A Study of Primary Factors Influencing the Properties of Plating Throwing Power for Printed Circuit Boards

2013 ◽  
Vol 721 ◽  
pp. 409-413
Author(s):  
Yuanming Chen ◽  
Yuang Ming Chen ◽  
Shou Xu Wang ◽  
Wei He ◽  
Jia Zhang

High throwing power (TP) copper electroplating has become increasingly important for interconnect fabrication in IC packaging substrates and printed circuit boards (PCB) due to the demands of electronic products with high-density interconnection (HDI). In this study, the factors that influence throwing power of PCB such as plating liquid concentration, current density, organic additive composition and vibration frequency have been investigated. The results showed that, within the scope of this study, with the increase of the current density, PCB throwing power ability decreased gradually, descending grade range up to 5%. Throwing power ability gradually increased as different vibration frequency from 10s to 30s. The orthogonal experimental design was employed to investigate key factors out of all available operation parameters to influence TP. It turned out that the copper sulfate concentration of 30g/L, a current density of 5 ASF, a brightener concentration of 60ml/ kAH and the vibration frequency of 30s are advantageous to achieve best throwing power in the electrodeposition processes.

1999 ◽  
Vol 122 (1) ◽  
pp. 3-5 ◽  
Author(s):  
Ephraim Suhir

External electric leads, soldered into plated through-holes (PTHs) of printed circuit boards (PCBs), provide, in addition to electrical interconnection, mechanical support for heavy electronic components (such as, say, power ones) mounted on the boards. The leads can possibly break (most likely by fatigue), if the PCB support contour is subjected to excessive oscillations. Such oscillations typically occur at the lowest resonant frequency (fundamental frequency). The ability to predict this frequency and possibly avoid resonance conditions is of obvious practical importance. Accordingly, in this analysis, we develop a simple formula for the evaluation of the fundamental vibration frequency of a heavy electronic component mounted on a PCB. The formula is obtained for the case, when the component has only one row of leads, and the vibrations occur in the direction of the least flexural rigidity of this row. [S1043-7398(00)00601-0]


2020 ◽  
Vol 33 (2) ◽  
pp. 14-21
Author(s):  
Carmichael Gugliotti ◽  
Rich Bellemare ◽  
Andy Oh ◽  
Ron Blake

ABSTRACT Pulse plating of copper has typically found use in the plating of very difficult, high aspect ratio printed circuit boards. Its ability to provide throwing power deep within through holes with aspect ratios as high as 30:1 is well established. This technology has long been thought of as a high technology, high cost, specialty process applicable only to high end products. This paper will discuss the advantages that pulse plating offers over conventional DC copper plating in high volume production applications for panels with aspect ratios of up to 12:1. These advantages are reduced plating time, increased throughput, and reduced plated copper thickness on the panel surface while meeting minimum in-hole copper thickness requirements.  


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

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