Scalable Particle Removal for sub-5 nm Nodes

2021 ◽  
Vol 314 ◽  
pp. 222-227
Author(s):  
Yukifumi Yoshida ◽  
Katsuya Akiyama ◽  
Song Zhang ◽  
Dai Ueda ◽  
Masaki Inaba ◽  
...  
Keyword(s):  
Polymer Film ◽  
Removal Efficiency ◽  
Particle Removal ◽  
Feature Size ◽  
Megasonic Cleaning ◽  
3D Structures ◽  
High Particle ◽  
Removal Technology ◽  
Induce Pattern ◽  
Cleaning Methods

Wet cleaning has become challenging as the feature size of semiconductor devices decreased to sub-5 nm nodes. One of the key challenges is removing various types and sizes of particles and contamination from complex and fragile 3D structures without pattern damage and film loss. Conventional physical cleaning methods, such as dual-fluid spray or megasonic cleaning, are being used for the particle removal process. However, in advanced device nodes, these methods induce pattern damage and film loss. In this paper, we describe a novel particle removal technology called Nanolift which uses a polymer film consisting of two organic resins with different functions and achieved high particle removal efficiency on various types and sizes of particles with no pattern damage and minimum film loss.

High Efficiency Single Wafer Cleaning for Wafer Bonding-Based 3D Integration Applications

2012 ◽  
Vol 187 ◽  
pp. 269-272 ◽  
Author(s):  
Don Dussault ◽  
F. Fournel ◽  
V. Dragoi
Keyword(s):  
Removal Efficiency ◽  
Wafer Bonding ◽  
High Efficiency ◽  
Current Work ◽  
Particle Removal ◽  
3D Integration ◽  
Production Scale ◽  
Megasonic Cleaning ◽  
Wafer Cleaning ◽  
Transducer Design

Current work describes development, testing and verification of a single wafer megasonic cleaning method utilizing a transducer design that meets the extreme particle neutrality, Particle Removal Efficiency (PRE), and repeatability requirements of production scale wafer bonding and other applications requiring extremely low particle levels.

Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents

2009 ◽  
Vol 23 (12) ◽  
pp. 1709-1721 ◽  
Author(s):  
Francesca Barbagini ◽  
Sandip Halder ◽  
Tom Janssens ◽  
Karine Kenis ◽  
Kurt Wostyn ◽  
...  
Keyword(s):  
Removal Efficiency ◽  
Silicon Wafers ◽  
Damage Analysis ◽  
Particle Removal ◽  
Megasonic Cleaning

Effects of Chamber Pressure on the Performance of CO2 Beam Cleaning

2014 ◽  
Vol 219 ◽  
pp. 131-133
Author(s):  
Seung Ho Kim ◽  
Joong Ha Lee ◽  
Ho Young Kim
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing Industry ◽  
Supersonic Nozzle ◽  
Solid Particles ◽  
Chamber Pressure ◽  
Megasonic Cleaning ◽  
Functional Patterns ◽  
Induce Pattern ◽  
Cleaning Methods ◽  
The Cost

As the size of functional patterns in the semiconductor chips shrinks down to below 100 nm, removing nanoscale contaminant particles is an important technological challenge that the current semiconductor manufacturing industry must overcome. Several cleaning methods proposed to date, such as megasonic cleaning [1], droplet impact [2], and cryogenic aerosol cleaning [3], have difficulties in cleaning of sub-100 nm contaminant particles, let alone their tendency to induce pattern damages. Kim et al. [4] has recently developed a new method, where CO2 solid particles nucleated from a supersonic nozzle physically attack contaminant nanoscale particles on the wafer, thus detaching them. A drawback of this novel scheme is that the cleaning must be executed in vacuum because CO2 gas needs to sublimate into solid and be accelerated supersonically as exiting the nozzle. This has adverse effects on the cost and rate of the semiconductor manufacturing process. Here we investigate the effects of vacuum chamber pressure on the performance of the CO2 dry cleaning system. We observe the cryogenic CO2 beams, dents induced by CO2 solid particles, and wafer surfaces initially contaminated with cerium oxide particles, which indicate the effects of the chamber pressure.

Impact of Re-Gasified Water on Megasonic Cleaning

2007 ◽  
Vol 134 ◽  
pp. 217-220 ◽  
Author(s):  
Boon Cheng Goh ◽  
Felicia Goh ◽  
Christopher Lim ◽  
Zainab Ismail ◽  
Mei Sheng Zhou
Keyword(s):  
Removal Efficiency ◽  
Particle Removal ◽  
Megasonic Cleaning ◽  
Cavitation Activity

Megasonic cleaning using de-gassed water (less than 2ppm N2, O2, CO2) in a 300mm batch immersion tool often does not give optimal particle performance, with particle streaks and clusters added onto the wafer, and low particle removal efficiency (PRE). When water was re-gasified with N2, the resultant stable cavitation activity reduced particle adders and increased PRE. With N2 concentration increased to just above 5ppm, number of particle adders decreased by three folds. Optimal particle performance could be obtained by operating at an N2 level close to saturation.

Evaluation of Megasonic Cleaning for Sub-90nm Technologies

2005 ◽  
Vol 103-104 ◽  
pp. 141-146 ◽  
Author(s):  
Guy Vereecke ◽  
Frank Holsteyns ◽  
Sophia Arnauts ◽  
S. Beckx ◽  
P. Jaenen ◽  
...  
Keyword(s):  
Low Temperature ◽  
Mass Balance ◽  
Semiconductor Manufacturing ◽  
Particle Removal ◽  
Dissolved Gas ◽  
Cleaning Efficiency ◽  
Megasonic Cleaning ◽  
High Particle ◽  
The Cost

Cleaning of nanoparticles (< 50nm ) is becoming a major challenge in semiconductor manufacturing and the future use of traditional methods, such as megasonic cleaning, is questioned. In this paper the capability of megasonic cleaning to remove nanoparticles without inflicting damage to fragile structures is investigated. The role of dissolved gas in cleaning efficiency indicates that cavitation is the main cleaning mechanism. Consequently gas mass-balance analyses are needed to optimize the performance of cleaning tools. When gas is dissolved in the cleaning present tools can remove nanoparticles down to about 30 nm using dilute chemistries at low temperature. Ultimate performance is limited by cleaning uniformity, which depends on tool design and operation. However no tool reached the target of high particle removal efficiency andlow damage. Significantly lower damage could only be obtained by decreasing the power, at the cost of a lower cleaning efficiency for nanoparticles. The development of damage-free megasonic is discussed.

SI3N4 Particle Removal Efficiency Study

1997 ◽  
Vol 477 ◽  
Author(s):  
Jane Qian Liu ◽  
Carolyn Lee ◽  
Joseph M. Rosamilia ◽  
Tom Boone ◽  
Veronica Czitrom ◽  
...  
Keyword(s):  
Removal Efficiency ◽  
Defect Density ◽  
Bath Temperature ◽  
Solution Chemistry ◽  
Particle Removal ◽  
Megasonic Cleaning ◽  
Wafer Cleaning ◽  
Particle Contamination ◽  
The Impact ◽  
Improve Device

ABSTRACTControlling particle contamination in wafer cleaning is important to reduce defect density and improve device performance and yield. In this study, a screening experiment was employed to evaluate particle removal efficiency among different cleanings, including FSI BCLN, bench rinse and dry only, bench SC1/megasonic only, bench RCA cleaning, and bench RCA-based cleaning. To optimize particle removal efficiency in RCA-based cleaning, a design of experiment (DOE) has been done to investigate the impact of SC1/megasonic cleaning on Si3N4 particle removal efficiency. Bath temperature, megasonic power, and solution chemistry of SCI bath were evaluated. The removal efficiency in relations to particle sizes was also investigated

Effect of Particle Deposition and Wet/Dry Cleaning Methods on Particle Removal Efficiency

2019 ◽  
Vol 11 (2) ◽  
pp. 361-367 ◽  
Author(s):  
Tae-Gon Kim ◽  
Shan Hu ◽  
Ahmed A. Busnaina ◽  
Jin-Goo Park
Keyword(s):  
Removal Efficiency ◽  
Particle Deposition ◽  
Particle Removal ◽  
Dry Cleaning ◽  
Cleaning Methods

STUDY ON EXPERIMENTAL MODEL TO DETERMINE THE EFFICIENCY OF DUST REMOVAL EQUIPMENT FOR MECHANIC WORKSHOP

2010 ◽  
Vol 13 (3) ◽  
pp. 67-75
Author(s):  
Thang Xuan Dinh ◽  
Trung Thanh Nguyen
Keyword(s):  
Removal Efficiency ◽  
Research Result ◽  
Suitable Method ◽  
Dust Removal ◽  
Small Scale ◽  
Dust Collector ◽  
Particle Removal ◽  
Wet Scrubber ◽  
Cleaning Methods ◽  
Removal Technique

Finding suitable method for selecting the most suitable dust collector for manufacturers is a very important practise which help to reduce environmental pollution and develop a stable society. Based on available research results, the article studies the efficiency of dust removal technique for medium and small scale workshops on three equipments: wet scrubber, wet packed scrubber and centriscrub to suggest suitable dust treatment process in factories as well as the present need. The research result on three equipments suggest that the wet packed scrubber has a minimum particle removal efficiency of 92,67% while the wet scrubber achieving removal efficiency of 81,85% and the Centriscrub achieving removal efficiency up to 99,50%. The results show that the wet cleaning methods is the most suitable method for safe and efficient collection of dusts from various metal working applications such as deburring, polishing and grinding workshop in which the centriscrub achieves the highest efficiency.

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