Thermal and Mechanical Properties of Boron-Containing Bisphenal-A Formaldehyde Resin Composites

2010 ◽  
Vol 150-151 ◽  
pp. 877-880
Author(s):  
Jun Gang Gao ◽  
Xing Li ◽  
Bei Bei Sun
Keyword(s):  
Mechanical Properties ◽  
Bisphenol A ◽  
Surface Resistance ◽  
Phenolic Resin ◽  
Volume Resistivity ◽  
Formaldehyde Resin ◽  
Resin Composites ◽  
Thermal And Mechanical Properties ◽  
Fiber Glass ◽  
Residual Rate

Boron-containing bisphenol-A formaldehyde resin (BBAFR) with different amounts of boron was synthesized from bisphenol-A, formaldehyde solution and boric acid. The fiber-glass reinforced laminates were prepared. The thermal, electric and mechanical properties were determined. The results show that the BBAFR has a better thermal stablitity. The residual rate of BBAFR is 18% at 900 oC, which is higher 300 oC than ordinary phenolic resin. The tensile strength of BBAFR fiber-glass laminates is higher 19.07MPa than ordinary phenolic resin fiber-glass laminates. The volume resistivity and surface resistance of BBAFR laminates increased, but the dielectric loss tanδ and dielectric constant ε decreased.

Effects of the Mould Pressure and Mould Pressing Time on the Properties of Graphite/Phenolic Resin Composites

2013 ◽  
Vol 706-708 ◽  
pp. 95-98
Author(s):  
Mi Dan Li ◽  
Dong Mei Liu ◽  
Lu Lu Feng ◽  
Huan Niu ◽  
Yao Lu
Keyword(s):  
Mechanical Properties ◽  
Electrical Conductivity ◽  
Flexural Strength ◽  
Polymer Matrix ◽  
Phenolic Resin ◽  
Polymer Matrix Composites ◽  
Resin Composites ◽  
Matrix Composites ◽  
Natural Graphite ◽  
Pressing Time

Polymer matrix composites made from phenolic resin are filled with natural graphite powders. They are fabricated by compression molding technique. The density, electrical conductivity and flexural strength of composite are analyzed to determine the influences of mould pressure and mould pressing time on the physical, electrical and mechanical properties of composite. It is found that the density, electrical conductivity and flexural strength of composites increased with increasing mould pressure. Under pressure of 40 MPa for 60 min, the density, electrical conductivity and flexural strength of composites were 1.85 g/cm3, 4.35  103 S/cm and 70 MPa, respectively. The decreased gaps could be the main reason for the increasing of density, electrical conductivity and flexural strength as mould pressure increases. The results also show that the density of composites increased with increasing mould pressing time.

Effect of Reinforcing Fillers and Fibres Treatment on Morphological and Mechanical Properties of Typha-Phenolic Resin Composites

2019 ◽  
Vol 20 (5) ◽  
pp. 1046-1053 ◽  
Author(s):  
Elhadji Babacar Ly ◽  
Marieme Josephine Lette ◽  
Abdou Karim Diallo ◽  
Adama Gassama ◽  
Akito Takasaki ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Phenolic Resin ◽  
Resin Composites ◽  
Reinforcing Fillers

Curing, Thermal and Mechanical Properties of Liquid Crystalline p-SBPEPB/BPAER/DDE System

2011 ◽  
Vol 239-242 ◽  
pp. 3253-3256 ◽  
Author(s):  
Li Huo ◽  
Jun Gang Gao ◽  
Yong Gang Du
Keyword(s):  
Mechanical Properties ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Impact Strength ◽  
Bisphenol A ◽  
Liquid Crystalline ◽  
Curing Agent ◽  
Thermal And Mechanical Properties ◽  
Component System

The curing, thermal and mechanical properties of bi-component system for bisphenol A epoxy resin (BPAER) modified by liquid crystalline Sulfonyl bis(4,1-phenylene)bis[4-(2,3-epoxypro pyloxy)benzoate] (p-SBPEPB), with 4,4'-diaminodiphenyl ether (DDE) as a curing agent, were investigated. The effect of the different liquid crystalline contents and the heating rate on curing reaction was discussed. The results show that the curing peak temperature decreases, curing rate increases, the glass transition temperature (Tg)and impact strength all increase with adding of liquid crystalline p-SBPEPB when the content is not over 8wt%.

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