High-Resolution Real-Time Visual Inspection System for Micro Assembly

2017 ◽  
Vol 870 ◽  
pp. 249-256
Author(s):  
Bing Yin Zhang ◽  
Mu Zheng Xiao ◽  
Zhi Jing Zhang ◽  
Ting Hai Qin
Keyword(s):  
High Resolution ◽  
Real Time ◽  
High Speed ◽  
Visual Inspection ◽  
Image Sensor ◽  
High Accuracy ◽  
Servo Control ◽  
Inspection System ◽  
Display Device ◽  
Micro Assembly

For precise assembly of miniature parts, the precise inspection for parts’ posture and real-time servo control for assembly greatly depend on the performance of visual inspection system. This paper proposed a high-resolution real-time visual inspection system of micro assembly. The CMOS image sensor and high-speed digital signal processing chip were chosen to design the image acquisition module, image processing module and image display module. High-accuracy display on the common display device was implemented with the video encoding chip and FPGA. The test results showed that the processing speed with preprocessing could reach 3.5 frames per second with 5 mega-pixel resolution, and the display accuracy after threshold processing had little loss. Micro parts assembly experiment and high accuracy Peg-in-Hole assembly experiment are done to test the performance of the proposed visual inspection system. This visual inspection system can be used for high-resolution real-time micro assembly and other real-time visual servo control.

Automated real-time visual inspection system for high-resolution superimposed printings

1998 ◽  
Vol 16 (12-13) ◽  
pp. 947-958 ◽  
Author(s):  
F. Torres ◽  
J.M. Sebastian ◽  
R. Aracil ◽  
L.M. Jimenez ◽  
O. Reinoso
Keyword(s):  
High Resolution ◽  
Real Time ◽  
Visual Inspection ◽  
Inspection System

Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits

1999 ◽  
Author(s):  
Kenneth Krieg ◽  
Richard Qi ◽  
Douglas Thomson ◽  
Greg Bridges
Keyword(s):  
High Resolution ◽  
Integrated Circuits ◽  
Real Time ◽  
High Speed ◽  
Time Signal ◽  
Surface Imaging ◽  
Atomic Force ◽  
Submicron Structures ◽  
High Resolution Images ◽  
Capacitive Loading

Abstract A contact probing system for surface imaging and real-time signal measurement of deep sub-micron integrated circuits is discussed. The probe fits on a standard probe-station and utilizes a conductive atomic force microscope tip to rapidly measure the surface topography and acquire real-time highfrequency signals from features as small as 0.18 micron. The micromachined probe structure minimizes parasitic coupling and the probe achieves a bandwidth greater than 3 GHz, with a capacitive loading of less than 120 fF. High-resolution images of submicron structures and waveforms acquired from high-speed devices are presented.

Realization of Miniature Air Data System Based on Silicon Micro Pressure Sensor

2012 ◽  
Vol 503-504 ◽  
pp. 1445-1449
Author(s):  
Li Min Chang ◽  
Xiang Bin Yu ◽  
Li Jing Zhang
Keyword(s):  
Mach Number ◽  
High Resolution ◽  
Real Time ◽  
Pressure Sensor ◽  
Pressure Measurement ◽  
High Stability ◽  
Computer Calculation ◽  
High Accuracy ◽  
Data System ◽  
Embedded Computer

In this paper, miniature air data system is designed based on thermally excited resonant silicon micro structural pressure sensor. The system employs thermally excited resonant silicon micro structural pressure sensor for the pressure measurement. Using miniature embedded computer, calculation of the parameters such as height, airspeed and mach number and real-time display by LCD are realized. The volume and weight of this system is only one-twelfth of the original. In addition, it has the characteristics of high accuracy, high resolution, high stability and repeatability.

Real-time thermal error compensation method for robotic visual inspection system

2014 ◽  
Vol 75 (5-8) ◽  
pp. 933-946 ◽  
Author(s):  
Shibin Yin ◽  
Yin Guo ◽  
Yongjie Ren ◽  
Jigui Zhu ◽  
Shourui Yang ◽  
...  
Keyword(s):  
Real Time ◽  
Error Compensation ◽  
Visual Inspection ◽  
Thermal Error ◽  
Compensation Method ◽  
Inspection System ◽  
Thermal Error Compensation

Image Processing for Optical Methods to Analyze Shape, Deformation, Stress and Strain

2006 ◽  
Vol 326-328 ◽  
pp. 13-18
Author(s):  
Yoshiharu Morimoto
Keyword(s):  
Image Processing ◽  
Real Time ◽  
High Speed ◽  
Video Camera ◽  
Image Sensor ◽  
Phase Shifting ◽  
Optical Methods ◽  
Shape Deformation ◽  
Stress And Strain ◽  
Deformation Stress

The authors have been developing some novel methods to measure shape, deformation, stress and strain of structures using optical methods and image processing as follows: (1) Phase analysis methods using Fourier, wavelet or Gabor transforms, etc., (2) Real-time 2-D strain measurement using moiré interferometry, (3) Scanning moiré method using thinning-out of scanning lines and a DMD camera (4) Strain rate distribution measurement by a high-speed video camera, (5) Real-time integrated phase-shifting method, (6) Shape measurement methods using multi-reference planes, a linear image sensor, or a frequency modulated grating, and (7) Windowed phase-shifting digital holographic interferometry (WPSDHI). Theories of these methods and some applications are introduced. The most accurate result is 88 picometer standard deviation of errors using the WPSDHI.

High-speed dual-output-channel stage-selectable TDI CCD image sensor for high-resolution applications

1995 ◽  
Author(s):  
M. S. Agwani ◽  
David A. Dobson ◽  
William D. Washkurak ◽  
Savvas G. Chamberlain
Keyword(s):  
High Resolution ◽  
High Speed ◽  
Image Sensor ◽  
Output Channel ◽  
Ccd Image Sensor ◽  
Ccd Image

A Real-Time Automated Visual Inspection System for Hot Steel Slabs

1983 ◽  
Vol PAMI-5 (6) ◽  
pp. 563-572 ◽  
Author(s):  
Bindinganavle R. Suresh ◽  
Richard A. Fundakowski ◽  
Tod S. Levitt ◽  
John E. Overland
Keyword(s):  
Real Time ◽  
Visual Inspection ◽  
Inspection System ◽  
Automated Visual Inspection ◽  
Steel Slabs
Sign in / Sign up

Export Citation Format

Share Document