Study on Wearable Computer Applications in the Industrial Field

2013 ◽  
Vol 389 ◽  
pp. 1008-1013
Author(s):  
Kai Wu ◽  
Qing Shui Li

Wearable computer will give a huge impact on traditional industries, which can effectively overcome the traditional industrial areas in the mobile monitoring, data acquisition, and the difficulties encountered by the large and complex equipment installation, maintenance and breakdown maintenance, special industrial field operations, remote collaboration. This paper is to study the wearable computer applications in the industrial field, and wearable computer design specifications. The model of the hardware and software is designed based on these indicators, and study and design a complete design.

2021 ◽  
Author(s):  
Li Bo ◽  
Du Zhanlong ◽  
Yang Qiushi ◽  
Li Xinyue

2012 ◽  
Vol 442 ◽  
pp. 412-417
Author(s):  
Xiao Wei Chen ◽  
Bin Tian

Designers are being increasingly pressurised to design buildings with high standards of energy e1ciency, performance and comfort. Computers are seen as an important modern design tool that can help lighten some of the designers' burdens. A myriad of computer applications already exists, ranging from complex 4nite-element applications to simple electronic nomographs. New development in this 4eld tends to be in the areas of integrated building design and knowledge-based systems.Researchers and scientists can develop tools with the potential to greatly enhance the quality of buildings. These tools will however fail if they are not widely accepted and used by designers. Only a few building designers currently exploit the full potential of computer design tools. The general use of computers seems to be restricted to CAD and steady state calculations. This can mainly be attributed to the complexity of, and time required for using the existing tools.


2001 ◽  
Vol 27 (4) ◽  
pp. 259-269 ◽  
Author(s):  
Rungtai Lin ◽  
John G. Kreifeldt

1996 ◽  
Vol 28 (5) ◽  
pp. 393-404 ◽  
Author(s):  
Susan Finger ◽  
John Stivoric ◽  
Cristina Amon ◽  
Levent Gursoz ◽  
Fritz Prinz ◽  
...  

2018 ◽  
Vol 9 (2) ◽  
pp. 8-16
Author(s):  
Juan Vicente Cajal-Barros

The project designed and implemented was an EEG as the first part of a macro project, which allowed the integration between the different programs of ANTONIO NARIÑO University. This system is an integral part of the physiographer, conditioning circuits, filters, amplifiers, a data acquisition system and a virtual instrument were designed that capture the variables through a data acquisition card to be analyzed and visualized dynamically on a personal computer. Design and implementation process were divided into 5 modules. It will begin describing magnitudes to be measured, the sensors that will give us a better capture of our signals, the next two modules are the circuitry and the patient protection, to finish with data acquisition and the visualization in a personal computer.


1999 ◽  
Vol 122 (2) ◽  
pp. 98-106 ◽  
Author(s):  
Eric Egan ◽  
Cristina H. Amon

Wearable computers are rugged, portable computers that can be comfortably worn on the body and easily operated for maintenance applications. The recently developed process of Shape Deposition Manufacturing has created the opportunity to embed the electronics of wearable computers in a polymer composite substrate. As both a protective outer case and a conductive heat dissipating medium, the substrate satisfies two basic constraints of wearable computer design: ruggedness and cooling efficiency. One such application of embedded electronics is the VuMan3R, a wearable computer designed and manufactured at Carnegie Mellon University for aircraft maintenance. This paper combines finite element numerical simulations, physical experimentation, and analytical models to understand the thermal phenomena of embedded electronic design and to explore the thermal design space. Numerical models ascertain the effect of heat spreaders and polymer composite substrates on the thermal performance, while physical experimentation of an embedded electronic artifact ensures the accuracy of the numerical simulations and the practicality of the thermal design. Analytical models using thermal resistance networks predict the heat flow paths within the embedded electronic artifact as well as the role of conductive fillers used in polymer composites. [S1043-7398(00)00102-X]


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