Analysis on the Drop of PCB Packaged by Cushion Material Based on Finite Element Method

2013 ◽  
Vol 288 ◽  
pp. 303-307
Author(s):  
Gai Mei Zhang ◽  
Heng Yi Guo ◽  
Yue Lou ◽  
Qi Lu Tao ◽  
Wei Yuan ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Elastic Modulus ◽  
Printed Circuit Board ◽  
Impact Force ◽  
Circuit Board ◽  
Drop Height ◽  
Printed Circuit ◽  
Finite Element Software ◽  
The Impact

This paper analyzes the stress of the printed circuit board (PCB) packaged by cushion materials after drop and investigates the stress of PCB under the different drop height, different cushion materials and different drop ground using ANSYS finite element software. The stress of PCB is analyzed quantitatively and qualitatively after drop, the results show: (1) The stress of the product is effected by drop height and the performance of dropping ground in a large extent; (2) The protect performance varies with the ways of cushioning packaging; (3) Within a certain range, the cushion material with smaller elastic modulus is better due to absorb the impact more energy and can bear the impact force is greater.

Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test

2009 ◽  
Vol 419-420 ◽  
pp. 37-40
Author(s):  
Shiuh Chuan Her ◽  
Shien Chin Lan ◽  
Chun Yen Liu ◽  
Bo Ren Yao
Keyword(s):  
Finite Element ◽  
Experimental Measurement ◽  
Test Specimen ◽  
Printed Circuit Board ◽  
Drop Impact ◽  
Simulation Technique ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Impact

Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-DYNA is applied to compute the impact acceleration and dynamic strain on the test specimen during the drop impact. The finite element results are compared to the experimental measurement of acceleration with good correlation between simulation and drop testing. With the accurate simulation technique, one is capable of predicting the impact response and characterizing the failure mode prior to real reliability test.

scholarly journals Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 833 ◽  
Author(s):  
Thomas Glatzl ◽  
Roman Beigelbeck ◽  
Samir Cerimovic ◽  
Harald Steiner ◽  
Albert Treytl
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Printed Circuit Board ◽  
Flow Sensor ◽  
Circuit Board ◽  
Thermal Flow ◽  
Fem Simulations ◽  
Printed Circuit ◽  
Thermal Flow Sensor ◽  
Element Method

We present finite element method (FEM) simulations of a thermal flow sensor as well as a comparison to measurement results. The thermal sensor is purely based on printed circuit board (PCB) technology, designed for heating, ventilation, and air conditioning (HVAC) systems. Design and readout method of the sensor enables the possibility to measure the flow velocity in various fluids. 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulations enable a fast and easy way to evaluate the sensor’s behaviour in different fluids. The results of the FEM simulations are compared to measurements in a real environment, proving the credibility of the model.

Revealing Mechanical Strength of Nanopores Using Atomic Finite Element Techniques

2018 ◽  
Vol 934 ◽  
pp. 24-29
Author(s):  
Prapasiri Pongprayoon ◽  
Attaphon Chaimanatsakun
Keyword(s):  
Mechanical Properties ◽  
Finite Element Method ◽  
Finite Element ◽  
Fluid Flow ◽  
Mechanical Strength ◽  
Impact Force ◽  
Pore Surface ◽  
Vertical Rectangle ◽  
The Impact ◽  
Graphene Nanopore

Graphene nanopore has been widely employed in nanofilter or nanopore devices due to its outstanding properties. The understanding of its mechanical properties at nanoscale is crucial for device improvement. In this work, the mechanical properties of graphene nanopore is thus investigated using atomistic finite element method (AFEM). Four graphene models with different pore shapes (circular (CR), horizontal rectangle (RH), and vertical rectangle (RV)) in sub-nm size which could be successfully fabricated experimentally have been studied here. The force normal to a pore surface is applied to mimic the impact force due to a fluid flow. Increasing pore size results in the reduction in its strength. Comparing among different pore shapes with comparable sizes, the order of pore strength is CR>RH>RV>SQ. In addition, we observe that the direction of pore alignment and geometries of pore edge also play a key role in mechanical strength of nanopores.

Research on Liberation Mechanism of the Impact Crushing Waste Printed Circuit Board

2010 ◽  
Vol 113-116 ◽  
pp. 730-734 ◽  
Author(s):  
Chen Long Duan ◽  
Yue Min Zhao ◽  
Jing Feng He ◽  
Nian Xin Zhou
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Distribution Model ◽  
Evaluation Indexes ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Waste Printed Circuit Board ◽  
Impact Crushing ◽  
The Impact

The reutilization of waste Printed Circuit Boards (PCB) is a focused topic in the field of environment protection and resource recycling, and the crushing is the crucial process for recycling waste PCB. A hamper impacting crusher was used to achieve metals crushing liberation from non-metals, the liberation mechanism of PCB can be explained by dispersion liberation accompanied disengaging liberation. The Rosin-Rammler distribution model of crushed PCB particle was put forward. The evaluation indexes show that Rosin-Rammler function can accurately describe size distribution of PCB particles because the convergence property R2 is 0.99694 and fitting error E is 4.80658. The selective crushing is appearance with metals concentrated in coarser fraction and non-metals in finer size during comminution processing. The impact crushing is an effective method to metals liberation of PCB particles.

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
Hung-Jen Chang ◽  
Chau-Jie Zhan ◽  
Tao-Chih Chang ◽  
Jung-Hua Chou
Keyword(s):  
Printed Circuit Board ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
Printed Circuit ◽  
Plastic Ball ◽  
Circuit Board Assembly ◽  
Halogen Free ◽  
Board Level ◽  
The Impact

In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0Ag0.5Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn1.0Ag0.5Cu solder paste on the Cu pad surfaces of either organic solderable preservative (OSP) or electroless nickel immersion gold (ENIG). The assembly was tested for the effect of the formation extent of Ag3Sn intermetallic compound. Afterward a board-level pulse-controlled drop test was conducted on the as-reflowed assemblies according to the JESD22-B110 and JESD22-B111 standards, the impact performance of various surface finished halogen-free printed circuit board assembly was evaluated. The test results showed that most of the fractures occurred around the pad on the test board first. Then cracks propagated across the outer build-up layer. Finally, the inner copper trace was fractured due to the propagated cracks, resulting in the failure of the PCB side. Interfacial stresses numerically obtained by the transient stress responses supported the test observation as the simulated initial crack position was the same as that observed.

Nonlinear Response of a Printed Circuit Board in Shock

2009 ◽  
Author(s):  
M. Vujosevic ◽  
P. Raghavan ◽  
G. Ramanathan ◽  
W. Hezeltine ◽  
K. Blue
Keyword(s):  
Printed Circuit Board ◽  
Transfer Functions ◽  
Numerical Approach ◽  
Circuit Board ◽  
Special Importance ◽  
Strain Measurements ◽  
Printed Circuit ◽  
Numerical Finite Element ◽  
Nonlinear Deformations ◽  
The Impact

This work focuses on deformation mechanisms taking place in a Printed Circuit Board (PCB) exposed to high impact shock. A combined experimental, theoretical, and numerical approach has been applied to address both the nature of the observed deformation and its modeling and test metrology implications. Experimental evidence overwhelmingly indicates that a PCB in both test and system applications undergoes nonlinear deformations. Geometric nonlinearity of board response is attributed to the elevated in-plane (membrane) stresses that develop when a drop height and/or inertia forces are significant. The impact of these stresses on deformations (board strain) was quantified using a specially designed test. Membrane stresses were also accounted for in a numerical (Finite Element Method) model developed and carefully validated in the course of this study. The model shows a very good agreement with test data. The nonlinearity of PCB deformation in shock, i.e. the fact that both bending moments and in-plane forces are present in the board has important implications on test metrology development and on correlation between the measured board strain and stresses in interconnects of surface mounted components. Of special importance is the impact that nonlinearity can have on development of transfer functions between strain measurements on system boards and strain measurements on test boards, which is also addressed in the paper.

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