEA Analysis of Variable Delivery Vane Pumps

Energies ◽

10.3390/en14061741 ◽

2021 ◽

Vol 14 (6) ◽

pp. 1741

Author(s):

Joanna Fabis-Domagala ◽

Mariusz Domagala ◽

Hassan Momeni

Keyword(s):

Risk Analysis ◽

Failure Modes ◽

High Reliability ◽

Matrix Analysis ◽

Hydraulic Systems ◽

Vane Pump ◽

End Effects ◽

Root Cause ◽

Preventative Measures ◽

Fmea Analysis

Hydraulic systems are widely used in the aeronautic, machinery, and energy industries. The functions that these systems perform require high reliability, which can be achieved by examining the causes of possible defects and failures and by taking appropriate preventative measures. One of the most popular methods used to achieve this goal is FMEA (Failure Modes and Effects Analysis), the foundations of which were developed and implemented in the early 1950s. It was systematized in the following years and practically implemented. It has also been standardized and implemented as one of the methods of the International Organization for Standardization (ISO) 9000 series standards on quality assurance and management. Apart from wide application, FMEA has a number of weaknesses, which undoubtedly include risk analysis based on the RPN (Risk Priority Number), which is evaluated as a product of severity, occurrence, and detection. In recent years, the risk analysis has been very often replaced by fuzzy logic. This study proposes the use of matrix analysis and statistical methods for performing simplified RCA (Root Cause Analysis) and for classification potential failures for a variable delivery vane pump. The presented methodology is an extension of matrix FMEA and allows for prioritizing potential failures and their causes in relation to functions performed by pump components, the end effects, and the defined symptoms of failure of the vane pump.

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TiO2–SiO2 one-dimensional photonic crystals of controlled porosity by glancing angle physical vapour deposition

Journal of Materials Chemistry ◽

10.1039/c0jm00680g ◽

2010 ◽

Vol 20 (31) ◽

pp. 6408 ◽

Cited By ~ 57

Author(s):

Lola González-García ◽

Gabriel Lozano ◽

Angel Barranco ◽

Hernán Míguez ◽

Agustín R. González-Elipe

Keyword(s):

Photonic Crystals ◽

Vapour Deposition ◽

Physical Vapour Deposition ◽

One Dimensional ◽

Glancing Angle ◽

Controlled Porosity

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Different Failure Modes of Non-Metallic Pipelines at Connections

Volume 4: Production Pipelines and Flowlines; Project Management; Facilities Integrity Management; Operations and Maintenance; Pipelining in Northern and Offshore Environments; Strain-Based Design; Standards and Regulations ◽

10.1115/ipc2014-33741 ◽

2014 ◽

Author(s):

Alex Tatarov ◽

Frank Gareau

Keyword(s):

Failure Modes ◽

Root Cause Analysis ◽

Case Histories ◽

Actual Case ◽

Cause Analysis ◽

Root Cause ◽

Pipeline Failures

The article provides an overview of different modes of failures in composite pipeline connections. Non-metallic spoolable (SCP) and reinforced thermoplastic pipelines (RTP) of different makes will be addressed. The article is based on actual case histories of pipeline failures (root cause analysis). Numerous factors contributing to failures and recommendations are discussed.

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Uniform aluminum deposits on large non-planar and planar polyimide substrates by physical vapour deposition

Microelectronics Journal ◽

10.1016/s0026-2692(83)80064-0 ◽

1983 ◽

Vol 14 (3) ◽

pp. 91

Keyword(s):

Vapour Deposition ◽

Physical Vapour Deposition

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Synthesis of multi-layer graphene films on silica using physical vapour deposition

Carbon ◽

10.1016/j.carbon.2017.08.014 ◽

2017 ◽

Vol 123 ◽

pp. 683-687 ◽

Cited By ~ 6

Author(s):

Daniel T. Oldfield ◽

Chi P. Huynh ◽

Stephen C. Hawkins ◽

James G. Partridge ◽

Dougal G. McCulloch

Keyword(s):

Vapour Deposition ◽

Physical Vapour Deposition ◽

Layer Graphene ◽

Graphene Films

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Characterisation of Pristine and Recoated electron beam evaporation plasma-assisted physical vapour deposition Cr–N coatings on AISI M2 steel and WC–Co substrates

Thin Solid Films ◽

10.1016/j.tsf.2005.06.029 ◽

2005 ◽

Vol 491 (1-2) ◽

pp. 177-183 ◽

Cited By ~ 7

Author(s):

J.C. Avelar-Batista ◽

E. Spain ◽

J. Housden ◽

G.G. Fuentes ◽

R. Rebolé ◽

...

Keyword(s):

Electron Beam ◽

Vapour Deposition ◽

Electron Beam Evaporation ◽

Physical Vapour Deposition

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PVD-Based Microstructuring Surface Techniques for Tribological Applications

World Tribology Congress III, Volume 2 ◽

10.1115/wtc2005-63303 ◽

2005 ◽

Author(s):

A. Alberdi ◽

M. Marin ◽

I. Etxeberria ◽

G. Alberdi

Keyword(s):

Vapour Deposition ◽

Mineral Oil ◽

Tribological Performance ◽

Physical Vapour Deposition ◽

Rectangular Grid ◽

New Techniques ◽

Surface Textures ◽

Microstructured Surfaces ◽

Set Up ◽

Ball On Disc

Combined techniques of Physical Vapour Deposition (PVD), laser ablation and UV-Photolithography have been set up to produce well defined surface textures able to increase the seizure resistance of high loaded lubricated systems. Using these new techniques, different predefined surface textures, following rectangular grid and zigzag stripped patterns have been generated. The microstructured surfaces developed have been characterised with confocal microscopy, optical and scanning electron microscopy. Ball-on-disc tribological tests under progressively increased load have been carried out using mineral oil as lubricant to determine the influence of surface microtextures on seizure resistance. The influence of shape and size of texture patterns on the tribological performance of the surface have been also studied.

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