Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

2014 ◽  
Vol 893 ◽  
pp. 811-814
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Comparison Analysis ◽  
Single Chip ◽  
High Power Led ◽  
Von Mises

The vast development of the LED industry has created contemporary set of thermal issues with limits the reliability of the high power LEDs. Thus, this paper reports a simulation analysis done on single chip high power LED package to evalute the effects of heat slug material on the heat dissipation of the LED package. The heat dissipation of two types of heat slug material, aluminum (Al) and copper (Cu) were compared in terms of junction temperature, von Mises stress and thermal resistance of the LED chip at varied input power of 0.1 W and 1W. Results of the analysis showed that the copper heat slug exhibits a better heat dissipation due to its superior thermal conductivity.

Heat Slug Material Variation Analysis on Thermal Dissipation of High Power LED

2014 ◽  
Vol 1082 ◽  
pp. 319-322
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Steven Taniselass ◽  
Hussin Kamarudin
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Method ◽  
Packaging Material ◽  
Thermal Dissipation ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Variation Analysis ◽  
High Power Led ◽  
Von Mises

Accession of power in high power LED light source has resulted in thermal issue which causes reliability malfunction due to deficient heat dissipation. However, the heat disspation of high power LED can be enhance by improving packaging material selection.Thus, in this work, the connotation of heat slug material on the thermal performance of high power LED package was analyzed through simulation method. The significance of two heat slug materials, copper (Cu) and copper diamond (CuDia) were evaluated in terms of junction temperature, von Mises stress and thermal resistance. The simulation was executed using Ansys version 11 at ambient temperature of 25 °C with natural convection condition.

Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package

2014 ◽  
Vol 1082 ◽  
pp. 315-318
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Rotation Speed ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Cooling Fan ◽  
High Power Led ◽  
Von Mises

In this work, thermal simulation analysis on high power LED is reported where the effect of the heat sink cooling fan and its rotation speed on the heat dissipation of the high power LED was evaluated. Ansys version 11 was utilized for the simulation. The thermal performance of the high power LED package was assessed in terms of operating junction temperature, von Mises stress and thermal resistance. The heat dissipation analysis was done under four types of convection condition:one natural convection conditionthree forced convection condition,. The forced convection condition was used to replicate the effect of a fan with various rotation speeds placed under the heat sink to increase the convective heat transfer coefficient. Results of the analysis showed that that the junction temperature, von Mises stress and thermal resistance of the GaN chip reduces with the increase of the fan rotation speed.

Natural Heat Convection Analysis on Cylindrical Al Slug of LED

2014 ◽  
Vol 487 ◽  
pp. 536-539 ◽  
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Nazuhusna Khalid ◽  
K. Anwar ◽  
...  
Keyword(s):  
Natural Convection ◽  
High Power ◽  
Heat Dissipation ◽  
Input Power ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Single Chip ◽  
Von Mises ◽  
Natural Heat Convection

This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug was carried out under natural convection condition at ambient temperature of 25°C. The junction temperature and the stress of the LED chip was assesed. The LED chip was powered with input power of 0.1 W and 1 W and the heat dissipation was assesed. Results showed that that the junction temperature and the Von Mises Stress of the single chip LED package increases with the increased input power.

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Single Chip ◽  
Pin Fin ◽  
High Power Led ◽  
Different Shapes ◽  
Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.

Thermal Analysis of High-Power LED Tube Lamp

2011 ◽  
Vol 308-310 ◽  
pp. 346-350 ◽  
Author(s):  
Xiang Jun Ma ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Bo You Zhou ◽  
Kun Bai ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Junction Temperature ◽  
Key Technology ◽  
High Power Led ◽  
Detailed Simulation ◽  
Simulation Results ◽  
Thermal Grease

Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the length of the lamp on the junction temperature were made, which provide an effective reference for the thermal design.

Research Progress on Packaging Thermal Management Techniques of High Power LED

2011 ◽  
Vol 347-353 ◽  
pp. 3989-3994 ◽  
Author(s):  
Jian Xin Zhang ◽  
Ping Juan Niu ◽  
Da Yong Gao ◽  
Lian Gen Sun
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Thermal Power ◽  
Light Output ◽  
Life Time ◽  
Thermal Design ◽  
Junction Temperature ◽  
Research Progress ◽  
High Heat Flux ◽  
High Power Led

In order to dominate the lighting market, LED needs more electrical power to be driven for higher brightness, thereby increasing thermal power dissipation, which contributes to a high heat flux of 85W/cm2 within a recent typical high power LED chip. And the junction temperature has direct influence upon the light output efficiency, device life time, emitting wavelength and reliability of LED. Therefore, effective removal of heat to maintain a safe junction temperature is the key to meet the future flux per LED requirements. Compared with other individual thermal resistances along the thermal path, thermal design for much lower packaging thermal resistance is more critical to improve the performances of LED. In this paper, major present technical researches on packaging thermal management were analyzed for high power LED, and the advantages and shortcomings of these techniques were respectively summarized. Besides, some suggestions were provided for further research in this area.

Copper Based Heat Slug Structure Variation Analysis on Heat Dissipation of High Power LED

2014 ◽  
Vol 1082 ◽  
pp. 340-343
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
Surface Area ◽  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Variation Analysis ◽  
Single Chip ◽  
Structure Variation ◽  
Excess Heat ◽  
High Power Led

Excess heat generated by the high power LED package significantly impacts the performance and reliability of the light source. Significance of heat dissipation are influenced by each packaging component of high power LED. This paper demonstrates simulation analysis on single chip high power LED where the significance of the copper based heat slug structure on the heat dissipation was analyzed. The simulation analysis was carried out by using Ansys version 11 and heat dissipation of two types of heat slug structure, rectangular and cylindrical were compared. The outcome exhibited that the structure of the heat slug significantly influences the heat dissipation of LED chip due to its surface area.

The Design Research of Single-Chip High Power LED Radiator

2011 ◽  
Vol 103 ◽  
pp. 219-224
Author(s):  
Yuan Luo ◽  
Ti Wei Wei ◽  
Zheng Wei Tang ◽  
Wei Xi Kong
Keyword(s):  
High Power ◽  
Thermal Effects ◽  
Heat Dissipation ◽  
Design Research ◽  
Junction Temperature ◽  
White Led ◽  
Single Chip ◽  
Finite Element Software ◽  
High Power Led ◽  
New Generation

As new generation of solid-state lighting source with green environmental protection, White LED has become the focus of attentions. Along with the development of high power LED, heat dissipation problems of LED become more and more important. This paper makes research on single-chip high power LED by ANSYS finite element software, and analyzes the thermal effects of parameters on the radiator. This paper believes that the influence of radiator materials’ thermal conductivity is not obvious, and the finned height and cooling area of radiator play an very important role in reducing chip junction temperature.

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