Onset of Microplasticity in Copper Crystal during Nanoindentation

Author(s):  
Jana Horníková ◽  
Miroslav Černý ◽  
Pavel Šandera ◽  
Jaroslav Pokluda
Keyword(s):  
2011 ◽  
Vol 23 (1) ◽  
pp. 101-106
Author(s):  
段涛 Duan Tao ◽  
罗江山 Luo Jiangshan ◽  
唐永建 Tang Yongjian ◽  
唐朝江 Tang Chaojiang

The thermal and electrical magnetoresistance tensors are expected to depend in identical ways on the electronic structure of a metal provided that scattering is predominantly elastic. It is shown that the lattice contribution to the thermal conductivity tensor can be neglected in copper at 2°K up to a field of 10 6 G, and that there are experimental reasons which suggest the thermal effect to be more amenable to accurate experimental investigation than the electrical one. The expected details of the electrical Hall effect in and around high symmetry directions are discussed in terms of the extended zone Fermi surface, and it is shown that the high field limits of the Hall coefficient with magnetic field exactly along the high symmetry directions are very simply related to a caliper dimension of the Fermi surface necks. Experimental techniques using carbon resistance thermometers and of making accurately placed thermal contacts to a copper crystal are described, and are followed by the results obtained in two samples, of resistance ratio 1600 an d 7000, in fields up to 40 kG. The open orbit dominated behaviour expected for the electrical effect near the high symmetry directions is satisfactorily confirmed in the thermal experiment, but the high field limits of the coefficients exactly along the symmetry directions do not agree at all well with the calculations, particularly in <111>. It is clearly necessary to measure the electrical and thermal effects in the same sample to check the validity of the Wiedemann-Franz law.


2011 ◽  
Vol 181-182 ◽  
pp. 434-438
Author(s):  
Ming Meng ◽  
Yuan Ming Huang

Electrochemical deposition of copper from copper chloride aqueous electrolyte on porous silicon (PS) substrate was investigated in the current density range of 5 mA/cm2to 35 mA/cm2. Scanning electron microscopy (SEM) was utilized to characterize the surface morphology of as-electrodeposited PS. SEM images illustrate that the applied current density has a profound influence on the shape of copper crystal electrodeposited on the top surface of PS films. When the applied current density was fixed at 5mA/cm2, most of the copper crystals are in the shape of cube along with a small number of cuboid-shape. With the increasing current density, cuboid-shaped copper crystals gradually vanished. When the current density is up to the 35mA/cm2, we surprisingly observe that the cube shape predominates simultaneously with the emergence of truncated tetrahedron. A tentative explanation for the growth mechanism of copper crystal having various shapes is explored.


2011 ◽  
Vol 151 (7) ◽  
pp. 509-513 ◽  
Author(s):  
L. Zhao ◽  
K.T. Rim ◽  
H. Zhou ◽  
R. He ◽  
T.F. Heinz ◽  
...  

1998 ◽  
Vol 539 ◽  
Author(s):  
A.-F. Bastawros ◽  
K.-S. Kim

AbstractThe incremental in-plane Green-Lagrange strain tensor was measured near a stationary crack tip in a cyclically work-hardened copper single crystal. Measurements were made on the surface of a four-point bend specimen, using a finite-deformation laser moiré interferometer. The measurement showed the existence of a narrow asymptotic field beyond a distance of 300 μm from the crack tip. The inner boundary of the asymptotic zone was almost fixed at a characteristic distance ahead of the crack tip. This length scale is thought to arise from a microstructural evolution near the crack tip. The inhomogeneous hardening due to glide-band clustering and patchy slip in a small volume near the crack tip triggered such an evolution. The outer boundary of the asymptotic zone radially grew with the increasing load. The deformation field was found to be very sensitive to additional mode II loading.


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