3D Profile Measurement of Nanometer Cutting Edges of Single-Point Diamond Tools for Ultra-Precision Machining

2009 ◽  
Vol 69-70 ◽  
pp. 138-142 ◽  
Author(s):  
Yoshikazu Arai ◽  
T. Asai ◽  
Sayeda Ferdous ◽  
Wei Gao
Keyword(s):  
Optical Sensor ◽  
Single Point ◽  
Beam Waist ◽  
Profile Measurement ◽  
Diamond Cutting ◽  
Tool Edge ◽  
Silicon Cantilever ◽  
Edge Profile ◽  
Afm Probe ◽  
Diamond Cutting Tool

This paper describes an atomic force microscope (AFM) based instrument for 3D edge profile measurement of single-point diamond cutting tools. The instrument is composed of an AFM unit and an optical sensor for alignment of the AFM probe tip (silicon cantilever) with the diamond cutting tool edge. In the optical sensor, a laser beam from a laser diode along the Y-axis is focused to generate a small beam spot with a micrometer-order diameter at the beam waist, and then received by a photo-detector (photodiode). The tool edge top and the AFM probe tip are brought to the center of the beam waist in the XZ-plane through monitoring the variation of the photodiode output, respectively. Consequently, the AFM tip can be aligned with the tool edge top. Alignment experiments and 3D edge profile measurements of a round-nose type single-point diamond tool are carried out.

Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

2014 ◽  
Author(s):  
Hossein Mohammadi ◽  
H. Bogac Poyraz ◽  
Deepak Ravindra ◽  
John A. Patten
Keyword(s):  
Fiber Laser ◽  
Cutting Tool ◽  
Single Point ◽  
Diamond Turning ◽  
Depth Of Cut ◽  
Beam Diameter ◽  
Diamond Cutting ◽  
Laser Assisted Machining ◽  
Diamond Cutting Tool ◽  
Si Wafer

In this study, single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (μ-LAM) technique. The μ-LAM system is used to preferentially heat and thermally soften the work piece material in contact with a diamond cutting tool. In μ-LAM the laser and cutting tool are integrated into a single package, i.e. the laser energy is delivered by a single mode fiber laser to and through a diamond cutting tool. This hybrid method can potentially increase the critical depth of cut (DoC), i.e., a larger ductile-to-brittle transition (DBT) depth, in ductile regime machining, resulting in a higher material removal rate (MRR). An IR continuous wave (CW) fiber laser, wavelength of 1064nm and max power of 100W with a beam diameter of 10μm, is used in this investigation. In the current study SPDT tests were employed on single crystal silicon (Si) wafer which is very brittle and hard to machine by conventional methods. Different outputs such as surface roughness and depth of cut for different set of experiments were analyzed. Results show that an unpolished surface of a Si wafer can be machined in one pass to get a very good surface finish. The Ra was brought down from 1.2μm to 275nm only in one pass which is a very promising result for machining the Si wafer.

Controllability Study of Single-Crystal Diamond Cutting Tool Focus Ion Beam Milling with Different Beam Current and Tilting Angle

2016 ◽  
Vol 1136 ◽  
pp. 430-434 ◽  
Author(s):  
Seung Yub Baek ◽  
Woong Kirl Choi ◽  
Young Jae Choi ◽  
Eun Sang Lee
Keyword(s):  
Cutting Tool ◽  
Ion Beam ◽  
Beam Current ◽  
Diamond Cutting ◽  
Tilting Angle ◽  
Tool Edge ◽  
Single Crystal Diamond ◽  
Processing Procedure ◽  
Edge Sharpness ◽  
Diamond Cutting Tool

Micro/nanoscale diamond cutting tools used in ultra-precision machining can be fabricated by precision grinding, but it is hard to fabricate a tool with a nanometric cutting edge and complex configurations. High-precision geometry accuracy and special shapes for microcutting tools with sharp edges can be achieved by focused ion beam (FIB) milling. However, in the FIB milling process, the surface properties of the substrate (such as a diamond substrate) are affected by the amorphous damage layer caused by the FIB gallium ion collision and implantation and these influence the diamond cutting tool edge sharpness and increase the processing procedure. In this study, to reduce the diamond cutting tool edge sharpness and processing procedure, FIB milling beam current and tilting angle characteristics of single-crystal diamond were investigated, along with method for decreasing the FIB-induced damage on diamond tools by platinum (Pt) coating on the diamond substrate. Experimental results revealed that optimize beam current, tilting angle and platinum (Pt) coating could lead to relatively few processing procedure and sharp cutting tool edge. The obtained results are an endeavor to enhance the controllability of the diamond cutting tool FIB milling.

Edge Contour Measurement of Single Point Diamond Cutting Tools by an Optical Probe

2012 ◽  
Vol 523-524 ◽  
pp. 925-931 ◽  
Author(s):  
Sung Ho Jang ◽  
Yuki Shimizu ◽  
Takemi Asai ◽  
So Ito ◽  
Wei Gao
Keyword(s):  
Laser Beam ◽  
Single Point ◽  
Cutting Tools ◽  
Optical Probe ◽  
Cutting Edge ◽  
Light Spot ◽  
Objective Lens ◽  
Diamond Cutting ◽  
Diamond Cutting Tools ◽  
Diamond Cutting Tool

This paper presents an optical probe employed for edge contour measurement of single point diamond cutting tools. The laser beam from a laser diode (LD) is focused by an objective lens to form a small light spot with a radius of approximately 20 μm, and is then received by a photodiode (PD) after passed through the focal point of the objective lens. The cutting edge of the tool, which is placed on a line with the LD and the PD, is inserted into the laser beam section. At an each X-position, the output of the PD is recorded while the light spot is moved along the Z-direction, scanning across the cutting edge of the tool with its rake face aligned in the XZ plane. The Z-position of the cutting edge is evaluated by determining a specific value from the obtained outputs of the PD. The edge contour of the diamond cutting tool can thus be measured by repeating the Z-scanning at different X-positions. Computer simulation was carried out to investigate the influences of error factors on the evaluation of the cutting edge. Experiments were also carried out to measure a round nose of a tool with nominal nose radius of 2 mm.

scholarly journals A Comparison of the Probes with a Cantilever Beam and a Double-Sided Beam in the Tool Edge Profiler for On-Machine Measurement of a Precision Cutting Tool

Machines ◽  
2021 ◽  
Vol 9 (11) ◽  
pp. 271
Author(s):  
Bo Wen ◽  
Sho Sekine ◽  
Shinichi Osawa ◽  
Yuki Shimizu ◽  
Hiraku Matsukuma ◽  
...  
Keyword(s):  
Cantilever Beam ◽  
Cutting Tool ◽  
Displacement Sensor ◽  
Laser Displacement Sensor ◽  
Tool Edge ◽  
Edge Profile ◽  
Measurement Principle ◽  
Beam Type ◽  
Tool Position ◽  
Tool Cutting

This paper describes a comparison of the mechanical structures (a double-sided beam and a cantilever beam) of a probe in a tool edge profiler for the measurement of a micro-cutting tool. The tool edge profiler consists of a positioning unit having a pair of one-axis DC servo motor stages and a probe unit having a laser displacement sensor and a probe composed of a stylus and a mechanical beam; on-machine measurement of a tool cutting edge can be conducted with a low contact force through measuring the deformation of the probe by the laser displacement sensor while monitoring the tool position. Meanwhile, the mechanical structure of the probe could affect the performance of measurement of the edge profile of a precision cutting tool. In this paper, the measurement principle of the tool edge profile is firstly introduced; after that, slopes and a top-flat of a cutting tool sample are measured by using a cantilever-type probe and a double-sided beam-type probe, respectively. The measurement performances of the two probes are compared through experiments and theoretical measurement uncertainty analysis.

Microtexture Generation Using Controlled Chatter Machining in Ultraprecision Diamond Turning

2015 ◽  
Vol 3 (2) ◽  
Author(s):  
Syed Adnan Ahmed ◽  
Jeong Hoon Ko ◽  
Sathyan Subbiah ◽  
Swee Hock Yeo
Keyword(s):  
Cutting Tool ◽  
Cutting Speed ◽  
Diamond Turning ◽  
Diamond Cutting ◽  
Machined Surface ◽  
Excited Vibration ◽  
Mass And Heat Transfer ◽  
Tool Shank ◽  
Diamond Cutting Tool

This paper describes a new method of microtexture generation in precision machining through self-excited vibrations of a diamond cutting tool. Conventionally, a cutting tool vibration or chatter is detrimental to the quality of the machined surface. In this study, an attempt is made to use the cutting tool's self-excited vibration during a cutting beneficially to generate microtextures. This approach is named as “controlled chatter machining (CCM).” Modal analysis is first performed to study the dynamic behavior of the cutting tool. Turning processes are then conducted by varying the tool holder length as a means to control vibration. The experimental results indicate that the self-excited diamond cutting tool can generate microtextures of various shapes, which depend on the cutting tool shank, cutting speed, feed, and cutting depth. The potential application of this proposed technique is to create microtextures in microchannels and microcavities to be used in mass and heat transfer applications.

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