A Bulk RF MEMS Switch by Silicon-to-GaAs Bonding

2009 ◽  
Vol 60-61 ◽  
pp. 224-227
Author(s):  
Le Lu ◽  
Jian Zhu ◽  
Shi Xin Jian ◽  
Chen Chen

. A Bulk RF MEMS switch is present in this paper. The beam structure and transmission line are separated fabricated on silicon and gallium arsenide (GaAs) wafer. The beam structure, up electrode, contact and anchor are fabricated on the silicon wafer. And transmission line and down electrode are made on the GaAs substrate. Two parts of the switch are bonded together by wafer bonding using gold layer as seed. The total area of the switch is 600 um X 600 um.

2020 ◽  
Vol 12 ◽  
Author(s):  
Pampa Debnath ◽  
Ujjwal Mondal ◽  
Arpan Deyasi

Aim:: Computation of loss factors for one-bit RF MEMS switch over Ku, K and Ka-band for two different insulating substrates. Objective:: Numerical investigation of return loss, insertion loss, isolation loss are computed under both actuated and unactuated states for two different insulating substrates of the 1-bit RF MEMS switch, and corresponding up and down-capacitances are obtained. Methods:: The unique characteristics of a 1-bit RF MEMS switch of providing higher return loss under both actuated and unactuated states and also of isolation loss with negligible insertion loss makes it as a prime candidate for phase shifter application. This is presented in this manuscript with a keen focus on improvement capability by changing transmission line width, and also of overlap area; where dielectric constant of the substrate also plays a vital role. Results:: The present work exhibits very low down-capacitance over the spectrum whereas considerable amount of up-capacitance. Also when overall performance in terms of all loss parameters are considered, switch provides very low insertion loss, good return loss under actuated state and standard isolation loss. Conclusion:: Reduction of transmission line width of about 33% improved the performance of the switch by increasing isolation loss. Isolation loss of -40 dB is obtained at actuated condition in higher microwave spectra for SiO 2 at higher overlap area. Down capacitance of ~ 1dB is obtained which is novel as compared with other published literature. Moreover, a better combination of both return loss, isolation loss and insertion loss are reported in this present work compared with all other published data so far.


2020 ◽  
Vol 96 (3s) ◽  
pp. 456-459
Author(s):  
И.В. Кулинич ◽  
И.М. Добуш ◽  
Д. Бобошко

Спроектирован и разработан СВЧ МЭМ-ключ до 25 ГГц на GaAs-подложке с медной металлизацией. Разработана технология корпусирования СВЧ МЭМ-ключа на уровне пластины, полностью совместимой с GaAs-технологией. Проведен расчет секции аттенюатора на основе СВЧ МЭМ-ключа в виде копланарной линии, по разработанной технологии изготовлена секция аттенюатора с коэффициентом ослабления 8 дБ на GaAs-подложке на основе СВЧ МЭМ-ключей. The paper highlights the RF MEMS switch up to 25 GHz on a GaAs substrate with copper metallization. A technology has been developed for packaging a RF MEMS switch at the wafer level, which is fully compatible with MMIC GaAs technology. The section of the attenuator based on the RF MEMS switch in the form of a coplanar line has been calculated, according to the developed technology, the section of the attenuator with the attenuation coefficient of 8dB on a GaAs substrate based on the RF MEMS switch has been manufactured.


Author(s):  
Mehrdad Khodapanahandeh ◽  
Akbar Babaeihaselghobi ◽  
Habib Badri Ghavifekr

Author(s):  
K. Srinivasa Rao ◽  
Ch. Gopi Chand ◽  
Reshmi Maity ◽  
N. P. Maity ◽  
K. Girija Sravani

2014 ◽  
Vol 50 (23) ◽  
pp. 1720-1722 ◽  
Author(s):  
A. Attaran ◽  
R. Rashidzadeh ◽  
R. Muscedere

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