Numerical and Experimental Research of the Slurry Film in Chemical Mechanical Polishing (CMP)
2010 ◽
Vol 102-104
◽
pp. 669-674
Keyword(s):
A three-dimensional hydrodynamic lubrication model for chemical-mechanical polishing is presented based on the Reynolds equation and Reynolds boundary condition. By solving the Reynolds equation, the slurry film pressure distribution has been obtained. The effects of minimum film thickness and the wafer tile angle on the film pressure are analyzed, and the influence of the polishing applied load and rotation speed on slurry film thickness and tilt angle are discussed. At last, by experiment, it is found that the simulation results are similar to experiment results which film thickness is increasing with the increasing of rotation speed, decreasing of the applied load. It is proved that the simulation is reliable.
2010 ◽
Vol 44-47
◽
pp. 1213-1217
1982 ◽
Vol 104
(3)
◽
pp. 410-417
◽
2001 ◽
Vol 389
(1-2)
◽
pp. 254-260
◽
2005 ◽
Vol 219
(4)
◽
pp. 285-290
◽
1987 ◽
Vol 201
(1)
◽
pp. 1-9
◽
2014 ◽
Vol 2014
◽
pp. 1-8
◽
1982 ◽
Vol 383
(1785)
◽
pp. 439-446
◽