Thinning Silicon Wafer with Polycrystalline Diamond Tools

2009 ◽  
Vol 404 ◽  
pp. 157-163
Author(s):  
Pei Lum Tso ◽  
Cheng Huan Chen
Keyword(s):  
Cutting Tools ◽  
Polycrystalline Diamond ◽  
Wafer Surface ◽  
Depth Of Cut ◽  
Entire Surface ◽  
Machined Surface ◽  
Drill Bits ◽  
Ductile Mode ◽  
Critical Depth Of Cut ◽  
Pcd Tools

Sintered polycrystalline diamond (PCD) compacts are normally used for cutting tools, drill bits and wire dies. A novel application of PCD has been developed to use its entire surface carved to create different patterns which are triangle or square shape loaded with leveled millers that can shave brittle materials in ductile mode. Due to numerous cutting edges formed on the same level of PCD tools, which can be used to thin the wafer surface to achieve both flatness and smoothness of the industrial requirements. SEM has been used to observe the surface and subsurface of the thinned wafer surface. The critical depth of cut between ductile and brittle cutting mode is close to 2 µm in this thinning operation. The damaged layers of machined surface have been observed and studied in this paper.

Experimental Investigation on Surface Roughness in Precision Cutting Ti6Al4V Alloy Using Diamond Tools

2014 ◽  
Vol 800-801 ◽  
pp. 576-579
Author(s):  
Lin Hua Hu ◽  
Ming Zhou ◽  
Yu Liang Zhang
Keyword(s):  
Surface Roughness ◽  
Cutting Speed ◽  
Polycrystalline Diamond ◽  
Cutting Parameters ◽  
Limited Range ◽  
Nose Radius ◽  
Machined Surface ◽  
Machined Surface Roughness ◽  
Titanium Alloy Ti6al4v ◽  
Pcd Tools

In this work, cutting experiments were carried out on titanium alloy Ti6Al4V by using polycrystalline diamond (PCD) tools to investigate the effects of the tool geometries and cutting parameters on machined surface roughness. Experimental results show machined surface roughness decreases with increases in the flank angle, tool nose radius and cutting speed within a limited range respectively, and begins to increase as the factors reaches to certain values respectively. And machined surface roughness decreases with increases in feed rate and cutting depth respectively.

Scribing Characteristics of Glass Plate with Ground PCD Scribing Wheel

2018 ◽  
Vol 12 (5) ◽  
pp. 760-766
Author(s):  
Yusuke Akiyama ◽  
Mutsumi Okada ◽  
Hirofumi Suzuki ◽  
Toshio Fukunishi ◽  
Yoshiyuki Asai ◽  
...  
Keyword(s):  
High Efficiency ◽  
Glass Plate ◽  
Cutting Tools ◽  
Polycrystalline Diamond ◽  
Diamond Wheel ◽  
Precision Machining ◽  
Electric Discharge Machining ◽  
Single Crystal Diamond ◽  
Pcd Tools ◽  
Alloy Metal

Polycrystalline diamond (PCD) tools are widely used for cutting tools because PCD has no crystal orientation and is an isotropic material, it is low in cost, and it is easily machined by electric discharge machining. PCD is sintered from diamond abrasives with an alloy metal, such as cobalt, and it is difficult to reduce the surface roughness and the edge accuracy compared with single crystal diamond. In this study, high efficiency and high precision machining of the PCD wheel were investigated. In the experiments, PCD wheels were ground with a diamond wheel, and the effects of the grinding direction and the load on the tool preciseness and the scribing performance were examined.

Ultra-Precision Cutting of Brittle Materials with Ultrasonic Vibrated Diamond Tool

2006 ◽  
Vol 532-533 ◽  
pp. 169-172 ◽  
Author(s):  
Chun Xiang Ma ◽  
Eiji Shamoto ◽  
Li Ming Xu ◽  
Nan Liu ◽  
T. Moriwaki
Keyword(s):  
Diamond Tool ◽  
Brittle Materials ◽  
Optical Quality ◽  
Depth Of Cut ◽  
Critical Depth ◽  
Machined Surface ◽  
Ductile Cutting ◽  
Ultra Precision ◽  
Critical Depth Of Cut ◽  
Quality Surface

The influence of the ultrasonic vibrated diamond tool on the transition of ductile cutting to brittle cutting of the glasses is investigated by facing turning. It is understood that the critical depth of cut for the ductile cutting of the brittle materials is increased obviously by the ultrasonic vibrated diamond tool. The optical quality surface of the glasses is obtained, the surface roughness of which is less than0.03m. Finally, the relation between the roughness of machined surface and the cutting distance is studied experimentally.

Study on Precision Finishing of PCD by Constant-Pressure Grinding and UV-Polishing

2009 ◽  
Vol 407-408 ◽  
pp. 388-391 ◽  
Author(s):  
Mutsumi Touge ◽  
Takayuki Nakano ◽  
Keishi Yamaguchi ◽  
Akihisa Kubota ◽  
Junji Watanabe
Keyword(s):  
Ultraviolet Irradiation ◽  
Constant Pressure ◽  
Cutting Tools ◽  
Polycrystalline Diamond ◽  
Diamond Wheel ◽  
Total Processing Time ◽  
Machined Surface ◽  
Diamond Substrate ◽  
Single Crystal Diamond ◽  
Precision Finishing

Polycrystalline diamond (PCD) has been widely used for various cutting tools and die components making use of its hardness and wear resistance properties. The polishing method of a single crystal diamond substrate and SiC using ultraviolet irradiation was newly developed to obtain mirror-finished surfaces. Due to the long polishing time in this method, a better pre-machined surface is required to shorten the total processing time. In this work, the constant-pressure grinding was performed using a cup type metal-bonded diamond wheel and a constant pressure device. After the good constant-pressure grinding, the PCD was finished by the polishing under the ultraviolet irradiation, and the microroughness was reached to be 0.71 nmRa.

Study on Wafer Thinning Characteristics of Ultimate Diamond Disk

2012 ◽  
Vol 591-593 ◽  
pp. 476-479
Author(s):  
Xu Xing Jin
Keyword(s):  
Cutting Tool ◽  
Cutting Tools ◽  
Polycrystalline Diamond ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Workpiece Material ◽  
Diamond Disk ◽  
Diamond Cutting Tools ◽  
Wafer Thinning ◽  
Wafer Surfaces

Silicon wafer is machined by diamond cutting tools to certain extent, the cutting tool currently used is polycrystalline diamond (PCD). However, as its cutting edges are not leveled to the same height, it will produce different depth of cut and the stress distribution is uneven on wafer surfaces, in the process of wafer thinning, both the workpiece and the cutting tool are probably damaged, this will increase the production cost accordingly. In this paper, a strategy is described to improve the ability of cutting tool for wafer thinning, a cutting tool named Ultimate Diamond Disk (UDD) designed by Taiwan Wheel Company is recommended, which can reduce both the crack of workpiece and the wear speed of cutting tool. Moreover, an experiment on base of different machining parameters including rotation speed of spindle, feed rate and depth of cut was tested and discussed. As a result, the removal mode of workpiece material and the wafer thinning characteristics of UDD are obtained.

A Fundamental Study of Vibration Assisted Machining

2011 ◽  
Vol 264-265 ◽  
pp. 1702-1707 ◽  
Author(s):  
Alao Abdur-Rasheed
Keyword(s):  
Brittle Materials ◽  
Depth Of Cut ◽  
Cutting Fluids ◽  
Fundamental Study ◽  
Research Directions ◽  
Ductile Mode ◽  
Critical Depth Of Cut ◽  
Ecological Hazards ◽  
Silicon And Germanium ◽  
Conventional Machining

Conventional diamond cutting of ferrous materials is rarely economical due to the rapid tool wears which result from diffusion and graphitization of the tools. Conventional machining of hard-brittle materials like silicon and germanium results in surface and subsurface damage due to their brittle fracture. Although ductile mode machining (DMM) concept can be used to have a flawless machining on these materials but the mirror surfaces can only be realized on expensive ultraprecision machine tools because the critical depth of cut must be on the order of 1μm or less. Furthermore, there is a need to eliminate or reduce the use of cutting fluids during machining due to their attendant ecological hazards. However, grinding is one of the most difficult processes with regard to eliminating cutting fluids. Vibration assisted machining (VAM) can be used to minimize the problems enumerated above. VAM combines precision machining with small-amplitude tool vibration to improve the fabrication process. It has been applied to a number of processes ranging from turning, drilling to grinding. Therefore, this paper discusses DMM, the general overview of VAM, the basic kinematics of one-dimensional VAM; the advantages derived from using VAM and the ability of VAM to machine brittle materials in the ductile regime at increased depth of cut are described. Finally, the research directions in VAM are outlined.

Machining of Graphite/Epoxy Composite Materials With Polycrystalline Diamond (PCD) Tools

1991 ◽  
Vol 113 (4) ◽  
pp. 430-436 ◽  
Author(s):  
M. Ramulu ◽  
M. Faridnia ◽  
J. L. Garbini ◽  
J. E. Jorgensen
Keyword(s):  
Flank Wear ◽  
Epoxy Composite ◽  
Wear Behavior ◽  
Polycrystalline Diamond ◽  
Surface Characteristics ◽  
Machining Time ◽  
Machined Surface ◽  
Surface Textures ◽  
Small Cracks ◽  
Pcd Tools

Machining of graphite/epoxy composite material is investigated by turning (cutoff) tests using different grades of polycrystalline diamond (PCD) inserts. The wear behavior of the PCD cutting edge is characterized by small cracks, rounded edges, and flank wear. The flank wear growth rate was found to depend on the microstructure of the tool and machining time. The coarser the PCD grade was, the better the wear resistance. The machined surface characteristics were evaluated by analyzing the surface roughness data and by scanning electron microscopy inspection of machined surface textures. Surface quality was found to get better with the cutting time.

Fundamentals of BK7 Glass Removal in Micro/Nano-Machining

2009 ◽  
Vol 76-78 ◽  
pp. 485-490 ◽  
Author(s):  
Ming Chen ◽  
Qing Long An ◽  
Wei Min Lin ◽  
Hitoshi Ohmori
Keyword(s):  
Material Removal ◽  
Cutting Tools ◽  
Depth Of Cut ◽  
Process Technology ◽  
Ductile Mode ◽  
Fundamental Understanding ◽  
Bk7 Glass ◽  
Ductile Mode Cutting ◽  
Brittle Material Removal ◽  
Brittle Mode

The confine of ductile-mode cutting and brittle-mode cutting seems to be a crucial step for designing a brittle material removal process. However, the existing transition from ductile-mode to brittle-mode for BK7 material makes the confine of different mode very difficult. Through a series of micro/nano-machining tests, measurements of cutting forces and morphological appearance of cutting groove as well as the cross section at the certain depth of cut, the confirmation of ductile-mode cutting, transition-mode cutting and brittle-mode cutting has been clearly described in the paper. This lays a foundation for the fundamental understanding of cutting physics concerning of material characteristics and cutting tools, and thereafter for the development of optimal process technology.

scholarly journals Study of cutting force and tool wear during turning of aluminium with WC, PCD and HFCVD coated MCD tools

2020 ◽  
Vol 7 ◽  
pp. 27
Author(s):  
Sisira Kanta Pattnaik ◽  
Minaketan Behera ◽  
Sachidananda Padhi ◽  
Pusparaj Dash ◽  
Saroj Kumar Sarangi
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Cutting Force ◽  
Cutting Tools ◽  
Chemical Vapor ◽  
Polycrystalline Diamond ◽  
Machining Process ◽  
Pcd Tool ◽  
Rolled Aluminum ◽  
Pcd Tools

Enormous developmental work has been made in synthesis of metastable diamond by hot filament chemical vapor deposition (HFCVD) method. In this paper, micro-crystalline diamond (MCD) was deposited on WC–6 wt.% Co cutting tool inserts by HFCVD technique. The MCD coated tool was characterized by the scanning electron microscope (SEM), X-ray diffraction (XRD) and micro Raman spectroscopy (μ-RS). A comparison was made among the MCD tool, uncoated tungsten carbide (WC) tool and polycrystalline diamond (PCD) tool during the dry turning of rolled aluminum. The various major tests were conducted such as surface roughness, cutting force and tool wear, which were taken into consideration to establish a proper comparison among the advanced cutting tools. Surface roughness was measured during machining by Talysurf. The tool wear was studied by SEM after machining. The cutting forces were measured by Kistler 3D-dynamometer during the machining process. The test results indicate that, the CVD coated MCD tool and PCD tool produced almost similar results. But, the price of PCD tools are five times costlier than MCD tools. So, MCD tool would be a better alternative for machining of aluminium.

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