Thermal Conductivity of Polyimide Resin-Based Composite with Cu Fibers

In some industrial application, thermal property of resin plays an important role as same as strength. Many attempts have been made to enhance the thermal conductivity of resin matrix composite. In this paper, the copper fibers were introduced to the polyimide-based composite. The experimental results showed that the thermal conductivity of polyimide-based composite with 15% Cu fibers was as high as 8.62W/mK which is more than three times that with Cu powders. The PI-Cu composites with copper fiber had a much lower wear loss than that with copper powder. The forming of three-dimensional network by Cu fibers makes it possible that the heat can conduct by electrons in the resin-based composite with Cu fibers.