High strain rates have a similar influence to large deformations on the refinement of microstructure. In both cases, at large strains and high deformation rates, a strong tendency to form microbands is observed. It was found, that the width of the microbands is very sensitive to changes of the deformation parameters. It has been observed particularly, that in severely deformed materials, the width of the microbands is reduced to nanometric dimensions. Hydrostatic extrusion, which has been used in for the deformation of copper in the current work, strain rates exceeding 2 1 3.84 10 − ⋅ ε = × s were employed. In all the samples investigated, numerous microbands were found in the microstructure. The width of microbands varied from 20 to about 400 nm. Thus, the width of some of the microbands exhibited dimensions typical of nanometric materials. Additionally, a special feature was the appearance of large areas of subgrains with an average dimension of about 200 nm. These areas were identified as recrystallized dynamically, or post-dynamically. Large misorientations were found between the microbands and the surrounding “matrix’. Such misorientation facilitates the formation of high angle boundaries, which in turn contribute to the changes of microstructure and mechanical properties. The mechanism for the creation of high misorientation in the microband areas is probably different from that operating during the process of dynamic recrystalization. The results confirm the possibility of obtaining a nanometric structure at lower deformation, but at higher strain rates.
High Plastic Strain of Silica Microparticles under Electron Beam Irradiation
