Design and Tests of a Water-Cooling Micro-Channel Heat Sink Made by WEDM
Keyword(s):
The purpose of this research is to design a new heat sink of water-cooling. With the aid of CAE (computer aided engineering), WEDM (wire electrical discharge machining), and the concept of micro-channel design, a heat sink of water-cooling can then be built with the merit of a smaller volume and lower thermal resistance. From this paper, results of the experiment indicate that the thermal resistance of heat sink can be decreased to 0.12 °C/W with input power of 60W, flow rate of 0.6 LPM, and a better heat dissipation with the in input power of 100W or 140W can be revealed.
2005 ◽
Vol 219
(10)
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pp. 777-784
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2006 ◽
Vol 505-507
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pp. 223-228
Keyword(s):
2017 ◽
Vol 11
(3)
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pp. 208
2012 ◽
Vol 13
(11)
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pp. 1989-1995
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2020 ◽
Vol 864
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pp. 012089