The Temperature Calculation of Axisymmetric Multilayer Cylinder

2011 ◽  
Vol 279 ◽  
pp. 356-360
Author(s):  
Yu Li
Keyword(s):  
Heat Conduction ◽  
Linear System ◽  
Boundary Conditions ◽  
Calculation Method ◽  
Multilayer Cylinder ◽  
Temperature Calculation

A general temperature calculation method of axisymmetric multilayer cylinder was deduced according to the axisymmetric heat conduction of cylinder. Four types of combined boundary conditions were summarized, and temperature computational formulas of axisymmetrical monolayer cylinder were formed under each type. The intermediate interface temperatures and radial stresses of axisymmetrical multilayer cylinder satisfy tridiagonal linear system of eouations, which can be solved with pursuit method. The calculation method is applied universally. Meanwhile, the corresponding calculating program was developed.

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

2015 ◽  
Author(s):  
Koji Nishi ◽  
Tomoyuki Hatakeyama ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Boundary Conditions ◽  
Thermal Resistance ◽  
Hot Spot ◽  
Three Dimensional ◽  
Thermal Design ◽  
Target Temperature ◽  
One Dimensional ◽  
Thermal Network

The thermal network method has a long history with thermal design of electronic equipment. In particular, a one-dimensional thermal network is useful to know the temperature and heat transfer rate along each heat transfer path. It also saves computation time and/or computation resources to obtain target temperature. However, unlike three-dimensional thermal simulation with fine pitch grids and a three-dimensional thermal network with sufficient numbers of nodes, a traditional one-dimensional thermal network cannot predict the temperature of a microprocessor silicon die hot spot with sufficient accuracy in a three-dimensional domain analysis. Therefore, this paper introduces a one-dimensional thermal network with average temperature nodes. Thermal resistance values need to be obtained to calculate target temperature in a thermal network. For this purpose, thermal resistance calculation methodology with simplified boundary conditions, which calculates thermal resistance values from an analytical solution, is also introduced in this paper. The effectiveness of the methodology is explored with a simple model of the microprocessor system. The calculated result by the methodology is compared to a three-dimensional heat conduction simulation result. It is found that the introduced technique matches the three-dimensional heat conduction simulation result well.

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