Processing and Thermal Conductivity Characterization of Solid Glass Micro-Spheres Filled Polymer Composites

2012 ◽  
Vol 445 ◽  
pp. 526-529 ◽  
Author(s):  
Debasmita Mishra ◽  
Alok Satapathy ◽  
Amar Patnaik
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Polymer Composites ◽  
Three Dimensional ◽  
Theoretical Models ◽  
Test Method ◽  
Filled Polymer ◽  
Solid Glass ◽  
Guarded Heat Flow Meter

This paper describes the preparation and thermal conductivity characterization of solid glass micro-spheres (SGMs) filled polymer composites. SGMs of different sizes are embedded in epoxy resin to develop composites by hand layup technique. A numerical simulation of the heat-transfer within the composites is made by using finite element method (FEM). Three-dimensional spheres-in-cube lattice array models are constructed to simulate the microstructure of composite materials for various SGM content ranging from 0 to about 27 vol % and the effective thermal conductivities (Keff) of the composites are estimated. Keff values are also calculated using some of the existing theoretical models. Finally, guarded heat flow meter test method is used to measure the conductivity of these composites. The simulations are compared with Keff values obtained from experiments and it is found that the FEM simulations are fairly close to the measured Keff. This study shows that the incorporation of SGMs results in reduction of conductivity of epoxy resin and thereby improves its thermal insulation capability. Further, the size and content of SGMs influence the extent of reduction of Keff. Keywords: Composites; Glass Microspheres; FEM; Thermal Conductivity; Simulation

Estimation of Interlayer Thickness in Inorganic Particulate-Filled Polymer Composites

2011 ◽  
Vol 24 (6) ◽  
pp. 777-788 ◽  
Author(s):  
J.Z. Liang
Keyword(s):  
Polymer Composites ◽  
Volume Fraction ◽  
Particle Diameter ◽  
Interfacial Structure ◽  
Interlayer Thickness ◽  
Filled Polymer ◽  
Mechanical And Physical Properties ◽  
The Relationship ◽  
Good Agreement

The structure of the interlayer between matrix and inclusions affect directly the mechanical and physical properties of inorganic particulate-filled polymer composites. The interlayer thickness is an important parameter for characterization of the interfacial structure. The effects of the interlayer between the filler particles and matrix on the mechanical properties of polymer composites were analyzed in this article. On the basis of a simplified model of interlayer, an expression for estimating the interlayer thickness ([Formula: see text]) was proposed. In addition, the relationship between the [Formula: see text] and the particle size and its concentration was discussed. The results showed that the calculations of the [Formula: see text] and thickness/particle diameter ratio ([Formula: see text]) increased nonlinearly with an increase of the volume fraction of the inclusions. Moreover, the predictions of [Formula: see text] and the relevant data reported in literature were compared, and good agreement was found between them.

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

Exceptionally high thermal and electrical conductivity of three-dimensional graphene-foam-based polymer composites

RSC Advances ◽  
2016 ◽  
Vol 6 (27) ◽  
pp. 22364-22369 ◽  
Author(s):  
Zhiduo Liu ◽  
Dianyu Shen ◽  
Jinhong Yu ◽  
Wen Dai ◽  
Chaoyang Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Polymer Composites ◽  
Epoxy Matrix ◽  
Three Dimensional ◽  
Neat Epoxy ◽  
Graphene Foam

Three dimensional graphene foam incorporated into epoxy matrix greatly enhance its thermal conductivity (up to 1.52 W mK−1) at low graphene foam loading (5.0 wt%), over an eight-fold enhancement in comparison with that of neat epoxy.

Fabrication of thermally conductive and electrically insulating polymer composites with isotropic thermal conductivity by constructing a three-dimensional interconnected network

Nanoscale ◽  
2019 ◽  
Vol 11 (23) ◽  
pp. 11360-11368 ◽  
Author(s):  
Hao Yuan ◽  
Yang Wang ◽  
Ting Li ◽  
Yijie Wang ◽  
Piming Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Three Dimensional ◽  
Heat Removal ◽  
Interconnected Network ◽  
Microelectronic Devices ◽  
Thermally Conductive

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices.

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