Thermal Analysis of High-Power LED Tube Lamp

2011 ◽  
Vol 308-310 ◽  
pp. 346-350 ◽  
Author(s):  
Xiang Jun Ma ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Bo You Zhou ◽  
Kun Bai ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Junction Temperature ◽  
Key Technology ◽  
High Power Led ◽  
Detailed Simulation ◽  
Simulation Results ◽  
Thermal Grease

Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the length of the lamp on the junction temperature were made, which provide an effective reference for the thermal design.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

Research Progress on Packaging Thermal Management Techniques of High Power LED

2011 ◽  
Vol 347-353 ◽  
pp. 3989-3994 ◽  
Author(s):  
Jian Xin Zhang ◽  
Ping Juan Niu ◽  
Da Yong Gao ◽  
Lian Gen Sun
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Thermal Power ◽  
Light Output ◽  
Life Time ◽  
Thermal Design ◽  
Junction Temperature ◽  
Research Progress ◽  
High Heat Flux ◽  
High Power Led

In order to dominate the lighting market, LED needs more electrical power to be driven for higher brightness, thereby increasing thermal power dissipation, which contributes to a high heat flux of 85W/cm2 within a recent typical high power LED chip. And the junction temperature has direct influence upon the light output efficiency, device life time, emitting wavelength and reliability of LED. Therefore, effective removal of heat to maintain a safe junction temperature is the key to meet the future flux per LED requirements. Compared with other individual thermal resistances along the thermal path, thermal design for much lower packaging thermal resistance is more critical to improve the performances of LED. In this paper, major present technical researches on packaging thermal management were analyzed for high power LED, and the advantages and shortcomings of these techniques were respectively summarized. Besides, some suggestions were provided for further research in this area.

High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

2014 ◽  
Vol 893 ◽  
pp. 811-814
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Comparison Analysis ◽  
Single Chip ◽  
High Power Led ◽  
Von Mises

The vast development of the LED industry has created contemporary set of thermal issues with limits the reliability of the high power LEDs. Thus, this paper reports a simulation analysis done on single chip high power LED package to evalute the effects of heat slug material on the heat dissipation of the LED package. The heat dissipation of two types of heat slug material, aluminum (Al) and copper (Cu) were compared in terms of junction temperature, von Mises stress and thermal resistance of the LED chip at varied input power of 0.1 W and 1W. Results of the analysis showed that the copper heat slug exhibits a better heat dissipation due to its superior thermal conductivity.

Thermal Design of Automotive Headlamp with High Power LED

2013 ◽  
Vol 457-458 ◽  
pp. 649-654
Author(s):  
Jing Wang ◽  
Yi Xi Cai ◽  
Chun Zhang ◽  
Xin Jie Zhao ◽  
Xiao Hua Li ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Fluorescent Lamps ◽  
Beam System ◽  
Cooling Devices ◽  
High Power Led ◽  
Led Headlamp ◽  
Volume Method

With an urgent need for energy conservation and pollution reduction, the trend of replacing traditional incandescent or fluorescent lamps with high-power LEDs is growing more and more popular. However, heat dissipation of high-power LED is the main bottleneck for its application. In this research, a kind of automotive headlamp low beam system model is designed with high power LED chips. Several different cooling devices are designed for headlamp cooling, the heat dissipation performances are simulated and analyzed both by the finite volume method (FVM) in FloEFD and experimental measurements. The obtained results indicate that loop heat pipe combined with fined heat sink is the most effective way for heat dissipation in the designed automotive low beam system, even in 80¡æ environmental temperature can ensure the LED headlamp system working stability. The research lays a theoretical basis for the follow-up study.

CuDia Slug Size Variation Analysis on Heat Dissipation of High Power LED

2014 ◽  
Vol 487 ◽  
pp. 33-36 ◽  
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli
Keyword(s):  
Natural Convection ◽  
High Power ◽  
Heat Dissipation ◽  
Size Variation ◽  
Simulation Method ◽  
Point Of View ◽  
Junction Temperature ◽  
Variation Analysis ◽  
Single Chip ◽  
Simulation Results

The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation of heat slug size effect on the junction temperature and stress of single chip LED through simulation method. Ansys version 11 was utilized and the analysis was done with copper diamond rectangular heat slug under natural convection condition at ambient temperature of 25 °C.The simulation results indicated that junction temperature and the stress of the single chip LED is influenced by the size of heat slug.

Effect of Pin-Fin Heat Sink Structure and Irradiation Angle on High-Power LED Down-Light Thermal Performance

2012 ◽  
Vol 591-593 ◽  
pp. 653-656
Author(s):  
Hai Lin Liu ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Wan Jiong Lin ◽  
Bo You Zhou ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Thermal Design ◽  
Cooling Effect ◽  
Future Design ◽  
Pin Fin ◽  
High Power Led ◽  
Simulation Results ◽  
Irradiation Angle

The heat sink has played an important role in the thermal design of high power LED lamps. In this study, a pin-fin heat sink is designed for the 3-chips high power LED down-light. Thermal performance of pin-fin heat sink is researched by changing the fin height, fin number and lamp’s irradiation angle. Simulation results gotten by CFD software show that the pin-fin heat sink has better thermal performance with fin height of 40mm and fin number of 75. The LED down-light with a pin-fin heat sink has a better cooling effect in multi-angle irradiation. The results provide a reference for future design of pin-fin heat-sink.

Heat Slug Material Variation Analysis on Thermal Dissipation of High Power LED

2014 ◽  
Vol 1082 ◽  
pp. 319-322
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Steven Taniselass ◽  
Hussin Kamarudin
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Method ◽  
Packaging Material ◽  
Thermal Dissipation ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Variation Analysis ◽  
High Power Led ◽  
Von Mises

Accession of power in high power LED light source has resulted in thermal issue which causes reliability malfunction due to deficient heat dissipation. However, the heat disspation of high power LED can be enhance by improving packaging material selection.Thus, in this work, the connotation of heat slug material on the thermal performance of high power LED package was analyzed through simulation method. The significance of two heat slug materials, copper (Cu) and copper diamond (CuDia) were evaluated in terms of junction temperature, von Mises stress and thermal resistance. The simulation was executed using Ansys version 11 at ambient temperature of 25 °C with natural convection condition.

Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package

2014 ◽  
Vol 1082 ◽  
pp. 315-318
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Rotation Speed ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Cooling Fan ◽  
High Power Led ◽  
Von Mises

In this work, thermal simulation analysis on high power LED is reported where the effect of the heat sink cooling fan and its rotation speed on the heat dissipation of the high power LED was evaluated. Ansys version 11 was utilized for the simulation. The thermal performance of the high power LED package was assessed in terms of operating junction temperature, von Mises stress and thermal resistance. The heat dissipation analysis was done under four types of convection condition:one natural convection conditionthree forced convection condition,. The forced convection condition was used to replicate the effect of a fan with various rotation speeds placed under the heat sink to increase the convective heat transfer coefficient. Results of the analysis showed that that the junction temperature, von Mises stress and thermal resistance of the GaN chip reduces with the increase of the fan rotation speed.

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