Study on Preparation and Properties of Pressure Sensitive Adhesive of Acrylate Prepared by Miniemulsion

2011 ◽  
Vol 183-185 ◽  
pp. 1938-1941
Author(s):  
Jiu Yin Pang ◽  
Chuan Sun ◽  
Shi Cheng Zhang ◽  
Zhen Xing

Miniemulsion was prepared by means of different ratio of butyl acrylate with vinyl acetate emulsion pressure sensitive adhesive excellent performance. Focused on acrylic acid and vinyl acetate copolymers of different proportions of the glass transition temperature, molecular weight and molecular weight distribution of micro-factors, and build the macroscopic properties of the copolymer glass transition temperature and molecular weight between contacts. The use of APS as initiator under the conditions of the experiment found that with the increase of acrylic, PVC-floor, 180 peel strength composite materials decreased. While the molecular weight of butyl acrylate with the increase of the amount did not change significantly, the initial viscosity of the polymer and 180 º peel strength is improved, but the adhesive holding down quickly.

1998 ◽  
Vol 10 (3) ◽  
pp. 273-283 ◽  
Author(s):  
J W Connell ◽  
J G Smith ◽  
P M Hergenrother

As part of a programme to develop high-performance/high-temperature structural resins for aeronautical applications, imide oligomers containing pendent and terminal phenylethynyl groups were prepared, characterized and the cured resins evaluated as composite matrices. The oligomers were prepared at a calculated number-average molecular weight of 5000 g mol−1 and contained 15–20 mol% pendent phenylethynyl groups. In previous work, an oligomer containing pendent and terminal phenylethynyl groups exhibited a high glass transition temperature (∼313 °C), and laminates therefrom exhibited high compressive properties, but processability, fracture toughness, microcrack resistance and damage tolerance were less than desired. In an attempt to improve these deficiencies, modifications in the oligomeric backbone involving the incorporation of 1,3-bis(3-aminophenoxy)benzene were investigated as a means of improving processability and toughness without detracting from the high glass transition temperature and high compressive properties. The amide acid oligomeric solutions were prepared in N-methyl-2-pyrrolidinone and were subsequently processed into imide powder, thin films, adhesive tape and carbon fibre prepreg. Neat resin plaques were fabricated from imide powder by compression moulding. The maximum processing pressure was 1.4 MPa and the cure temperature ranged from 350 to 371 °C for 1 h for the mouldings, adhesives, films and composites. The properties of the 1,3-bis(3-aminophenoxy)benzene modified cured imide oligomers containing pendent and terminal phenylethynyl groups are compared with those of previously prepared oligomers containing pendent and terminal phenylethynyl groups of similar composition and molecular weight.


2020 ◽  
Vol 869 ◽  
pp. 190-195
Author(s):  
Yuri Mikhailov ◽  
Ludmila Romanova ◽  
Anna Darovskikh ◽  
Nilson Garifullin

Some properties (enthalpy of formation, glass transition temperature and rheological parameters) of hyperbranched polyglycidol derivatives containing nitrate and azide functional groups were investigated. The dependence of the found properties on the molecular weight, composition and structure of the investigated substances was determined.


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