Research on the Precision Machining on SiC

2014 ◽  
Vol 900 ◽  
pp. 601-604
Author(s):  
Qiang Xiao ◽  
Xue Li He
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Surface Damage ◽  
Precision Machining ◽  
Depth Of Cut ◽  
Brittle To Ductile Transition ◽  
Elid Grinding ◽  
Ductile Mode ◽  
Grinding Mechanism ◽  
Critical Depth Of Cut

SiC material removal mechanism and ELID grinding mechanism is analyzed, the character and condition of brittle to ductile transition of SiC single crystal, the critical depth of cut, and surface formation mechanism of ductile mode grinding of SiC single crystal are studied, the experiment results show that ELID grinding can realize ductile grinding ,this will lower the surface damage and improve the machining efficiency.

Study on the Machining Principle and Experiment of Grinding

2013 ◽  
Vol 395-396 ◽  
pp. 1000-1003
Author(s):  
Qiang Xiao
Keyword(s):  
New Technology ◽  
Surface Damage ◽  
Grinding Wheel ◽  
Process Technology ◽  
Precision Grinding ◽  
Brittle To Ductile Transition ◽  
Elid Grinding ◽  
Ductile Mode ◽  
Grinding Mechanism ◽  
Ultra Precision

ELID for SiC which enables the improvement of surface quality is put forward. ELID grinding technology is new technology of ultra-precision grinding, and the oxide film is formed on grinding wheel by electrolytic in-process technology, thus the wheel is in-process dressed. SiC material removal mechanism and ELID grinding mechanism is analyzed, the character and condition of brittle to ductile transition of SiC and surface formation mechanism of ductile mode grinding of SiC are studied, the results show that ELID grinding can realize ductile grinding ,this will lower the surface damage and improve the machining efficiency.

Experimental Investigation of Brittle to Ductile Transition of Single Crystal Silicon by Single Grain Grinding

2007 ◽  
Vol 329 ◽  
pp. 433-438 ◽  
Author(s):  
Feng Wei Huo ◽  
Zhu Ji Jin ◽  
Fu Ling Zhao ◽  
Ren Ke Kang ◽  
Dong Ming Guo
Keyword(s):  
Single Crystal ◽  
Transition Point ◽  
Single Crystal Silicon ◽  
Depth Of Cut ◽  
Surface Cracks ◽  
Crystal Silicon ◽  
Brittle To Ductile Transition ◽  
Ductile Mode ◽  
Single Grain ◽  
Brittle Mode

Grinding of single crystal silicon may be achieved by two modes of material removal: ductile mode and brittle mode. Knowing of the brittle to ductile transition point at which the grinding process changes from the brittle mode to ductile mode is critically important for the realization of ductile mode grinding. This paper uses a new single grain diamond grinding method developed recently by the authors to investigate the brittle to ductile transition during grinding of single crystal silicon in all around. The results indicate that there exist four stages of brittle to ductile transition as the depth of cut is reduced: firstly, the surface cracks outside the grinding groove disappeared, secondlycracks on the bottom of the groove disappeared, then the lateral cracks ceased in the subsurface region, and finally the median crack is suppressed beneath the grooves. It is not until the depth of cut reaches the last transition point that a crack-free groove can be produced, therefore, the last transition stage is decisive. The critical depth of cut delineating the brittle to ductile transition point derived based on this criterion is 40 nanometers, which is much lower than that based on surface cracks.

scholarly journals Modeling and Experiment of the Critical Depth of Cut at the Ductile–Brittle Transition for a 4H-SiC Single Crystal

Micromachines ◽  
2019 ◽  
Vol 10 (6) ◽  
pp. 382 ◽  
Author(s):  
Peng Chai ◽  
Shujuan Li ◽  
Yan Li
Keyword(s):  
Single Crystal ◽  
Lateral Displacement ◽  
Tangential Force ◽  
Test System ◽  
Depth Of Cut ◽  
Critical Depth ◽  
Berkovich Indenter ◽  
Nose Radius ◽  
Brittle Transition ◽  
Critical Depth Of Cut

In this paper, a theoretical model of the critical depth of cut of nanoscratching on a 4H-SiC single crystal with a Berkovich indenter is proposed, and a series of scratch tests in a nanomechanical test system was performed. Through nanoindentation experimentation on fused quartz, the Berkovich indenter nose radius was indirectly confirmed using least squares. The range of critical depths of cut at the ductile–brittle transition was obtained by SEM observation, and the size of cracks was amplified with increasing scratching depth. The theoretical result of the critical depth of cut at the ductile–brittle transition for a 4H-SiC single crystal is 91.7 nm, which is close to the first obvious pop-in point of the relation curve between tangential force and lateral displacement. Repeated experimental results show good consistency and good agreement with other references.

Experimental Investigation of the Machinability of Single Crystal Silicon in Laser-Assisted Diamond Cutting

2020 ◽  
Author(s):  
Jinyang Ke ◽  
Xiao Chen ◽  
Jianguo Zhang ◽  
Changlin Liu ◽  
Guoqing Xu ◽  
...  
Keyword(s):  
Single Crystal ◽  
Surface Quality ◽  
Laser Power ◽  
Single Crystal Silicon ◽  
Depth Of Cut ◽  
Maximum Height ◽  
Critical Depth ◽  
Diamond Cutting ◽  
Crystal Silicon ◽  
Critical Depth Of Cut

Abstract Laser-assisted diamond cutting is a promising process for machining hard and brittle materials. A deep knowledge of material removal mechanism and attainable surface integrity are crucial to the development of this new technique. This paper focuses on the application of laser-assisted diamond cutting to single crystal silicon to investigate key characteristics of this process. The influence of laser power on the ductile machinability of single crystal silicon, in terms of the critical depth of cut for ductile-brittle transition in laser-assisted diamond cutting, is investigated quantitatively using a plunge-cut method. The experimental results reveal that this process can enhance the silicon’s ductility and machinability. The critical depth of cut has been increased by up to 330% with laser assistance, and its degree generally increases with the increase of laser power. The cross-sectional transmission electron microscope observation results indicate that laser-assisted diamond cutting is able to realize the subsurface damage free processing of single crystal silicon. In order to verify the ability of the laser-assisted diamond cutting to improve the surface quality, the face turning tests are also carried out. A significant improvement of surface quality has been obtained by laser-assisted diamond cutting: Sz (maximum height) has been reduced by 85% and Sa (arithmetical mean height) has been reduced by 45%.

Thinning Silicon Wafer with Polycrystalline Diamond Tools

2009 ◽  
Vol 404 ◽  
pp. 157-163
Author(s):  
Pei Lum Tso ◽  
Cheng Huan Chen
Keyword(s):  
Cutting Tools ◽  
Polycrystalline Diamond ◽  
Wafer Surface ◽  
Depth Of Cut ◽  
Entire Surface ◽  
Machined Surface ◽  
Drill Bits ◽  
Ductile Mode ◽  
Critical Depth Of Cut ◽  
Pcd Tools

Sintered polycrystalline diamond (PCD) compacts are normally used for cutting tools, drill bits and wire dies. A novel application of PCD has been developed to use its entire surface carved to create different patterns which are triangle or square shape loaded with leveled millers that can shave brittle materials in ductile mode. Due to numerous cutting edges formed on the same level of PCD tools, which can be used to thin the wafer surface to achieve both flatness and smoothness of the industrial requirements. SEM has been used to observe the surface and subsurface of the thinned wafer surface. The critical depth of cut between ductile and brittle cutting mode is close to 2 µm in this thinning operation. The damaged layers of machined surface have been observed and studied in this paper.

A Fundamental Study of Vibration Assisted Machining

2011 ◽  
Vol 264-265 ◽  
pp. 1702-1707 ◽  
Author(s):  
Alao Abdur-Rasheed
Keyword(s):  
Brittle Materials ◽  
Depth Of Cut ◽  
Cutting Fluids ◽  
Fundamental Study ◽  
Research Directions ◽  
Ductile Mode ◽  
Critical Depth Of Cut ◽  
Ecological Hazards ◽  
Silicon And Germanium ◽  
Conventional Machining

Conventional diamond cutting of ferrous materials is rarely economical due to the rapid tool wears which result from diffusion and graphitization of the tools. Conventional machining of hard-brittle materials like silicon and germanium results in surface and subsurface damage due to their brittle fracture. Although ductile mode machining (DMM) concept can be used to have a flawless machining on these materials but the mirror surfaces can only be realized on expensive ultraprecision machine tools because the critical depth of cut must be on the order of 1μm or less. Furthermore, there is a need to eliminate or reduce the use of cutting fluids during machining due to their attendant ecological hazards. However, grinding is one of the most difficult processes with regard to eliminating cutting fluids. Vibration assisted machining (VAM) can be used to minimize the problems enumerated above. VAM combines precision machining with small-amplitude tool vibration to improve the fabrication process. It has been applied to a number of processes ranging from turning, drilling to grinding. Therefore, this paper discusses DMM, the general overview of VAM, the basic kinematics of one-dimensional VAM; the advantages derived from using VAM and the ability of VAM to machine brittle materials in the ductile regime at increased depth of cut are described. Finally, the research directions in VAM are outlined.

Machining Force and Modes for Si Wafer Machining with Rotational Tool

2010 ◽  
Vol 126-128 ◽  
pp. 289-294
Author(s):  
Nobumasa Yokemura ◽  
Kenichiro Imai ◽  
Hiroshi Hashimoto
Keyword(s):  
Material Removal ◽  
Cutting Edge ◽  
Depth Of Cut ◽  
Removal Process ◽  
Machining Force ◽  
Ductile Mode ◽  
Basic Experiments ◽  
Brittle Mode ◽  
Si Wafer

In this study, basic experiments involving machining using a rotational tool were conducted with the aim of increasing the volume of material removed rate in ductile-mode machining of Si wafers. The machining surface and machining force was compared to experimentally clarify the material removal process for a single cutting edge, the critical cutting thickness tc at which occurs of cracks was set as the machining condition. Then, the three machining modes were experimentally revealed. As the result, the ductile-mode machining surface was obtained that the total depth of cut was under less than 78.5μm on ductile-brittle-mode machining.

Fundamentals of BK7 Glass Removal in Micro/Nano-Machining

2009 ◽  
Vol 76-78 ◽  
pp. 485-490 ◽  
Author(s):  
Ming Chen ◽  
Qing Long An ◽  
Wei Min Lin ◽  
Hitoshi Ohmori
Keyword(s):  
Material Removal ◽  
Cutting Tools ◽  
Depth Of Cut ◽  
Process Technology ◽  
Ductile Mode ◽  
Fundamental Understanding ◽  
Bk7 Glass ◽  
Ductile Mode Cutting ◽  
Brittle Material Removal ◽  
Brittle Mode

The confine of ductile-mode cutting and brittle-mode cutting seems to be a crucial step for designing a brittle material removal process. However, the existing transition from ductile-mode to brittle-mode for BK7 material makes the confine of different mode very difficult. Through a series of micro/nano-machining tests, measurements of cutting forces and morphological appearance of cutting groove as well as the cross section at the certain depth of cut, the confirmation of ductile-mode cutting, transition-mode cutting and brittle-mode cutting has been clearly described in the paper. This lays a foundation for the fundamental understanding of cutting physics concerning of material characteristics and cutting tools, and thereafter for the development of optimal process technology.

Mechanism of Surface Formation for Natural Granite Grinding

2006 ◽  
Vol 304-305 ◽  
pp. 161-165
Author(s):  
Jian Yun Shen ◽  
Wei Min Lin ◽  
Hitoshi Ohmori ◽  
Xi Peng Xu
Keyword(s):  
Material Removal ◽  
Mesh Size ◽  
Zirconia Ceramic ◽  
Depth Of Cut ◽  
Grinding Process ◽  
Material Removal Mechanism ◽  
Precision Grinding ◽  
Elid Grinding ◽  
Mineral Components ◽  
Grinding Machine

In the present study, zirconia ceramic, crystal and two typical natural granites were ELID ground on a precision grinding machine under the same condition. The surface appearances during the grinding process with different mesh size metal bonded diamond wheels were examined to describe the formation of finely finished granite surfaces. According to the detailed micro-observation of ground surfaces, it can be concluded that the material removal mechanism of the main mineral components for natural granites are really similar to other brittle materials during ELID grinding process. However, the differences of material performances cause the granite materials to be larger critical grain depth of cut and more ductile during finely grinding.

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