The Wear of Alumina Matrix Particulate Composites at Different Environments

2006 ◽  
Vol 45 ◽  
pp. 142-147 ◽  
Author(s):  
Zbigniew Pędzich ◽  
Rafał Cheliński
Keyword(s):  
Silicon Carbide ◽  
Tungsten Carbide ◽  
Work Environment ◽  
Particulate Composites ◽  
Alumina Matrix ◽  
Abrasive Medium ◽  
Abrasive Particles ◽  
Miller Test ◽  
Dry Sand

Paper presents the results of investigation on wear of alumina and alumina-basing particulate composites by hard abrasive particles in different environments. The results of two tests (The Dry Sand Test and the Miller Test in pulp) were compared. As an abrasive medium coarse silicon carbide grains were used in both cases. The alumina microstructure was modified by different inclusions: zirconia, tungsten carbide, metallic tungsten and their mixtures. The results indicate that the optimal wear susceptibility in given work environment could be achieved by the addition of different type of additives.

The Abrasive Wear of Alumina Matrix Particulate Composites at Different Environments of Work

2007 ◽  
Vol 29-30 ◽  
pp. 283-286 ◽  
Author(s):  
Zbigniew Pędzich
Keyword(s):  
Silicon Carbide ◽  
Abrasive Wear ◽  
Work Environment ◽  
Yttria Stabilized Zirconia ◽  
Particulate Composites ◽  
Alumina Matrix ◽  
Stabilized Zirconia ◽  
Abrasive Medium ◽  
Miller Test ◽  
Conditions Of Work

The paper presents the results of investigation on the wear of alumina-based composites containing submicrometre particles of other phases in different conditions of work. Three types of phases were used as additives: tungsten carbide, yttria stabilized zirconia and metallic tungsten. The above mentioned phases were used separately or simultaneously as mixes. Two types of tests were performed - the Dry Sand Test and the Miller Test in wet pulp. Coarse silicon carbide grains were used as an abrasive medium in both cases. The results indicate that the optimal wear susceptibility in given work environment could be achieved by the addition of different type of additives.

Refractory Core-Shell Powders for Additive Industries

2017 ◽  
Vol 265 ◽  
pp. 529-534 ◽  
Author(s):  
Sergey P. Bogdanov ◽  
A.P. Garshin
Keyword(s):  
Thin Films ◽  
Silicon Carbide ◽  
Composite Materials ◽  
Boron Nitride ◽  
Tungsten Carbide ◽  
Mechanical Characteristics ◽  
Core Shell ◽  
Refractory Materials ◽  
Iodide Transport ◽  
Physical And Mechanical Characteristics

The finished products obtained when the surfaces of powders of refractory materials (diamond, boron nitride, silicon carbide, tungsten carbide, tungsten) were coated with thin films by the method of iodide transport are presented. The developed method enables to obtain powder composite materials of core-shell type that have surface thickness varying in the range from 1 nm to several micrometers. From the powders modified by the films of metals and thier compounds composite materials were developed, their physical and mechanical characteristics were studied. The characteristics turned out to be substantially higher in comparison to materials sintered from the same powders but without coating. The probable fields of use of the composites in question were determined.

Development of New Complex Machining Technology for Single Crystal Silicon Carbide Polishing

2016 ◽  
Vol 10 (5) ◽  
pp. 786-793
Author(s):  
Tsuneo Kurita ◽  
◽  
Koji Miyake ◽  
Kenji Kawata ◽  
Kiwamu Ashida ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Single Crystal ◽  
Semiconductor Device ◽  
Single Crystal Silicon ◽  
High Hardness ◽  
Electrochemical Technique ◽  
Crystal Silicon ◽  
Abrasive Particles ◽  
Power Semiconductor ◽  
Device Applications

Single-crystal, silicon carbide (SiC) wafers surpass silicon in terms of voltage resistance and heat resistance, and show promise for use in power semiconductor device applications. The aim of this research is to develop a complex machining technology for SiC, which is known to be difficult to process owing to its high hardness. This paper proposes a complex machining method based on converting SiC into a material with a relatively low hardness, and then polishing it using abrasive particles with a higher hardness. The proposed polishing method uses either a photodissociation or an electrochemical technique to reduce the hardness of SiC. The effectiveness of the combined technique is experimentally demonstrated. In addition, a method is proposed for monitoring the processing state by measuring the electric current.

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